Patents by Inventor KAR-WAI HON
KAR-WAI HON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11629428Abstract: A metal article comprises two metals, and a first hole and an oxide layer are set correspondingly on the surfaces of the two metals. To avoid the electrolytic corrosion on the interface between the two metals during the formation of the first hole, the disclosure provides a method of manufacturing the metal article. By putting a metal substrate in a first electrolyte including an etching agent and a passivating agent and applying electricity on the metal substrate, the metal article with the first hole is formed without electrolytic corrosion. The disclosure also provides a metal composite, which is formed by setting a material part in the first hole of the metal article.Type: GrantFiled: May 27, 2021Date of Patent: April 18, 2023Assignee: Fulian Yuzhan Precision Technology Co., LtdInventors: Kar-Wai Hon, Ching-Hao Yang, Hao Zhou, Dong-Xu Zhang
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Publication number: 20220098754Abstract: A metal product includes a metal substrate, at least one first hole, at least one second hole, and at least one third hole. The first hole is formed in a surface of the metal substrate. The second hole is formed in at least one of a portion of the surface of the metal substrate without the first hole and an inner surface defining the first hole. The third hole is formed in at least one of a portion of the surface of the metal substrate without the first hole and without the second hole, a portion of the inner surface defining the first hole without the second hole, and an inner surface defining the second hole. The first, second, and third holes enhance a bonding strength between the metal product and a material product. The disclosure also provides a metal composite and a method for manufacturing the metal product.Type: ApplicationFiled: September 24, 2021Publication date: March 31, 2022Inventors: YU-MEI HU, SHI-CHU XUE, LI-MING SHEN, ZHENG-QUAN WANG, DONG-XU ZHANG, ZHONG-HUA MAI, AN-LI QIN, QING-RUI WANG, CHING-HAO YANG, KAR-WAI HON, HAO ZHOU
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Publication number: 20210370635Abstract: A metal article comprises two metals, and a first hole and an oxide layer are set correspondingly on the surfaces of the two metals. To avoid the electrolytic corrosion on the interface between the two metals during the formation of the first hole, the disclosure provides a method of manufacturing the metal article. By putting a metal substrate in a first electrolyte including an etching agent and a passivating agent and applying electricity on the metal substrate, the metal article with the first hole is formed without electrolytic corrosion. The disclosure also provides a metal composite, which is formed by setting a material part in the first hole of the metal article.Type: ApplicationFiled: May 27, 2021Publication date: December 2, 2021Inventors: KAR-WAI HON, CHING-HAO YANG, HAO ZHOU, DONG-XU ZHANG
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Publication number: 20210039350Abstract: A metal product capable of firmly combing a component of different materials with the metal to form a metal composite article includes a metal substrate. One or more surfaces of the metal substrate have a hole therein, the hole decreases in size towards an opening on the surface. A is the longest distance between any two points on a periphery of the opening. A plane of the opening is defined by the two points and a third point on the periphery of the opening. A periphery of an inner wall of the hole is defined on an intersection of the section plane and the inner wall of the hole. B is the longest distance between any two points on the periphery of the inner wall of the hole, and B is greater than A. The disclosure further provides a metal composite article and a method of manufacture.Type: ApplicationFiled: July 31, 2020Publication date: February 11, 2021Inventors: ZHENG-QUAN WANG, KAR-WAI HON
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Patent number: 9921620Abstract: A method for manufacturing a housing of an electronic device includes the following steps. An area not to be etched is shielded and an etching area is exposed. The etching area is etched by photolithography and forming a plurality of heat dissipation holes of nanometer scale in the etching area. The area not to be etched is cleaned for removing the shielding.Type: GrantFiled: November 10, 2016Date of Patent: March 20, 2018Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Shyan-Juh Liu, Kar-Wai Hon, Sha-Sha Liu
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Patent number: 9889625Abstract: A composite of metal and resin and a manufacturing method require a metal piece and a resin piece, and the surface of the metal piece is etched to include a number of micropores. Each micropore includes a first inclined hole and a second inclined hole, the first inclined hole and the second inclined hole diverging from each other below the surface of the metal piece. The first inclined hole and the second inclined hole extend downwards from a common starting hole which is symmetric around an axis perpendicular to the surface of the metal piece. The resin is embedded in the micropores to combine with the metal piece, where the bonding strength of the composite of metal and resin is increased.Type: GrantFiled: December 9, 2016Date of Patent: February 13, 2018Assignee: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: Kar-Wai Hon
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Patent number: 9610717Abstract: A method for manufacturing composite of resin and other materials includes the following steps. A shaped piece made by materials different with resin is provided, and is degreased and cleaned. A resist layer with a lot of location holes is formed on the surface of the heterogeneous member by nano-imprint lithography, and a lot of small holes are formed on the surface of the heterogeneous member while the resist layer is removed. Then the heterogeneous member is inserted in an injection mold, and molten crystalline thermoplastic resin is injected into the mold, thus the resin embedded into the holes and bonding with the shaped piece. The method is environmentally friendly and suitable for mass production.Type: GrantFiled: October 14, 2014Date of Patent: April 4, 2017Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Shyan-Juh Liu, Kar-Wai Hon, Sha-Sha Liu
