Patents by Inventor Karl E. Kroll

Karl E. Kroll has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package
    Patent number: 5162264
    Abstract: Integrated circuit package comprising a power supply distribution wiring and a chip interconnection signal wiring both formed on the top surface of a passive semiconductor interconnection carrier (2) in which a power supply decoupling capacitor is implemented.Spaced wells (4) of a first conductivity type are provided in the surface of said carrier of a second conductivity type.The power supply distribution wiring comprises first and second conductive lines (5,6) within a first wiring level (WL1).Said first conductive lines (5) are deposited on the surface areas of said wells (4) in an ohmic contact relationship and said second conductive lines (6) are deposited on the surface areas of said carrier (2) between said wells (4) in an ohmic contact relationship.Said first and second conductive lines are connected to first and second terminals of the power supply, respectively, so that the junction capacitance between said wells (4) and the carrier material (2) embedding said wells forms said decoupling capacitor.
    Type: Grant
    Filed: May 7, 1991
    Date of Patent: November 10, 1992
    Assignee: International Business Machines Corporation
    Inventors: Werner O. Haug, Erich Klink, Karl E. Kroll, Thomas Ludwig, Helmut Schettler, Rainer Stahl, Otto M. Wagner
  • Integrated circuit package
    Patent number: 5016087
    Abstract: Integrated circuit package comprising a power supply distribution wiring and a chip interconnection signal wiring both formed on the top surface of a passive semiconductor interconnection carrier (2) in which a power supply decoupling capacitor is implemented.Spaced wells (4) of a first conductivity type are provided in the surface of said carrier of a second conductivity type.The power supply distribution wiring comprises first and second conductive lines (5,6) within a first wiring level (WL1).Said first conductive lines (5) are deposited on the surface areas of said wells (4) in an ohmic contact relationship and said second conductive lines (6) are deposited on the surface areas of said carrier (2) between said wells (4) in an ohmic contact relationship.Said first and second conductive lines are connected to first second terminals of the power supply, respectively, so that the junction capacitance between said wells (4) and the carrier material (2) embedding said wells forms said decoupling capacitor.
    Type: Grant
    Filed: February 15, 1990
    Date of Patent: May 14, 1991
    Assignee: International Business Machines Corporation
    Inventors: Werner O. Haug, Erich Klink, Karl E. Kroll, Thomas Ludwig, Helmut Schettler, Rainer Stahl, Otto M. Wagner