Patents by Inventor Kar Tean Tan

Kar Tean Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low-temperature curing adhesive compositions
    Patent number: 11952514
    Abstract: Disclosed herein is an adhesive composition comprising: an epoxy-containing component; and a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester, or thioester, or a combination thereof. Also disclosed are methods for forming a bonded substrate with the adhesive composition. Also disclosed is an article comprising first and second substrates and the adhesive composition.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: April 9, 2024
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Hongying Zhou, Masayuki Nakajima, Kar Tean Tan
  • ADHESIVE COMPOSITIONS
    Publication number: 20220275253
    Abstract: Disclosed herein is an adhesive composition that includes a resin composition and an epoxy-containing compound. The resin composition includes an epoxidized polysulfide and an epoxidized oil. The epoxidized polysulfide is present in the adhesive composition in a weight ratio to the epoxidized oil of 20:1 to 1:1. Also disclosed is the adhesive composition in an at least partially cured state. Also disclosed is a method for treating a substrate comprising applying the adhesive composition to a surface of a substrate; and applying an external energy source to cure the composition. Also disclosed are substrates comprising the adhesive composition in an at least partially cured state.
    Type: Application
    Filed: June 5, 2020
    Publication date: September 1, 2022
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Loubna Pagnotti, Masayuki Nakajima, Hongying Zhou, Ying Zhou, Maria S. French, Kar Tean Tan, Allison G. Condie
  • THIOL-CONTAINING COMPOSITION
    Publication number: 20210355272
    Abstract: The present invention is directed toward a composition comprising: an epoxy compound, a polythiol curing agent, and a second curing agent. Also disclosed are methods of treating a substrate with the composition and substrates formed by such methods.
    Type: Application
    Filed: September 20, 2019
    Publication date: November 18, 2021
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Allison G. Condie, Masayuki Nakajima, Kar Tean Tan, Peter L. Votruba-Drzal, Maria S. French, Hongying Zhou, Baptiste Rayer
  • Tielayer Composition Comprising Polythiol
    Publication number: 20200277521
    Abstract: Disclosed is a tielayer composition having an epoxy-containing compound, a polythiol curing agent, a curing catalyst, and a solvent present in an amount of at least 25% by weight, based on the total weight of the tielayer composition. Also disclosed is a tielayer comprising the tielayer composition in a cured state. Also disclosed is a coated substrate. The substrate has at least one coatable surface and a tielayer formed from the tielayer composition applied to at least one surface of the substrate and cured thereon. The substrate may be footwear. Also disclosed is a method for forming a bond between two substrates.
    Type: Application
    Filed: September 20, 2018
    Publication date: September 3, 2020
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Benjamin Kabagambe, Masayuki Nakajima, Jennifer T. Jordan, Roxalana L. Martin, Ronald J. Kralic, Jr., Kar Tean Tan, Christina A. Winters, Hongying Zhou
  • Two-Component Structural Adhesives
    Publication number: 20200248050
    Abstract: The present invention is directed toward an adhesive composition comprising: a first component; and a second component that chemically reacts with the first component, the second component comprising: a polythiol curing agent; and an alkanolamine. Also disclosed are methods of forming a bond between two substrates and adhesive bonds.
    Type: Application
    Filed: September 20, 2018
    Publication date: August 6, 2020
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Masayuki Nakajima, Kar Tean Tan, Jonathan P. Breon, Hongying Zhou, Allison G. Condie, Fanghui Wu
  • Low-Temperature Curing Adhesive Compositions
    Publication number: 20190390092
    Abstract: Disclosed herein is an adhesive composition comprising: an epoxy-containing component; and a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester, or thioester, or a combination thereof. Also disclosed are methods for forming a bonded substrate with the adhesive composition. Also disclosed is an article comprising first and second substrates and the adhesive composition.
    Type: Application
    Filed: February 7, 2018
    Publication date: December 26, 2019
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Hongying Zhou, Masayuki Nakajima, Kar Tean Tan