Abstract: The present invention relates to a hot-melt adhesive composition comprising at least one polyester polyol based on Betulin and at least one NCO-terminated compound as well as a method for the production of a laminated article using the inventive hot-melt adhesive composition.

Abstract: The present invention relates to a reactive polyurethane (PUR) hot-melt adhesive, in particular a moisture cross-linking 1K-PUR hot-melt adhesive, wherein the PUR adhesive contains neutralized hollow glass spheres as fillers. The invention also relates to the use of said adhesive for adhesively bonding substrates.

Abstract: The present invention relates to a hot-melt adhesive composition comprising at least one polyester polyol based on Betulin and at least one NCO-terminated compound as well as a method for the production of a laminated article using the inventive hot-melt adhesive composition.

Abstract: The present invention relates to a reactive polyurethane (PUR) hot-melt adhesive, in particular a moisture cross-linking 1K-PUR hot-melt adhesive, wherein the PUR adhesive contains neutralized hollow glass spheres as fillers. The invention also relates to the use of said adhesive for adhesively bonding substrates.

Abstract: Solvent-free moisture-curing polyurethane compositions are described, containing 99.9% to 75% by weight of at least one polyurethane prepolymer having free isocyanate groups, prepared by reaction of at least one polyol, selected from the group of the polyether polyols and polyester polyols, with at least one polyisocyanate in stoichiometric excess, at least one polyol being a recycled polyethylene terephthalate polyol. In addition, this composition contains 0.1% to 25% by weight of at least one additive selected from the group of the catalysts, resins, plasticisers, fillers, pigments, stabilisers, adhesion promoters and further polymers. The sum total of the aforementioned constituents is 100% by weight. These compositions can be used as a one-component adhesive, reactive hot-melt adhesive, coating material or sealant.

Abstract: The invention relates to a method for bonding metal or plastic substrates, in which the substrate is freed from adhering impurities, a dual-component polyurethane adhesive is directly applied onto at least one substrate without prior application of a primer and the substrates are joined and cured. According to the invention, the dual-component polyurethane adhesive is composed of a component A, containing 1 to 98% by weight with reference to the component A of an oleochemic polyol, 1 to 10% by weight of at least one three-, four- or five-functional polyol with a molecular weight of 90 to 750 g/mol, 2.5 to 60% by weight of at least on aldehyde resin, keton resin and/or keton/aldehyde resin with a molecular weight of 250 to 25000 g/mol, and 0 to 70% by weight of other additives and a component B, containing at least one polyisocyanate, the NCO/OH ratio of the isocyanate component to the polyol component ranging between 1.0 and 2.0:1.

Abstract: The invention relates to a method for bonding metal or plastic substrates, in which the substrate is freed from adhering impurities, a dual-component polyurethane adhesive is directly applied onto at least one substrate without prior application of a primer and the substrates are joined and cured. According to the invention, the dual-component polyurethane adhesive is composed of a component A, containing 1 to 98% by weight with reference to the component A of an oleochemic polyol, 1 to 10% by weight of at least one three-, four- or five-functional polyol with a molecular weight of 90 to 750 g/mol, 2.5 to 60% by weight of at least on aldehyde resin, keton resin and/or keton/aldehyde resin with a molecular weight of 250 to 25000 g/mol, and 0 to 70% by weight of other additives and a component B, containing at least one polyisocyanate, the NCO/OH ratio of the isocyanate component to the polyol component ranging between 1.0 and 2.0:1.

Abstract: The invention relates to the use of moisture-curing PU hotmelt adhesives as molding compounds for the production of moldings, the PU hotmelt adhesives having a melt viscosity of less than 100 Pa.multidot.s at the processing temperature of 70.degree. to 190.degree. C. To produce the moldings, the molding compound is melted at temperatures of 70.degree. to 200.degree. C., the melt is injected into closed molds under an excess pressure of 1 to 50 bar, the cooled moldings are removed from the mold after a short time and are then cured with atmospheric moisture. Economic and technical advantages include distinctly lower processing pressures, expense on machinery and tooling and firm adhesion to various substrates. The moldings are heat-resistant and adhere to various substrates. They are particularly suitable for the production of electrical components.