Patents by Inventor Karen Paghasian

Karen Paghasian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060141749
    Abstract: A package includes a flexible substrate with a first region and a second region, an encapsulated die supported by the first region, and a conformable fold adhesive introduced between the encapsulated die and the flexible substrate. The second region of the flexible substrate is folded over the surface of the encapsulated die.
    Type: Application
    Filed: February 21, 2006
    Publication date: June 29, 2006
    Inventors: Rahul Manepalli, Karen Paghasian, Shinobu Kourakata, Ruel Aranda
  • Publication number: 20050224993
    Abstract: A package includes a flexible substrate with a first region and a second region, an encapsulated die supported by the first region, and a conformable fold adhesive introduced between the encapsulated die and the flexible substrate. The second region of the flexible substrate is folded over the surface of the encapsulated die.
    Type: Application
    Filed: March 31, 2004
    Publication date: October 13, 2005
    Inventors: Rahul Manepalli, Karen Paghasian, Shinobu Kourakata, Ruel Aranda