Abstract: A lapping system including a substrate having an air bearing surface and at least one slider, wherein each slider comprises at least one electronic lapping guide pad, and a probe card comprising at least one extending probe comprising a body member and a distal end, the probe card being movable in a direction of compression between a first position in which the distal end of a first extending probe is spaced from a top surface of one of a first electronic lapping guide pad and a second position in which the distal end of the first extending probe contacts the top surface the first electronic lapping guide pad, wherein the first extending probe is pre-loaded with a predetermined spring force in the direction of compression.

Abstract: A device and system for precise measurement of a thickness and determination of a profile of a slider row bar. The device includes a bar mount fixture having a structure for supporting the row bar by an edge, a first probe and a second probe on either side of the row bar, each probe being a non-contact sensor with a measurement precision of 0.5 micrometer, with each of the probes laterally moveable in relation to the bar mount fixture. Also included are methods of using a device for precisely measuring of a thickness and determining of a profile of a slider row bar.

Abstract: A device and system for precise measurement of a thickness and determination of a profile of a slider row bar. The device includes a bar mount fixture having a structure for supporting the row bar by an edge, a first probe and a second probe on either side of the row bar, each probe being a non-contact sensor with a measurement precision of 0.5 micrometer, with each of the probes laterally moveable in relation to the bar mount fixture. Also included are methods of using a device for precisely measuring of a thickness and determining of a profile of a slider row bar.

Abstract: The presently disclosed technology describes systems and methods for attaining a ball bond using less than 1 thousandth of an inch diameter gold wire using ultrasonic bonding energy and without heating an underlying bonding pad. The ball bond allows the use of particularly small bonding pads that are particularly close to adjacent microelectronic structures that limit the use of other bonding techniques that have shallow take-off angles.