Patents by Inventor Karen Y. Paghasian

Karen Y. Paghasian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive of folder package
    Patent number: 7335973
    Abstract: A package includes a flexible substrate with a first region and a second region, an encapsulated die supported by the first region, and a conformable fold adhesive introduced between the encapsulated die and the flexible substrate. The second region of the flexible substrate is folded over the surface of the encapsulated die.
    Type: Grant
    Filed: February 21, 2006
    Date of Patent: February 26, 2008
    Assignee: Intel Corporation
    Inventors: Rahul N. Manepalli, Karen Y. Paghasian, Shinobu Kourakata, Ruel D R Aranda
  • Adhesive of folded package
    Patent number: 7033911
    Abstract: A package includes a flexible substrate with a first region and a second region, an encapsulated die supported by the first region, and a conformable fold adhesive introduced between the encapsulated die and the flexible substrate. The second region of the flexible substrate is folded over the surface of the encapsulated die.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: April 25, 2006
    Assignee: Intel Corporation
    Inventors: Rahul N. Manepalli, Karen Y. Paghasian, Shinobu Kourakata, Ruel D R Aranda