Patents by Inventor Karim Fernandes

Karim Fernandes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for making a prepreg
    Publication number: 20050028925
    Abstract: A continuous method to make a prepreg with improved thermal conductivity and electrical properties for use in multilayer printed circuit boards.
    Type: Application
    Filed: September 4, 2003
    Publication date: February 10, 2005
    Inventors: Karim Fernandes, Jeffrey Gotro
  • Thermal dissipating printed circuit board and methods
    Publication number: 20020162685
    Abstract: A multilayer circuit board comprising at least one substantially void free encapsulated heavy copper core and methods for producing such a board. Such a board may be formed by providing a first core that includes a substrate and heavy copper circuit traces, filling the spaces between circuit traces with a resin, and at least partially curing the resin so as to form two exposed and substantially planar surfaces on opposite sides of the core. The filled and planarized core is then laminated with additional dielectric layers to form a fully cured, void free multilayer printed circuit board.
    Type: Application
    Filed: May 7, 2002
    Publication date: November 7, 2002
    Inventors: Jeffrey Gotro, Karim Fernandes