Abstract: A method and apparatus are described in which an optimal configuration of memory instances is determined. The optimal configuration of memory instances to be fabricated with built-in repair capacity and memory instances that are non-repairable may provide a maximum number of good chip dies per wafer. An amount of memory instances to be fabricated with built-in repair capacity as well as a remaining amount of memory instances to be fabricated without any built-in repair components in the integrated circuit design is determined relative to achieving the maximum number of good chip dies per wafer for a given defect density and wafer area. The amount of good dies produced per fabricated wafer for a populated amount of memories with built-in repair components is determined to be between an amount established by a minimum limit for the die area up to the amount established by a maximum limit for the die area.

Abstract: A structural primitive verification tool for memory compilers is described. A first set of memory structural primitives are supplied by a designer by filling in fields of a presented user interface. The first set of structural primitives describe certain physical layout features of a proposed memory array in an integrated circuit. A first model of a memory instance derived from the first set of memory structural primitives supplied by the designer is compared to a second model of a memory instance derived from a memory layout file from a memory compiler under-test. The first model is verified against the second model to verify to an integrity of the first set of memory structural primitives supplied by the designer compared to the memory layout file derived from a second set of memory structural primitives configuring that memory instance from the memory compiler.

Abstract: A method and apparatus are described in which an optimal configuration of memory instances is determined. The optimal configuration of memory instances to be fabricated with built-in repair capacity and memory instances that are non-repairable may provide a maximum number of good chip dies per wafer. An amount of memory instances to be fabricated with built-in repair capacity as well as a remaining amount of memory instances to be fabricated without any built-in repair components in the integrated circuit design is determined relative to achieving the maximum number of good chip dies per wafer for a given defect density and wafer area. The amount of good dies produced per fabricated wafer for a populated amount of memories with built-in repair components is determined to be between an amount established by a minimum limit for the die area up to the amount established by a maximum limit for the die area.

Abstract: A computer-implemented method for creating an integrated circuit, IC, test engine for testing a proposed IC memory array using new memory structural model. An IC designer inputs the number of words that can be stored and a column multiplexer ratio in a proposed IC memory array. A selection of one or more procedures is made from a library of computer-readable procedures. Each of the procedures is to produce one or more structural primitives that describe certain physical layout features of the proposed IC memory array, without analyzing a CAD layout file of the proposed IC memory array. The library of procedures as a whole translates between a physical model of a family of IC memory arrays and a user interface model of the family. A data background, DB, pattern is produced to be used by the test engine in testing the proposed IC memory array. This is done by executing the selected one or more procedures, wherein these procedures take as input the received number of words and column multiplexer size.

Abstract: A method and apparatus are described in which an optimal configuration of memory instances is determined. The optimal configuration of memory instances to be fabricated with built-in repair capacity and memory instances that are non-repairable may provide a maximum number of good chip dies per wafer. An amount of memory instances to be fabricated with built-in repair capacity as well as a remaining amount of memory instances to be fabricated without any built-in repair components in the integrated circuit design is determined relative to achieving the maximum number of good chip dies per wafer for a given defect density and wafer area. The amount of good dies produced per fabricated wafer for a populated amount of memories with built-in repair components is determined to be between an amount established by a minimum limit for the die area up to the amount established by a maximum limit for the die area.

Abstract: A structural primitive verification tool for memory compilers is described. A first set of memory structural primitives are supplied by a designer by filling in fields of a presented user interface. The first set of structural primitives describe certain physical layout features of a proposed memory array in an integrated circuit. A first model of a memory instance derived from the first set of memory structural primitives supplied by the designer is compared to a second model of a memory instance derived from a memory layout file from a memory compiler under-test. The first model is verified against the second model to verify to an integrity of the first set of memory structural primitives supplied by the designer compared to the memory layout file derived from a second set of memory structural primitives configuring that memory instance from the memory compiler.