Patents by Inventor Karl Aust

Karl Aust has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrodeposition method for preparing polycrystalline copper having improved mechanical and physical properties
    Patent number: 10060016
    Abstract: Polycrystalline materials are prepared by electrodeposition of a precursor material that is subsequently heat-treated to induce at least a threefold increase in the grain size of the material to yield a relatively high fraction of ‘special’ low ? grain boundaries and a randomized crystallographic texture. The precursor metallic material has sufficient purity and a fine-grained microstructure (e.g., an average grain size of 4 nm to 5 ?m). The resulting metallic material is suited to the fabrication of articles requiring high mechanical or physical isotropy and/or resistance to grain boundary-mediated deformation or degradation mechanisms.
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: August 28, 2018
    Assignee: INTEGRAN TECHNOLOGIES INC.
    Inventors: Gino Palumbo, Iain Brooks, Klaus Tomantschger, Peter Lin, Karl Aust, Nandakumar Nagarajan, Francisco Gonzalez
  • ELECTRODEPOSITION METHOD FOR PREPARING POLYCRYSTALLINE COPPER HAVING IMPROVED MECHANICAL AND PHYSICAL PROPERTIES
    Publication number: 20160208369
    Abstract: Polycrystalline materials are prepared by electrodeposition of a precursor material that is subsequently heat-treated to induce at least a threefold increase in the grain size of the material to yield a relatively high fraction of ‘special’ low ? grain boundaries and a randomized crystallographic texture. The precursor metallic material has sufficient purity and a fine-grained microstructure (e.g., an average grain size of 4 nm to 5 pm). The resulting metallic material is suited to the fabrication of articles requiring high mechanical or physical isotropy and/or resistance to grain boundary-mediated deformation or degradation mechanisms.
    Type: Application
    Filed: January 21, 2016
    Publication date: July 21, 2016
    Applicant: INTEGRAN TECHNOLOGIES INC.
    Inventors: Gino PALUMBO, Iain BROOKS, Klaus TOMANTSCHGER, Peter LIN, Karl AUST, Nandakumar NAGARAJAN, Francisco GONZALEZ
  • Method for preparing polycrystalline structures having improved mechanical and physical properties
    Patent number: 9260790
    Abstract: Polycrystalline materials are prepared by electrodeposition of a precursor material that is subsequently heat-treated to induce at least a threefold increase in the grain size of the material to yield a relatively high fraction of ‘special’ low ? grain boundaries and a randomized crystallographic texture. The precursor metallic material has sufficient purity and a fine-grained microstructure (e.g., an average grain size of 4 nm to 5 ?m). The resulting metallic material is suited to the fabrication of articles requiring high mechanical or physical isotropy and/or resistance to grain boundary-mediated deformation or degradation mechanisms.
    Type: Grant
    Filed: December 18, 2008
    Date of Patent: February 16, 2016
    Assignee: INTEGRAN TECHNOLOGIES INC.
    Inventors: Gino Palumbo, Iain Brooks, Klaus Tomantschger, Peter Lin, Karl Aust, Nandakumar Nagarajan, Francisco Gonzalez
  • Method for Preparing Polycrystalline Structures Having Improved Mechanical and Physical Properties
    Publication number: 20100307642
    Abstract: Polycrystalline materials are prepared by electrodeposition of a precursor material that is subsequently heat-treated to induce at least a threefold increase in the grain size of the material to yield a relatively high fraction of ‘special’ low ? grain boundaries and a randomized crystallographic texture. The precursor metallic material has sufficient purity and a fine-grained microstructure (e.g., an average grain size of 4 nm to 5 ?m). The resulting metallic material is suited to the fabrication of articles requiring high mechanical or physical isotropy and/or resistance to grain boundary-mediated deformation or degradation mechanisms.
    Type: Application
    Filed: December 18, 2008
    Publication date: December 9, 2010
    Applicant: INTEGRAN TECHNOLOGIES, INC.
    Inventors: Gino Palumbo, Iain Brooks, Klaus Tomantschger, Peter Lin, Karl Aust, Nandakumar Nagarajan, Francisco Gonzalez