Patents by Inventor Karl F. Seelig

Karl F. Seelig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • White Metal Babbitt for Rolling Mill Bushing
    Publication number: 20130084209
    Abstract: A tin based white metal alloy consisting essentially by weight of approximately 5.0%-0-9.0% antimony, approximately 3.0%-8.0% copper, approximately 0.1%-0.7% cobalt, and the balance tin.
    Type: Application
    Filed: August 21, 2012
    Publication date: April 4, 2013
    Applicant: Siemens Industry, Inc.
    Inventor: Karl F. Seelig
  • TIN ALLOY SOLDER COMPOSITION
    Publication number: 20100059576
    Abstract: A lead-free and solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition comprises, by weight, about 0.2% to about 1% copper; about 0.001% to about 0.039% nickel; about 0.001% to about 0.039% cobalt; and the balance of tin. The alloy composition has a melting temperature of about 227° C., with superior wetting and mechanical strength making the alloy composition wells suited for electronic circuit board manufacture and lead less component bumping or column arrays, and replacement of conventional tin-lead solders.
    Type: Application
    Filed: September 5, 2008
    Publication date: March 11, 2010
    Applicant: American Iron & Metal Company, Inc.
    Inventor: Karl F. Seelig
  • Lead-free and bismuth-free tin alloy solder composition
    Patent number: 5405577
    Abstract: A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition consists of, in weight percent, 90.3-99.2% tin, 0.5-3.5% silver, 0.1-2.8% copper, and 0.2-2.0% antimony. The alloy composition has a melting temperature of 210.degree.-216.degree. C. with superior wetting and mechanical strength making the alloy composition well suited for electronic circuit board manufacture and replacement of conventional tin-lead solders.
    Type: Grant
    Filed: April 11, 1994
    Date of Patent: April 11, 1995
    Inventors: Karl F. Seelig, Donald G. Lockard
  • Lead-free bismuth free tin alloy solder composition
    Patent number: 5352407
    Abstract: A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition consists of, in weight percent, 93-98% tin, 1.5-3.5% silver, 0.2-2.0% copper, and 0.2-2.0% antimony. The alloy composition has a melting temperature of 210.degree.-215.degree. C. with superior wetting and mechanical strength making the alloy composition well suited for electronic circuit board manufacture and replacement of conventional tin-lead solders.
    Type: Grant
    Filed: April 29, 1993
    Date of Patent: October 4, 1994
    Inventors: Karl F. Seelig, Donald G. Lockard