Abstract: An integrated circuit device support tool which includes a device for providing a vacuum for holding an integrated circuit device to be soldered to a printed circuit board. The tool also includes a plurality of thin, pressure transferring members for pressing the leads of the integrated circuit device against a printed circuit board during soldering. The pressure transferring members are of a thin material so as not to provide a heat sink during the soldering operation.

Abstract: An infrared (IR) heater array apparatus that provides focused lines of IR radiation for soldering integrated circuit components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus is configured for concentric mounting in combination with the placement head of placement apparatus wherein FPDs and other IC devices may be bonded to the circuit board while the device is held in place by the placement apparatus. One preferred embodiment of the apparatus includes an array of IR lamps and associated lamp envelopes and lenses, together with control apparatus for operating the IR lamps and aligning the focused IR radiation generated thereby. The radiation generated by the IR lamps is configured to provide a desired line pattern of energy which is directed onto the leads of a device being soldered. The perimeter of the energy pattern is programmably alterable to suit particular device lead sizes and configurations.

Abstract: An infrared (IR) heater array apparatus that provides focused lines of IR radiation for soldering integrated circuit components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus is configured for concentric mounting in combination with the placement head of placement apparatus wherein FPDs and other IC devices may be bonded to the circuit board while the device is held in place by the placement apparatus. One preferred embodiment of the apparatus includes a rectangular frame member having four radiation slits, a rectangular array of four IR lamps and associated lamp envelopes mounted in combination outside the frame member, X and Y pairs of reflecting members rotatably mounted within the frame member, and control subsystems for operating the IR lamps and aligning the focused IR radiation generated thereby.

Abstract: An improved solder reflow system for mass joining with solder electrical and electronic components affixed on a circuit board is provided. The system employs a combination of IR heating, recirculating forced hot air heating, and focused forced hot air heating to achieve solder reflow at throughput speeds and soldering quality not heretofore achievable.

Abstract: A reclosable bag has elongated opening means adapted to be permanently opened with a slide fastener having support tapes secured to the bag on respective opposite sides of the opening means for forming a closure over the opening means once the opening means have been permanently opened.

Abstract: Protruding head portions of coupling elements are removed from a selected section of a slide stringer, and a reinforcing tape is applied to the selected section by means including a movable holder for clamping the stringer on opposite sides of the selected section. The holder is restricted to movement along track means for guiding and aligning the holder with two or more stations, such as a gapping station, a reinforcing tape applying station and a trimming station.

Abstract: A non-woven fabric or film of thermoplastic material has a pattern impressed on its surface so that it has a more pleasing appearance. The film is pressed between the patterned surfaces of two mold bands and is passed through an electromagnetic field which heats a susceptor material in the film to soften the fabric or film so that the pattern will be impressed in it.