Patents by Inventor Karl F. Leeser
Karl F. Leeser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955366Abstract: An assembly used in a process chamber for depositing a film on a wafer. A pedestal assembly includes a pedestal movably mounted to a main frame. A lift pad rests upon the pedestal and moves with the pedestal assembly. A raising mechanism separates the lift pad from the pedestal, and includes a hard stop fixed to the main frame, a roller attached to the pedestal assembly, a slide moveably attached to the pedestal assembly, a lift pad bracket interconnected to the slide and a pad shaft extending from the lift pad, and a lever rotatably attached to the lift pad bracket. The lever rests on the roller when not engaged with the upper hard stop. When the pedestal assembly moves upwards, the lever rotates about a pin when engaging the upper hard stop and roller, and separates the lift pad from the pedestal by a process rotation displacement.Type: GrantFiled: July 12, 2022Date of Patent: April 9, 2024Assignee: Lam Research CorporationInventors: Paul Konkola, Karl F. Leeser, Easwar Srinivasan
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Patent number: 11768011Abstract: Tubing structures are connected to each other to form a tubing assembly having one or more fluid pathways from a fluid entrance to a fluid exit. A heating device is bonded to the tubing structures along a length of the tubing assembly. The heating device has a flexibility to follow along one or more bends present along the length of the tubing assembly. The heating device includes one or more heater traces embedded within an encasing material. The encasing material is thermally conductive and electrically insulative. The one or more heater traces are formed of a material that generates heat in the presence of an electrical current. The heating device has a continuous and unbroken structure along the length of the tubing assembly. An encapsulation layer of thermal insulating material is disposed over the tubing assembly and covers the heating device.Type: GrantFiled: March 13, 2020Date of Patent: September 26, 2023Assignee: Lam Research CorporationInventor: Karl F. Leeser
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Publication number: 20220352004Abstract: An assembly used in a process chamber for depositing a film on a wafer. A pedestal assembly includes a pedestal movably mounted to a main frame. A lift pad rests upon the pedestal and moves with the pedestal assembly. A raising mechanism separates the lift pad from the pedestal, and includes a hard stop fixed to the main frame, a roller attached to the pedestal assembly, a slide moveably attached to the pedestal assembly, a lift pad bracket interconnected to the slide and a pad shaft extending from the lift pad, and a lever rotatably attached to the lift pad bracket. The lever rests on the roller when not engaged with the upper hard stop. When the pedestal assembly moves upwards, the lever rotates about a pin when engaging the upper hard stop and roller, and separates the lift pad from the pedestal by a process rotation displacement.Type: ApplicationFiled: July 12, 2022Publication date: November 3, 2022Inventors: Paul Konkola, Karl F. Leeser, Easwar Srinivasan
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Patent number: 11387136Abstract: An assembly used in a process chamber for depositing a film on a wafer. A pedestal assembly includes a pedestal movably mounted to a main frame. A lift pad rests upon the pedestal and moves with the pedestal assembly. A raising mechanism separates the lift pad from the pedestal, and includes a hard stop fixed to the main frame, a roller attached to the pedestal assembly, a slide moveably attached to the pedestal assembly, a lift pad bracket interconnected to the slide and a pad shaft extending from the lift pad, and a lever rotatably attached to the lift pad bracket. The lever rests on the roller when not engaged with the upper hard stop. When the pedestal assembly moves upwards, the lever rotates about a pin when engaging the upper hard stop and roller, and separates the lift pad from the pedestal by a process rotation displacement.Type: GrantFiled: February 4, 2020Date of Patent: July 12, 2022Assignee: Lam Research CorporationInventors: Paul Konkola, Karl F. Leeser, Easwar Srinivasan
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Patent number: 11131480Abstract: A tubing assembly includes a plurality of tubing structures connected to each other in a configuration providing one or more fluid pathways through the plurality of tubing structures from a fluid entrance to a fluid exit of the plurality of tubing structures. An electrical resistance heating filament wire is wound around the plurality of tubing structures in an unbroken manner from the fluid entrance to the fluid exit. The electrical resistance heating filament wire has a first electrical lead located proximate to the fluid entrance of the plurality of tubing structures and a second electrical lead located proximate to the fluid exit of the plurality of tubing structures. An encapsulation layer of thermal insulating material is disposed over an entirety of the plurality of tubing structures and covers the electrical resistance heating filament wire wound around the plurality of tubing structures with the first and second electrical leads exposed.Type: GrantFiled: November 21, 2018Date of Patent: September 28, 2021Assignee: Lam Research CorporationInventor: Karl F. Leeser
