Patents by Inventor Kar Meng Ho

Kar Meng Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device, leadframe for an electronic device and method for fabricating an electronic device and a leadframe
    Patent number: 11107754
    Abstract: An electronic device and method is disclosed. In one example, the electronic device includes a semiconductor chip and a leadframe. The leadframe includes a first class of leads and a second class of leads. The leads of the second class of leads are thinner than leads of the first class of leads.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: August 31, 2021
    Assignee: Infineon Technologies AG
    Inventors: Jia Yi Wong, Kar Meng Ho
  • Rivetless lead fastening for a semiconductor package
    Patent number: 10431526
    Abstract: A metal heat slug having an upper and lower surface is provided. First and second electrically conductive leads are provided. First and second electrically insulating fastening mechanisms are provided. The first and second fastening mechanisms are adhered to the upper surface of the heat slug in an outer peripheral region of the heat slug such that the first and second leads are vertically separated from and electrically insulated from the heat slug. The central die attach region is exposed from the first and second fastening mechanisms after adhering the first and second fastening mechanisms to the upper surface of the heat slug.
    Type: Grant
    Filed: October 9, 2017
    Date of Patent: October 1, 2019
    Assignee: Cree, Inc.
    Inventors: Kar Meng Ho, Chiew Li Tai, Jia Yi Wong, Sanjay Kumar Murugan
  • Rivetless Lead Fastening for a Semiconductor Package
    Publication number: 20190109070
    Abstract: A metal heat slug having an upper and lower surface is provided. First and second electrically conductive leads are provided. First and second electrically insulating fastening mechanisms are provided. The first and second fastening mechanisms are adhered to the upper surface of the heat slug in an outer peripheral region of the heat slug such that the first and second leads are vertically separated from and electrically insulated from the heat slug. The central die attach region is exposed from the first and second fastening mechanisms after adhering the first and second fastening mechanisms to the upper surface of the heat slug.
    Type: Application
    Filed: October 9, 2017
    Publication date: April 11, 2019
    Inventors: Kar Meng Ho, Chiew Li Tai, Jia Yi Wong, Sanjay Kumar Murugan
  • ELECTRONIC DEVICE, LEADFRAME FOR AN ELECTRONIC DEVICE AND METHOD FOR FABRICATING AN ELECTRONIC DEVICE AND A LEADFRAME
    Publication number: 20180358287
    Abstract: An electronic device and method is disclosed. In one example, the electronic device includes a semiconductor chip and a leadframe. The leadframe includes a first class of leads and a second class of leads. The leads of the second class of leads are thinner than leads of the first class of leads.
    Type: Application
    Filed: June 13, 2018
    Publication date: December 13, 2018
    Applicant: Infineon Technologies AG
    Inventors: Jia Yi Wong, Kar Meng Ho