Patents by Inventor Kari Thorkelsson
Kari Thorkelsson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240084473Abstract: Methods, apparatuses, and systems for forming deposited features on workpieces are provided herein. Generally, the techniques herein employ a deposition head to define an electrical field that facilitates electrochemical deposition. Other systems and controllers can be employed, which can assist in aligning or positioning the deposition head in proximity to a workpiece and controlling the size and location of the deposited feature.Type: ApplicationFiled: January 28, 2022Publication date: March 14, 2024Inventors: Steven T. Mayer, Kari Thorkelsson
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Publication number: 20230366119Abstract: A chamber in a substrate processing system comprises a substrate holder configured to support a substrate, a nozzle arranged above the substrate, the nozzle configured to inject a pre-wetting liquid onto a surface of the substrate during a pre-wetting period, and at least one gas injector arranged radially outward of the nozzle. The at least one gas injector is configured to inject gas toward an edge of the substrate for a drying period subsequent to the pre-wetting period to remove the pre-wetting liquid from the edge of the substrate.Type: ApplicationFiled: September 29, 2021Publication date: November 16, 2023Inventors: Kari THORKELSSON, Stephen J. BANIK, Bryan BUCKALEW
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Publication number: 20230340686Abstract: Methods, inks, apparatus, and systems for forming metal features on semiconductor substrates are provided herein. Advantageously, the techniques herein do not require the use of photoresist, and can be accomplished without many of the processes and apparatuses used in the conventional process flow. Instead, electrohydrodynamic ejection printing is used to deposit an ink that includes an electroplating additive such as accelerator or inhibitor. The printed substrate can then be electroplated in a preferential deposition process that achieves a first deposition rate on areas of the substrate where the ink is present and a second deposition rate on areas of the substrate where the ink is absent, the first and second deposition rates being different from one another. After electroplating, chemical etching may be used to spatially isolate the preferentially grown metal features from one another.Type: ApplicationFiled: January 27, 2021Publication date: October 26, 2023Inventors: Steven T. Mayer, Kari Thorkelsson
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Publication number: 20230230847Abstract: During electro-oxidative metal removal on a semiconductor substrate, the substrate having a metal layer is anodically biased and the metal is electrochemically dissolved into an electrolyte. Metal particles (e.g., copper particles when the dissolved metal is copper) can inadvertently form on the surface of the substrate during electrochemical metal removal and cause defects during subsequent semiconductor processing. Contamination with such particles can be mitigated by preventing particle formation and/or by dissolution of particles. In one implementation, mitigation involves using an electrolyte that includes an oxidizer, such as hydrogen peroxide, during the electrochemical metal removal. An electrochemical metal removal apparatus in one embodiment has a conduit for introducing an oxidizer to the electrolyte and a sensor for monitoring the concentration of the oxidizer in the electrolyte.Type: ApplicationFiled: May 5, 2021Publication date: July 20, 2023Inventors: Kari Thorkelsson, Stephen J. Banik, II, Bryan L. Buckalew, Steven T. Mayer
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Publication number: 20230167571Abstract: Sequential electrodeposition of metals into through-mask features on a semiconductor substrate is conducted such as to reduce the deleterious consequences of lipseal's pressure onto the mask material. In a first electroplating step, a first metal (e.g., nickel) is electrodeposited using a lipseal that has an innermost point of contact with the semiconductor substrate at a first distance from the edge of the substrate. In a second electroplating step, a second metal (e.g., tin) is electrodeposited using a lipseal that has an innermost point of contact with the semiconductor substrate at a greater distance from the edge of the substrate than the first distance. This allows to at least partially shift the lipseal pressure from a point that could have been damaged during the first electrodeposition step and to shield from electrolyte any cracks that might have formed in the mask material during the first electroplating step.Type: ApplicationFiled: April 7, 2021Publication date: June 1, 2023Inventors: Justin Oberst, Bryan L. Buckalew, Kari Thorkelsson
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Patent number: 11610782Abstract: In one implementation a cathode for electrochemical metal removal has a generally disc-shaped body and a plurality of channels in the generally disc-shaped body, where the channels are configured for passing electrolyte through the body of the cathode. The channels may be fitted with non-conductive (e.g., plastic) tubes that in some embodiments extend above the body of the cathode to a height of at least 1 cm. The cathode may also include a plurality of indentations at the edge to facilitate electrolyte flow at the edge of the cathode. In some embodiments the cathode includes a plurality of non-conductive fixation elements on a conductive surface of the cathode, where the fixation elements are attachable to one or more handles for removing the cathode from the electrochemical metal removal apparatus.Type: GrantFiled: May 15, 2020Date of Patent: March 21, 2023Assignee: Lam Research CorporationInventors: Kari Thorkelsson, Richard G. Abraham, Steven T. Mayer