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Patent number: 11056380Abstract: An assembly used in a process chamber for depositing a film on a wafer and including a pedestal extending from a central axis. An actuator is configured for controlling movement of the pedestal. A central shaft extends between the actuator and pedestal, the central shaft configured to move the pedestal along the central axis. A lift pad is configured to rest upon the pedestal and having a pad top surface configured to support a wafer placed thereon. A pad shaft extends between the actuator and the lift pad and controls movement of the lift pad. The pad shaft is positioned within the central shaft and is configured to separate the lift pad from the pedestal top surface by a process rotation displacement when the pedestal is in an upwards position. The pad shaft is configured to rotate relative to the pedestal top surface between first and second angular orientations.Type: GrantFiled: June 16, 2020Date of Patent: July 6, 2021Assignee: Lam Research CorporationInventors: Paul Konkola, Karl F. Leeser, Easwar Srinivasan
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Patent number: 10879048Abstract: A charge volume configuration for use in delivery of gas to a reactor for processing semiconductor wafers is provided. A charge volume includes a chamber that extends between a proximal end and a distal end. A base connected to the proximal end of the chamber, and the base includes an inlet port and an outlet port. A tube is disposed within the chamber. The tube has a tube diameter that is less than a chamber diameter. The tube has a connection end coupled to the inlet port at the proximal end of the chamber and an output end disposed at the distal end of the chamber.Type: GrantFiled: December 19, 2019Date of Patent: December 29, 2020Assignee: Lam Research CorporationInventor: Karl F. Leeser
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Patent number: 10870922Abstract: An assembly used in a process chamber for depositing a film on a wafer including a pedestal assembly having a pedestal movably mounted to a main frame. A lift pad rests upon the pedestal and moves with the pedestal. A raising mechanism separates the pad from the pedestal, and includes a hard stop fixed to the main frame, a roller attached to the pedestal assembly, a slide moveably attached to the pedestal assembly, a lift pad bracket interconnected to the slide and a pad shaft extending from the lift pad, a lever rotatably attached to lift pad bracket, a ferroseal assembly surrounding the pad shaft, and a yoke assembly offsetting a moment to the ferroseal assembly when the lever rotates. When the pedestal assembly moves upwards, the lever rotates when engaging with the upper hard stop and roller, and separates the pad from the pedestal by a process rotation displacement.Type: GrantFiled: February 5, 2020Date of Patent: December 22, 2020Assignee: Lam Research CorporationInventors: Paul Konkola, Karl F. Leeser, Easwar Srinivasan
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Patent number: 10804099Abstract: Methods of selectively inhibiting deposition of silicon-containing films deposited by atomic layer deposition are provided. Selective inhibition involves exposure of an adsorbed layer of a silicon-containing precursor to a hydrogen-containing inhibitor, and in some instances, prior to exposure of the adsorbed layer to a second reactant. Exposure to a hydrogen-containing inhibitor may be performed with a plasma, and methods are suitable for selective inhibition in thermal or plasma enhanced atomic layer deposition of silicon-containing films.Type: GrantFiled: December 19, 2017Date of Patent: October 13, 2020Assignee: Lam Research CorporationInventors: Jon Henri, Dennis M. Hausmann, Bart J. van Schravendijk, Shane Tang, Karl F. Leeser
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Publication number: 20200312703Abstract: An assembly used in a process chamber for depositing a film on a wafer and including a pedestal extending from a central axis. An actuator is configured for controlling movement of the pedestal. A central shaft extends between the actuator and pedestal, the central shaft configured to move the pedestal along the central axis. A lift pad is configured to rest upon the pedestal and having a pad top surface configured to support a wafer placed thereon. A pad shaft extends between the actuator and the lift pad and controls movement of the lift pad. The pad shaft is positioned within the central shaft and is configured to separate the lift pad from the pedestal top surface by a process rotation displacement when the pedestal is in an upwards position. The pad shaft is configured to rotate relative to the pedestal top surface between first and second angular orientations.Type: ApplicationFiled: June 16, 2020Publication date: October 1, 2020Inventors: Paul Konkola, Karl F. Leeser, Easwar Srinivasan
