Patents by Inventor Karl Butner

Karl Butner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulated power semiconductor device with single piece heat sink mounting plate
    Patent number: 4196444
    Abstract: A simplified power semiconductor device comprising a single-piece impact-extruded aluminum heat sink/support having a recess in one surface surrounded by an upstanding annular collar. The semiconductor chip is soldered to the floor of the recess and has contact zones at its opposite surface. Nail head leads are bonded to the contact zones. Encapsulation is completed by a mass of plastic or glass within the collar or by a sealing disc closing the collar through which the leads project.
    Type: Grant
    Filed: March 26, 1979
    Date of Patent: April 1, 1980
    Assignee: Texas Instruments Deutschland GmbH
    Inventors: Karl Butner, Josef Hehnen, Reiner Rudiger