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Publication number: 20170087800Abstract: A composite of metal and resin and a manufacturing method require a metal piece and a resin piece, and the surface of the metal piece is etched to include a number of micropores. Each micropore includes a first inclined hole and a second inclined hole, the first inclined hole and the second inclined hole diverging from each other below the surface of the metal piece. The first inclined hole and the second inclined hole extend downwards from a common starting hole which is symmetric around an axis perpendicular to the surface of the metal piece. The resin is embedded in the micropores to combine with the metal piece, where the bonding strength of the composite of metal and resin is increased.Type: ApplicationFiled: December 9, 2016Publication date: March 30, 2017Inventor: KAR-WAI HON
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Publication number: 20170060200Abstract: A method for manufacturing a housing of an electronic device includes the following steps. An area not to be etched is shielded and an etching area is exposed. The etching area is etched by photolithography and forming a plurality of heat dissipation holes of nanometer scale in the etching area. The area not to be etched is cleaned for removing the shielding.Type: ApplicationFiled: November 10, 2016Publication date: March 2, 2017Inventors: SHYAN-JUH LIU, KAR-WAI HON, SHA-SHA LIU
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Patent number: 9573345Abstract: A composite of metal and resin is provided. The composite of metal and resin includes a metal piece and a resin piece, and the surface of the metal piece includes a number of micropores. Each micropore includes a first inclining hole and a second inclining hole, and the first inclining hole and the second inclining hole are disposed inclined with the surface of the metal piece. The first inclining hole and the second inclining hole are disposed symmetrical around an axis perpendicular to the surface of the metal piece, and communicate with each other on the surface of the metal piece. The resin piece is embedded to the micropores to combine with the metal piece. The bonding strength of the composite of metal and resin is increased. A method of manufacturing the composite of metal and resin is also provided.Type: GrantFiled: October 16, 2014Date of Patent: February 21, 2017Assignee: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: Kar-Wai Hon
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Patent number: 9538673Abstract: An electronic device includes a housing, a mother board received in the housing, and a plurality of heat-generating members received in the housing. A dissipation area is formed in the housing, and a plurality of dissipation holes are defined in an outer surface of the dissipation area. Each dissipation hole is in a nanometer scale. The disclosure also supplies a method for manufacturing a housing of the electronic device.Type: GrantFiled: July 30, 2014Date of Patent: January 3, 2017Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Shyan-Juh Liu, Kar-Wai Hon, Sha-Sha Liu
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Publication number: 20150118479Abstract: A composite of metal and resin is provided. The composite of metal and resin includes a metal piece and a resin piece, and the surface of the metal piece includes a number of micropores. Each micropore includes a first inclining hole and a second inclining hole, and the first inclining hole and the second inclining hole are disposed inclined with the surface of the metal piece. The first inclining hole and the second inclining hole are disposed symmetrical around an axis perpendicular to the surface of the metal piece, and communicate with each other on the surface of the metal piece. The resin piece is embedded to the micropores to combine with the metal piece. The bonding strength of the composite of metal and resin is increased. A method of manufacturing the composite of metal and resin is also provided.Type: ApplicationFiled: October 16, 2014Publication date: April 30, 2015Inventor: KAR-WAI HON
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Publication number: 20150111002Abstract: A method for manufacturing composite of resin and other materials includes the following steps. A shaped piece made by materials different with resin is provided, and is degreased and cleaned. A resist layer with a lot of location holes is formed on the surface of the heterogeneous member by nano-imprint lithography, and a lot of small holes are formed on the surface of the heterogeneous member while the resist layer is removed. Then the heterogeneous member is inserted in an injection mold, and molten crystalline thermoplastic resin is injected into the mold, thus the resin embedded into the holes and bonding with the shaped piece. The method is environmentally friendly and suitable for mass production.Type: ApplicationFiled: October 14, 2014Publication date: April 23, 2015Inventors: SHYAN-JUH LIU, KAR-WAI HON, SHA-SHA LIU
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Publication number: 20150036295Abstract: An electronic device includes a housing, a mother board received in the housing, and a plurality of heat-generating members received in the housing. A dissipation area is formed in the housing, and a plurality of dissipation holes are defined in an outer surface of the dissipation area. Each dissipation hole is in a nanometer scale. The disclosure also supplies a method for manufacturing a housing of the electronic device.Type: ApplicationFiled: July 30, 2014Publication date: February 5, 2015Inventors: SHYAN-JUH LIU, KAR-WAI HON, SHA-SHA LIU