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Publication number: 20220018036Abstract: Direct copper-copper bonding at low temperatures is achieved by electroplating copper features on a substrate followed by electroplanarizing the copper features. The copper features are electroplated on the substrate under conditions so that nanotwinned copper structures are formed. Electroplanarizing the copper features is performed by anodically biasing the substrate and contacting the copper features with an electrolyte so that copper is electrochemically removed. Such electrochemical removal is performed in a manner so that roughness is reduced in the copper features and substantial coplanarity is achieved among the copper features. Copper features having nanotwinned copper structures, reduced roughness, and better coplanarity enable direct copper-copper bonding at low temperatures.Type: ApplicationFiled: December 7, 2019Publication date: January 20, 2022Inventors: Stephen J. Banik, II, Justin Oberst, Kari Thorkelsson, Bryan L. Buckalew, Thomas Anand Ponnuswamy
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Patent number: 11047059Abstract: The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold between the channeled plate and substrate, and on the sides by a flow confinement ring. A seal may be provided between the bottom surface of a substrate holder and the top surface of an element below the substrate holder (e.g., the flow confinement ring). During plating, fluid enters the cross flow manifold through channels in the channeled plate, and through a cross flow inlet, then exits at the cross flow exit, positioned opposite the cross flow inlet. The apparatus may switch between a sealed state and an unsealed state during electroplating, for example by lowering and lifting the substrate and substrate holder as appropriate to engage and disengage the seal.Type: GrantFiled: June 5, 2019Date of Patent: June 29, 2021Assignee: Lam Research CorporationInventors: Kari Thorkelsson, Aaron Berke, Bryan L. Buckalew, Steven T. Mayer
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Publication number: 20200279754Abstract: In one implementation a cathode for electrochemical metal removal has a generally disc-shaped body and a plurality of channels in the generally disc-shaped body, where the channels are configured for passing electrolyte through the body of the cathode. The channels may be fitted with non-conductive (e.g., plastic) tubes that in some embodiments extend above the body of the cathode to a height of at least 1 cm. The cathode may also include a plurality of indentations at the edge to facilitate electrolyte flow at the edge of the cathode. In some embodiments the cathode includes a plurality of non-conductive fixation elements on a conductive surface of the cathode, where the fixation elements are attachable to one or more handles for removing the cathode from the electrochemical metal removal apparatus.Type: ApplicationFiled: May 15, 2020Publication date: September 3, 2020Inventors: Kari Thorkelsson, Richard G. Abraham, Steven T. Mayer
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Patent number: 10692735Abstract: In one implementation a wafer processing method includes filling a plurality of through-resist recessed features with a metal, such that a ratio of fill rate of a first feature to a fill rate of a second feature is R1; followed by electrochemically removing metal such that a ratio of metal removal rate from the first feature to the metal removal rate from the second feature is greater than R1, improving the uniformity of the fill. In some embodiments the method includes contacting an anodically biased substrate with an electrolyte such that the electrolyte has a transverse flow component in a direction that is substantially parallel to the working surface of the substrate. The method can be implemented in an apparatus that is configured for generating the transverse flow at the surface of the substrate. In some implementations the method makes use of distinct electrochemical regimes to achieve improvement in uniformity.Type: GrantFiled: July 19, 2018Date of Patent: June 23, 2020Assignee: Lam Research CorporationInventors: Kari Thorkelsson, Richard G. Abraham, Steven T. Mayer
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Publication number: 20190301042Abstract: The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold between the channeled plate and substrate, and on the sides by a flow confinement ring. A seal may be provided between the bottom surface of a substrate holder and the top surface of an element below the substrate holder (e.g., the flow confinement ring). During plating, fluid enters the cross flow manifold through channels in the channeled plate, and through a cross flow inlet, then exits at the cross flow exit, positioned opposite the cross flow inlet. The apparatus may switch between a sealed state and an unsealed state during electroplating, for example by lowering and lifting the substrate and substrate holder as appropriate to engage and disengage the seal.Type: ApplicationFiled: June 5, 2019Publication date: October 3, 2019Inventors: Kari Thorkelsson, Aaron Berke, Bryan L. Buckalew, Steven T. Mayer
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Patent number: 10364505Abstract: The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold between the channeled plate and substrate, and on the sides by a flow confinement ring. A seal may be provided between the bottom surface of a substrate holder and the top surface of an element below the substrate holder (e.g., the flow confinement ring). During plating, fluid enters the cross flow manifold through channels in the channeled plate, and through a cross flow inlet, then exits at the cross flow exit, positioned opposite the cross flow inlet. The apparatus may switch between a sealed state and an unsealed state during electroplating, for example by lowering and lifting the substrate and substrate holder as appropriate to engage and disengage the seal.Type: GrantFiled: August 1, 2016Date of Patent: July 30, 2019Assignee: Lam Research CorporationInventors: Kari Thorkelsson, Aaron Berke, Bryan L. Buckalew, Steven T. Mayer
