Patents by Inventor Karina Rott

Karina Rott has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor Device Package Comprising a Thermal Interface Material with Improved Handling Properties
    Publication number: 20220013433
    Abstract: A semiconductor device package comprises an electrically conductive carrier, a semiconductor die disposed on the carrier, an encapsulant encapsulating part of the carrier and the semiconductor die, an electrically insulating and thermally conductive interface structure, in particular covering an exposed surface portion of the carrier and a connected surface portion of the encapsulant, wherein the interface structure comprises a glass transition temperature in a range between ?40° C. to 150° C.
    Type: Application
    Filed: July 6, 2021
    Publication date: January 13, 2022
    Inventors: Martin Mayer, Edward Fuergut, Alexander Roth, Karina Rott