Abstract: A photonics integrated circuit includes a photonics platform having a waveguide layer having a waveguide and a wiring substrate with an active component positioned thereon and extending therefrom. The active component has a component top surface facing away from the wiring substrate and component side surfaces through which radiation can be coupled. The photonics platform comprises a recess wherein the active component can be positioned such that the component top surface of the active component is positioned on a surface of the recess. The photonics platform and the active component are being configured for allowing lateral optical coupling between the waveguide in the photonics platform and at least one of the component side surfaces of the active component.