Abstract: An apparatus for thermal testing of a printed circuit board being electrically energized and being unpopulated or populated with electrical or electronic components is disclosed. The apparatus includes a device for pyrometrical scanning of surface temperatures, wherein the scanning device comprises a pyrometric sensor being movable for the purpose of scanning and being adjustable with respect to its distance from the printed circuit board. A method for operating such an apparatus is disclosed. The method includes adjusting the distance between the sensor and the printed circuit board during scanning.

Abstract: An apparatus for thermal testing of a printed circuit board being electrically energized and being unpopulated or populated with electrical or electronic components is disclosed. The apparatus includes a device for pyrometrical scanning of surface temperatures, wherein the scanning device comprises a pyrometric sensor being movable for the purpose of scanning and being adjustable with respect to its distance from the printed circuit board. A method for operating such an apparatus is disclosed. The method includes adjusting the distance between the sensor and the printed circuit board during scanning.

Abstract: A device for testing printed circuit boards (1) that have contact points (3) arranged in a pattern. The device includes a needle plate (4) that is parallel to the printed circuit board (1) and can be displaced towards the printed circuit board. The plate is equipped with fixed needles (6), whose points are arranged in the pattern of the contact points (3). The needles (6) and their points are arranged so that they can be repositioned in the (x,y) direction of the plane of the needle plate (4).

Abstract: A device for testing printed circuit boards (1) that have contact points (3) arranged in a pattern. The device includes needle plate (4) that is parallel to the printed circuit board (1) and can be displaced towards the printed circuit board. The plate is equipped with fixed needles (6), whose points are arranged in the pattern of the contact points (3). The needles (6) and their points are arranged so that they can be repositioned in the (x,y) direction of the plane of the needle plate (4).

Abstract: An instrument to test electronic components, the instrument including a drive unit electrically connecting the component and electrically driving the component to generate a field in the nearby space. The instrument also includes a test device electrically insulated from the component and mounted in its vicinity in order to measure the field generated by the component. The drive unit is designed to apply a voltage to the component. The test device includes an instrument amplifier measuring the voltage differential of two electrodes positioned at two sites in the electric field generated by the component. One of the electrodes is positioned near the component.

Abstract: A test method for verifying proper connection of a CMOS IC uses measurements of a transistor within the IC which can be done with a conventional transistor tester. The transistor has its base connected to a ground pin of the IC, its collector connected to a signal pin of the IC, and its emitter connected to another signal pin of the IC. A second collector of the transistor is connected to a supply voltage pin. The method uses a first step in which suitable voltages are applied to the emitter, base and first collector to turn the transistor on, whereupon the first collector current and second collector voltage are measured. In a second step, the same voltages are applied to the emitter and base as were applied in the first step and a voltage is applied to the second collector which is equal to the voltage measured there in the first step.