Patents by Inventor Kaoru Yokosawa

Kaoru Yokosawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a semiconductor device using markings on both lead frame and sealing body
    Patent number: 9287142
    Abstract: A management method is able to quickly investigate the cause of a defect generated in a semiconductor product manufacturing process. Manufacturing conditions in various QFP manufacturing steps are stored in a main server while correlating them with an identification number of the QFP, and a two-dimensional bar code corresponding to the identification number is stamped to the surface of the QFP. In the event of occurrence of a defect of the QFP, the manufacturing conditions for the QFP stored in the main server can be traced in an instant by reading the two-dimensional bar code of the QFP and thereby specifying the identification number.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: March 15, 2016
    Assignee: Renesas Electronics Corporation
    Inventor: Kaoru Yokosawa
  • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING MARKINGS ON BOTH LEAD FRAME AND SEALING BODY
    Publication number: 20140147971
    Abstract: A management method is able to quickly investigate the cause of a defect generated in a semiconductor product manufacturing process. Manufacturing conditions in various QFP manufacturing steps are stored in a main server while correlating them with an identification number of the QFP, and a two-dimensional bar code corresponding to the identification number is stamped to the surface of the QFP. In the event of occurrence of a defect of the QFP, the manufacturing conditions for the QFP stored in the main server can be traced in an instant by reading the two-dimensional bar code of the QFP and thereby specifying the identification number.
    Type: Application
    Filed: January 29, 2014
    Publication date: May 29, 2014
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventor: Kaoru YOKOSAWA
  • Manufacturing method of semiconductor device
    Patent number: 8649896
    Abstract: A management method is able to quickly investigate the cause of a defect generated in a semiconductor product manufacturing process. Manufacturing conditions in various QFP manufacturing steps are stored in a main server while correlating them with an identification number of the QFP, and a two-dimensional bar code corresponding to the identification number is stamped to the surface of the QFP. In the event of occurrence of a defect of the QFP, the manufacturing conditions for the QFP stored in the main server can be traced in an instant by reading the two-dimensional bar code of the QFP and thereby specifying the identification number.
    Type: Grant
    Filed: August 2, 2010
    Date of Patent: February 11, 2014
    Assignee: Renesas Electronics Corporation
    Inventor: Kaoru Yokosawa
  • Manufacturing Method of Semiconductor Device
    Publication number: 20110071662
    Abstract: A management method is able to quickly investigate the cause of a defect generated in a semiconductor product manufacturing process. Manufacturing conditions in various QFP manufacturing steps are stored in a main server while correlating them with an identification number of the QFP, and a two-dimensional bar code corresponding to the identification number is stamped to the surface of the QFP. In the event of occurrence of a defect of the QFP, the manufacturing conditions for the QFP stored in the main server can be traced in an instant by reading the two-dimensional bar code of the QFP and thereby specifying the identification number.
    Type: Application
    Filed: August 2, 2010
    Publication date: March 24, 2011
    Applicant: Renesas Electronics Corporation
    Inventor: Kaoru Yokosawa