Patents by Inventor Karen Bruzda

Karen Bruzda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally-conductive electromagnetic interference (EMI) absorbers
    Patent number: 11955438
    Abstract: Disclosed are exemplary embodiments of thermally-conductive electromagnetic interference (EMI) absorbers. In exemplary embodiments, the thermally-conductive EMI absorber may have a thermal conductivity of at least 6 Watts per meter per Kelvin (W/mK) and an attenuation greater than 15 decibels per centimeter (dB/cm) at a frequency of 10 gigahertz (GHz) or higher.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: April 9, 2024
    Assignee: Laird Technologies, Inc.
    Inventors: Karen Bruzda, John David Ryan
  • THERMALLY-CONDUCTIVE ELECTROMAGNETIC INTERFERENCE (EMI) ABSORBERS
    Publication number: 20220093525
    Abstract: Disclosed are exemplary embodiments of thermally-conductive electromagnetic interference (EMI) absorbers. In exemplary embodiments, the thermally-conductive EMI absorber may have a thermal conductivity of at least 6 Watts per meter per Kelvin (W/mK) and an attenuation greater than 15 decibels per centimeter (dB/cm) at a frequency of 10 gigahertz (GHz) or higher.
    Type: Application
    Filed: September 22, 2021
    Publication date: March 24, 2022
    Inventors: Karen BRUZDA, John David RYAN
  • Thermal interface materials with low secant modulus of elasticity and high thermal conductivity
    Patent number: 10692797
    Abstract: Disclosed are exemplary embodiments of thermal interface materials with low secant modulus of elasticity and high thermal conductivity.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: June 23, 2020
    Assignee: Laird Technologies, Inc.
    Inventors: Karen Bruzda, Kathryn Cancar
  • Thermal Interface Materials With Low Secant Modulus Of Elasticity And High Thermal Conductivity
    Publication number: 20190122954
    Abstract: Disclosed are exemplary embodiments of thermal interface materials with low secant modulus of elasticity and high thermal conductivity.
    Type: Application
    Filed: December 17, 2018
    Publication date: April 25, 2019
    Inventors: Karen BRUZDA, Kathryn CANCAR
  • Thermal interface materials with low secant modulus of elasticity and high thermal conductivity
    Patent number: 10155896
    Abstract: Disclosed are exemplary embodiments of thermal interface materials with low secant modulus of elasticity and high thermal conductivity.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: December 18, 2018
    Inventors: Karen Bruzda, Kathryn Cancar
  • THERMAL INTERFACE MATERIALS WITH LOW SECANT MODULUS OF ELASTICITY AND HIGH THERMAL CONDUCTIVITY
    Publication number: 20180094183
    Abstract: Disclosed are exemplary embodiments of thermal interface materials with low secant modulus of elasticity and high thermal conductivity.
    Type: Application
    Filed: November 21, 2017
    Publication date: April 5, 2018
    Inventors: Karen Bruzda, Kathryn Cancar
  • Thermal interface materials with low secant modulus of elasticity and high thermal conductivity
    Patent number: 9828539
    Abstract: Disclosed are exemplary embodiments of thermal interface materials with low secant modulus of elasticity and high thermal conductivity.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: November 28, 2017
    Assignee: Laird Technologies, Inc.
    Inventors: Karen Bruzda, Kathryn Cancar
  • Thermal interface materials with thin film or metallization
    Patent number: 9795059
    Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0001 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.
    Type: Grant
    Filed: May 20, 2013
    Date of Patent: October 17, 2017
    Assignee: Laird Technologies, Inc.
    Inventors: Jason L. Strader, Mark Wisniewski, Karen Bruzda, Michael D. Craig
  • THERMAL INTERFACE MATERIALS WITH LOW SECANT MODULUS OF ELASTICITY AND HIGH THERMAL CONDUCTIVITY
    Publication number: 20170002248
    Abstract: Disclosed are exemplary embodiments of thermal interface materials with low secant modulus of elasticity and high thermal conductivity.
    Type: Application
    Filed: June 16, 2016
    Publication date: January 5, 2017
    Inventors: Karen Bruzda, Kathryn Cancar
  • THERMAL INTERFACE MATERIALS WITH THIN FILM SEALANTS
    Publication number: 20150334871
    Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In an exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side. A dry material is along at least a portion of the first side of the thermal interface material. The dry material has a thickness less than 0.005 millimeters. At least one edge of the thermal interface material is sealed at least partially by the dry material.
    Type: Application
    Filed: June 24, 2014
    Publication date: November 19, 2015
    Inventors: Richard F. Hill, Mark Wisniewski, Karen Bruzda
  • Thermal Interface Materials with Thin Film or Metallization
    Publication number: 20130265721
    Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.
    Type: Application
    Filed: May 20, 2013
    Publication date: October 10, 2013
    Inventors: Jason L. Strader, Mark Wisniewski, Karen Bruzda, Michael D. Craig
  • Thermal interface material with thin transfer film or metallization
    Patent number: 8445102
    Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.
    Type: Grant
    Filed: September 4, 2008
    Date of Patent: May 21, 2013
    Assignee: Laird Technologies, Inc.
    Inventors: Jason L. Strader, Mark Wisniewski, Karen Bruzda, Michael D. Craig
  • THERMAL INTERFACE MATERIALS AND METHODS FOR PROCESSING THE SAME
    Publication number: 20120292005
    Abstract: A thermal interface material is provided for use to fill a gap between surfaces in a thermal transfer system to transfer heat between the surfaces. The thermal interface material includes a base material and thermally conductive particles dispersed within the base material. The thermal interface material is conditioned under reduced pressure (e.g., prior to being placed in the gap between the surfaces, while being placed in the gap, after being placed in the gap, etc.) and, within about forty-eight hours or less of conditioning, the conditioned thermal interface material is either positioned in a container that inhibits ambient gas from contacting it (either alone or applied to the surfaces), or used to transfer heat between the surfaces. As such, the thermal interface material is substantially free of cracks following exposure to thermal cycling comprising a temperature change of at least about 100 degrees Celsius for at least about 10 cycles.
    Type: Application
    Filed: May 19, 2011
    Publication date: November 22, 2012
    Applicant: LAIRD TECHNOLOGIES, INC.
    Inventors: Karen Bruzda, Richard F. Hill, Brian Jones, Michael D. Craig
  • POTATO SHAPED GRAPHITE FILLER, THERMAL INTERFACE MATERIALS AND EMI SHIELDING
    Publication number: 20120080639
    Abstract: Various potato graphite filler, thermal interface materials, EMI shielding materials and methods of making thermal interface and EMI shielding materials are disclosed. An example thermal interface material includes a matrix material and a graphite filler suspended in the matrix material. The graphite filler includes potato graphite particles.
    Type: Application
    Filed: October 4, 2010
    Publication date: April 5, 2012
    Applicant: LAIRD TECHNOLOGIES, INC.
    Inventors: Karen Bruzda, Richard F. Hill
  • THERMAL INTERFACE MATERIAL WITH THIN TRANSFER FILM OR METALLIZATION
    Publication number: 20090117345
    Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.
    Type: Application
    Filed: September 4, 2008
    Publication date: May 7, 2009
    Applicant: Laird Technologies, Inc.
    Inventors: Jason L. Strader, Mark Wisniewski, Karen Bruzda, Michael Craig