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Publication number: 20200217558Abstract: Tubing structures are connected to each other to form a tubing assembly having one or more fluid pathways from a fluid entrance to a fluid exit. A heating device is bonded to the tubing structures along a length of the tubing assembly. The heating device has a flexibility to follow along one or more bends present along the length of the tubing assembly. The heating device includes one or more heater traces embedded within an encasing material. The encasing material is thermally conductive and electrically insulative. The one or more heater traces are formed of a material that generates heat in the presence of an electrical current. The heating device has a continuous and unbroken structure along the length of the tubing assembly. An encapsulation layer of thermal insulating material is disposed over the tubing assembly and covers the heating device.Type: ApplicationFiled: March 13, 2020Publication date: July 9, 2020Inventor: Karl F. Leeser
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Patent number: 10699937Abstract: An assembly used in a process chamber for depositing a film on a wafer and including a pedestal extending from a central axis. An actuator is configured for controlling movement of the pedestal. A central shaft extends between the actuator and pedestal, the central shaft configured to move the pedestal along the central axis. A lift pad is configured to rest upon the pedestal and having a pad top surface configured to support a wafer placed thereon. A pad shaft extends between the actuator and the lift pad and controls movement of the lift pad. The pad shaft is positioned within the central shaft and is configured to separate the lift pad from the pedestal top surface by a process rotation displacement when the pedestal is in an upwards position. The pad shaft is configured to rotate relative to the pedestal top surface between first and second angular orientations.Type: GrantFiled: July 15, 2019Date of Patent: June 30, 2020Assignee: Lam Research CorporationInventors: Paul Konkola, Karl F. Leeser, Easwar Srinivasan
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Publication number: 20200173016Abstract: An assembly used in a process chamber for depositing a film on a wafer including a pedestal assembly having a pedestal movably mounted to a main frame. A lift pad rests upon the pedestal and moves with the pedestal. A raising mechanism separates the pad from the pedestal, and includes a hard stop fixed to the main frame, a roller attached to the pedestal assembly, a slide moveably attached to the pedestal assembly, a lift pad bracket interconnected to the slide and a pad shaft extending from the lift pad, a lever rotatably attached to lift pad bracket, a ferroseal assembly surrounding the pad shaft, and a yoke assembly offsetting a moment to the ferroseal assembly when the lever rotates. When the pedestal assembly moves upwards, the lever rotates when engaging with the upper hard stop and roller, and separates the pad from the pedestal by a process rotation displacement.Type: ApplicationFiled: February 5, 2020Publication date: June 4, 2020Inventors: Paul Konkola, Karl F. Leeser, Easwar Srinivasan
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Publication number: 20200176301Abstract: An assembly used in a process chamber for depositing a film on a wafer. A pedestal assembly includes a pedestal movably mounted to a main frame. A lift pad rests upon the pedestal and moves with the pedestal assembly. A raising mechanism separates the lift pad from the pedestal, and includes a hard stop fixed to the main frame, a roller attached to the pedestal assembly, a slide moveably attached to the pedestal assembly, a lift pad bracket interconnected to the slide and a pad shaft extending from the lift pad, and a lever rotatably attached to the lift pad bracket. The lever rests on the roller when not engaged with the upper hard stop. When the pedestal assembly moves upwards, the lever rotates about a pin when engaging the upper hard stop and roller, and separates the lift pad from the pedestal by a process rotation displacement.Type: ApplicationFiled: February 4, 2020Publication date: June 4, 2020Inventors: Paul Konkola, Karl F. Leeser, Easwar Srinivasan
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Publication number: 20200126758Abstract: A charge volume configuration for use in delivery of gas to a reactor for processing semiconductor wafers is provided. A charge volume includes a chamber that extends between a proximal end and a distal end. A base connected to the proximal end of the chamber, and the base includes an inlet port and an outlet port. A tube is disposed within the chamber. The tube has a tube diameter that is less than a chamber diameter. The tube has a connection end coupled to the inlet port at the proximal end of the chamber and an output end disposed at the distal end of the chamber.Type: ApplicationFiled: December 19, 2019Publication date: April 23, 2020Inventor: Karl F. Leeser
