Abstract: A method and apparatus for cooling an electronic application having at least one heat-generating electronic component mounted on a circuit board. A heat transferring heat sink is attached to the circuit board in thermal contact with one heat generating electronic component by first being statically fixed to the circuit board in a stationary position at a specified height above the circuit board, and then by resiliently biasing the component against the heat sink.

Abstract: A method and apparatus for cooling an electronic application having at least one heat-generating electronic component mounted on a circuit board. A heat transferring heat sink is attached to the circuit board in thermal contact with one heat generating electronic component by first being statically fixed to the circuit board in a stationary position at a specified height above the circuit board, and then by resiliently biasing the component against the heat sink.

Abstract: The invention relates to a guide and support structure (1) that in addition to providing a secure and stable guide support for the plug-in unit and good electric contact properties enhances the removal of heat from the plug-in unit. This is achieved by means of a guide and support structure having an upper web forming a guide channel for a plug-in unit and being connected to a base of the structure through side walls of the structure. The base is at least partially open in order to allow air flow through the interior of the elongated profile. By virtue of such a configuration blockage of a cooling-air flow will be significantly reduced. Such a reduced blockage of cooling-air flow will in turn enhance the cooling of plug-in units and will require less powerful fans for producing the cooling-air flow.

Abstract: The invention relates to a guide and support structure (1) that in addition to providing a secure and stable guide support for the plug-in unit and good electric contact properties enhances the removal of heat from the plug-in unit. This is achieved by means of a guide and support structure having an upper web forming a guide channel for a plug-in unit and being connected to a base of the structure through side walls of the structure. The base is at least partially open in order to allow air flow through the interior of the elongated profile. By virtue of such a configuration blockage of a cooling-air flow will be significantly reduced. Such a reduced blockage of cooling-air flow will in turn enhance the cooling of plug-in units and will require less powerful fans for producing the cooling-air flow.