Patents by Inventor Karl H. Langsdorf

Karl H. Langsdorf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process and apparatus for abrasive machining of a wafer-like workpiece
    Patent number: 4739589
    Abstract: A process is provided for bilateral abrasive machining of wafer-like workpieces, especially semiconductor wafers. The process uses carrier disks in which the outer periphery on which the driving forces mesh, is made of a material having a tensile strength of at least 100 N/mm.sup.2, while in the area that comes into contact with the workpieces to be machined, there is provided a plastic material having an elasticity modulus of from 1.0 to 8.10.sup.4 N/mm.sup.2.
    Type: Grant
    Filed: July 2, 1986
    Date of Patent: April 26, 1988
    Assignee: Wacker-Chemitronic Gesellschaft fur Elektronik-Grundstoff mbH
    Inventors: Gerhard Brehm, Ingo Haller, Otto Rothenaicher, Karl H. Langsdorf