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Patent number: 10591182Abstract: Tubing structures are connected to each other to form a tubing assembly having one or more fluid pathways from a fluid entrance to a fluid exit. A heating device is bonded to the tubing structures along a length of the tubing assembly. The heating device has a flexibility to follow along one or more bends present along the length of the tubing assembly. The heating device includes one or more heater traces embedded within an encasing material. The encasing material is thermally conductive and electrically insulative. The one or more heater traces are formed of a material that generates heat in the presence of an electrical current. The heating device has a continuous and unbroken structure along the length of the tubing assembly. An encapsulation layer of thermal insulating material is disposed over the tubing assembly and covers the heating device.Type: GrantFiled: July 13, 2016Date of Patent: March 17, 2020Assignee: Lam Research CorporationInventor: Karl F. Leeser
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Patent number: 10573549Abstract: An assembly used in a process chamber for depositing a film on a wafer. A pedestal assembly includes a pedestal movably mounted to a main frame. A lift pad rests upon the pedestal and moves with the pedestal assembly. A raising mechanism separates the lift pad from the pedestal, and includes a hard stop fixed to the main frame, a roller attached to the pedestal assembly, a slide moveably attached to the pedestal assembly, a lift pad bracket interconnected to the slide and a pad shaft extending from the lift pad, and a lever rotatably attached to the lift pad bracket. The lever rests on the roller when not engaged with the upper hard stop. When the pedestal assembly moves upwards, the lever rotates about a pin when engaging the upper hard stop and roller, and separates the lift pad from the pedestal by a process rotation displacement.Type: GrantFiled: December 1, 2016Date of Patent: February 25, 2020Assignee: Lam Research CorporationInventors: Paul Konkola, Karl F. Leeser, Easwar Srinivasan
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Patent number: 10570515Abstract: An assembly used in a process chamber for depositing a film on a wafer including a pedestal assembly having a pedestal movably mounted to a main frame. A lift pad rests upon the pedestal and moves with the pedestal. A raising mechanism separates the pad from the pedestal, and includes a hard stop fixed to the main frame, a roller attached to the pedestal assembly, a slide moveably attached to the pedestal assembly, a lift pad bracket interconnected to the slide and a pad shaft extending from the lift pad, a lever rotatably attached to lift pad bracket, a ferroseal assembly surrounding the pad shaft, and a yoke assembly offsetting a moment to the ferroseal assembly when the lever rotates. When the pedestal assembly moves upwards, the lever rotates when engaging with the upper hard stop and roller, and separates the pad from the pedestal by a process rotation displacement.Type: GrantFiled: October 30, 2018Date of Patent: February 25, 2020Assignee: Lam Research CorporationInventors: Paul Konkola, Karl F. Leeser, Easwar Srinivasan
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Patent number: 10550469Abstract: A spatial atomic layer deposition (ALD) system is disclosed. The system includes a chamber that includes a plurality of zones oriented along a track. Also included is a shuttle that is configured to support the substrate and transport the substrate to each of the plurality of zones to enable deposition of a thin film. The shuttle includes an RF power electrode and an RF ground electrode coupled to an RF power source. The RF electrode and the RF ground electrode are each embedded in the shuttle, such that power provided by the RF power source to the shuttle moves with the shuttle to each of the zones. The RF power source is configured to be activated in synchronization with moving the shuttle to one of the zones.Type: GrantFiled: September 4, 2015Date of Patent: February 4, 2020Assignee: Lam Research CorporationInventor: Karl F. Leeser
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Patent number: 10526700Abstract: The present inventors have conceived of a multi-stage process gas delivery system for use in a substrate processing apparatus. In certain implementations, a first process gas may first be delivered to a substrate in a substrate processing chamber. A second process gas may be delivered, at a later time, to the substrate to aid in the even dosing of the substrate. Delivery of the first process gas and the second process gas may cease at the same time or may cease at separate times.Type: GrantFiled: September 13, 2018Date of Patent: January 7, 2020Assignee: Lam Research CorporationInventors: Purushottam Kumar, Hu Kang, Adrien LaVoie, Yi Chung Chiu, Frank L. Pasquale, Jun Qian, Chloe Baldasseroni, Shankar Swaminathan, Karl F. Leeser, David Charles Smith, Wei-Chih Lai