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Publication number: 20190122890Abstract: A method of electroplating a metal into features of a partially fabricated electronic device on a substrate is provided. The method includes (a) electroplating the metal into the features, to partially fill the features by a bottom up fill mechanism, while contacting the features with a first electroplating bath having a first composition and comprising ions of the metal; (b) thereafter, electroplating more of the metal into the features, to further fill the features, while contacting the features with a second electroplating bath having a second composition, which is different than the first composition, and comprises the ions of the metal; and (c) removing the substrate from an electroplating tool where operation (b) was performed.Type: ApplicationFiled: October 19, 2018Publication date: April 25, 2019Inventors: Kari Thorkelsson, Nirmal Shankar, Sigamani, Bryan L. Buckalew, Steven T. Mayer, Thomas Anand Ponnuswamy
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Publication number: 20190035640Abstract: In one implementation a wafer processing method includes filling a plurality of through-resist recessed features with a metal, such that a ratio of fill rate of a first feature to a fill rate of a second feature is R1; followed by electrochemically removing metal such that a ratio of metal removal rate from the first feature to the metal removal rate from the second feature is greater than R1, improving the uniformity of the fill. In some embodiments the method includes contacting an anodically biased substrate with an electrolyte such that the electrolyte has a transverse flow component in a direction that is substantially parallel to the working surface of the substrate. The method can be implemented in an apparatus that is configured for generating the transverse flow at the surface of the substrate. In some implementations the method makes use of distinct electrochemical regimes to achieve improvement in uniformity.Type: ApplicationFiled: July 19, 2018Publication date: January 31, 2019Applicant: Lam Research CorporationInventors: Kari Thorkelsson, Richard G. Abraham, Steven T. Mayer
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Publication number: 20180251907Abstract: A lipseal is designed for use in a lipseal assembly of an electroplating apparatus wherein a clamshell engages and supplies electrical current to a semiconductor substrate during electroplating. The lipseal includes an elastomeric body having an outer portion configured to engage a cup of the lipseal assembly and an inner portion configured to engage a peripheral region of the semiconductor substrate. The inner portion includes a protrusion having a width in a radial direction sufficient to provide a contact area with the semiconductor substrate which inhibits diffusion of acid in an electroplating solution used during the electroplating. The protrusion is located at an inner periphery of the lipseal.Type: ApplicationFiled: March 1, 2017Publication date: September 6, 2018Applicant: LAM RESEARCH CORPORATIONInventors: Kari Thorkelsson, Aaron Berke, Santosh Kumar, Robert Rash, Lee Peng Chua, Bryan Buckalew
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Publication number: 20170342590Abstract: The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold between the channeled plate and substrate, and on the sides by a flow confinement ring. A seal may be provided between the bottom surface of a substrate holder and the top surface of an element below the substrate holder (e.g., the flow confinement ring). During plating, the apparatus may switch between a sealed state and an unsealed state, for example by lowering and lifting the substrate and substrate holder as appropriate to engage and disengage the seal. A higher level of applied current or applied voltage may be provided to the substrate when the apparatus is in the sealed state compared to the unsealed state.Type: ApplicationFiled: January 23, 2017Publication date: November 30, 2017Inventors: Kari Thorkelsson, Jacob Lee Hiester, Yu Ding, Bryan L. Buckalew
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Publication number: 20170342583Abstract: The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold between the channeled plate and substrate, and on the sides by a flow confinement ring. A seal may be provided between the bottom surface of a substrate holder and the top surface of an element below the substrate holder (e.g., the flow confinement ring). During plating, fluid enters the cross flow manifold through channels in the channeled plate, and through a cross flow inlet, then exits at the cross flow exit, positioned opposite the cross flow inlet. The apparatus may switch between a sealed state and an unsealed state during electroplating, for example by lowering and lifting the substrate and substrate holder as appropriate to engage and disengage the seal.Type: ApplicationFiled: August 1, 2016Publication date: November 30, 2017Inventors: Kari Thorkelsson, Aaron Berke, Bryan L. Buckalew, Steven T. Mayer
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Patent number: 8785123Abstract: The present invention provides hierarchical assemblies of a block copolymer, a bifunctional linking compound and a nanoparticle. The block copolymers form one micro-domain and the nanoparticles another micro-domain.Type: GrantFiled: October 18, 2010Date of Patent: July 22, 2014Assignee: The Regents of the University of CaliforniaInventors: Ting Xu, Yue Zhao, Kari Thorkelsson
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Publication number: 20120309904Abstract: The present invention provides hierarchical assemblies of a block copolymer, a bifunctional linking compound and a nanoparticle. The block copolymers form one micro-domain and the nanoparticles another micro-domain.Type: ApplicationFiled: October 18, 2010Publication date: December 6, 2012Applicant: The Regents of the University of CaliforniaInventors: Ting Xu, Yue Zhao, Kari Thorkelsson