Patents by Inventor Karl-Heinz Hohenwarter
Karl-Heinz Hohenwarter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230411177Abstract: An apparatus for processing a wafer-shaped article, the apparatus comprising: a support for supporting the wafer-shaped article; and a liquid dispenser for dispensing a processing liquid onto a surface of the wafer-shaped article supported by the support; wherein the liquid dispenser comprises a nozzle assembly, the nozzle assembly comprising: an inlet portion; a dispensing nozzle; and a static throttle between the inlet portion and the dispensing nozzle, the static throttle comprising a plurality of flow passages through which the processing liquid can flow from the inlet portion to the dispensing nozzle.Type: ApplicationFiled: October 14, 2021Publication date: December 21, 2023Inventors: Karl-Heinz HOHENWARTER, Bhaskar BANDARAPU, Christian PUTZI
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Publication number: 20210366738Abstract: A vapor delivery head for wet treatment of a substrate includes a body including an upper surface, a lower surface, an upper plenum and a lower plenum. A first bore is arranged on the upper surface of the body and fluidly connected to the upper plenum to supply heated fluid. A second bore is arranged on the upper surface of the body and connected to the upper plenum to remove heated fluid. A third bore is arranged on the upper surface of the body and connected to the lower plenum to receive a gas mixture. A plurality of through holes through the lower surface of the body are in fluid communication with the lower plenum.Type: ApplicationFiled: August 21, 2019Publication date: November 25, 2021Inventors: Bhaskar BANDARAPU, David MUI, Karl-Heinz HOHENWARTER, Butch BERNEY, Nathan LAVDOVSKY, Christian PUTZI, Hongbo SI, Robert JOHNSON, Michael KLEMM, Bernhard LOIDL
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Patent number: 10658204Abstract: A substrate processing system to treat a substrate includes a spin chuck configured to hold and rotate a substrate. A heating assembly is configured to heat an opposite surface of the substrate and includes a main heater assembly and a nozzle stack cap. The main heater assembly includes a first plurality of light emitting diodes (LEDs) arranged on a first printed circuit board (PCB) in a first plane that is spaced from and parallel to a second plane including the substrate. The nozzle stack cap assembly includes at least one nozzle to dispense liquid onto a center of a first surface of the substrate. A radiant heat source is arranged closer to the substrate than the first plane and is configured to heat the center of the first surface of the substrate.Type: GrantFiled: August 8, 2017Date of Patent: May 19, 2020Assignee: LAM RESEARCH AGInventors: Bridget Hill, Michael Puggl, Gerhard Mueller, Henry Roger Osner, Karl-Heinz Hohenwarter, Ulrich Tschinderle, Daniel Brien
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Publication number: 20190051541Abstract: A substrate processing system to treat a substrate includes a spin chuck configured to hold and rotate a substrate. A heating assembly is configured to heat an opposite surface of the substrate and includes a main heater assembly and a nozzle stack cap. The main heater assembly includes a first plurality of light emitting diodes (LEDs) arranged on a first printed circuit board (PCB) in a first plane that is spaced from and parallel to a second plane including the substrate. The nozzle stack cap assembly includes at least one nozzle to dispense liquid onto a center of a first surface of the substrate. A radiant heat source is arranged closer to the substrate than the first plane and is configured to heat the center of the first surface of the substrate.Type: ApplicationFiled: August 8, 2017Publication date: February 14, 2019Inventors: Bridget Hill, Michael Puggl, Gerhard Mueller, Henry Roger Osner, Karl-Heinz Hohenwarter, Ulrich Tschinderle, Daniel Brien
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Patent number: 10068792Abstract: An apparatus for processing wafer-shaped articles comprises a rotary chuck adapted to hold a wafer shaped article thereon. The rotary chuck comprises a peripheral series of pins configured to contact an edge region of a wafer-shaped article. Each of the pins projects from the rotary chuck, and each of the pins comprises a projecting portion having a gripping element at a distal end thereof, and a proximal portion comprising a drive mechanism at a proximal end thereof by which the pin can be rotated. The projecting portion and the proximal portion comprise interengageable connectors configured to allow the projecting and proximal portions to be interconnected by pressing the projecting portion against the proximal portion and to be disconnected by pulling the projecting portion away from the proximal portion.Type: GrantFiled: May 31, 2016Date of Patent: September 4, 2018Assignee: LAM RESEARCH AGInventors: Karl-Heinz Hohenwarter, Bridget Hill, Hongbo Si
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Publication number: 20170345684Abstract: An apparatus for processing wafer-shaped articles comprises a rotary chuck adapted to hold a wafer shaped article thereon. The rotary chuck comprises a peripheral series of pins configured to contact an edge region of a wafer-shaped article. Each of the pins projects from the rotary chuck, and each of the pins comprises a projecting portion having a gripping element at a distal end thereof, and a proximal portion comprising a drive mechanism at a proximal end thereof by which the pin can be rotated. The projecting portion and the proximal portion comprise interengageable connectors configured to allow the projecting and proximal portions to be interconnected by pressing the projecting portion against the proximal portion and to be disconnected by pulling the projecting portion away from the proximal portion.Type: ApplicationFiled: May 31, 2016Publication date: November 30, 2017Inventors: Karl-Heinz HOHENWARTER, Bridget HILL, Hongbo SI
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Patent number: 9536770Abstract: An apparatus for processing wafer-shaped articles includes a rotary chuck adapted to hold a wafer shaped article thereon. The rotary chuck includes a peripheral series of pins configured to contact an edge region of a wafer-shaped article. Each of the pins projects upwardly from the rotary chuck, and each of the pins is individually secured to the rotary chuck by a respective connecting mechanism. Any selected one of the pins can be removed from the rotary chuck by disconnecting its corresponding connecting mechanism without removing any structure of the rotary chuck that surrounds any others of the pins.Type: GrantFiled: January 14, 2014Date of Patent: January 3, 2017Assignee: LAM RESEARCH AGInventors: Michael Brugger, Karl-Heinz Hohenwarter, Dieter Spitaler, Gerald Anton
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Publication number: 20160376702Abstract: An apparatus for processing a wafer shaped article comprises a rotary chuck for holding a wafer shaped article and rotating the wafer shaped article about an axis of rotation. A chamber surrounds and encloses the rotary chuck, the chamber comprising an upper opening. A lid is mounted externally of the chamber so as to be movable between a closed position in which the lid seals the upper opening, and an open position in which the lid uncovers the upper opening and is displaced laterally therefrom. The chamber is openable separately from the lid so as to permit a wafer shaped article to be introduced into the chamber in a direction perpendicular to the axis of rotation.Type: ApplicationFiled: June 26, 2015Publication date: December 29, 2016Inventors: Karl-Heinz HOHENWARTER, Michael PUGGL, Reinhold SCHWARZENBACHER, Milan PLISKA
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Patent number: 9355883Abstract: In an apparatus and method for treating a wafer-shaped article, a spin chuck is provided for holding a wafer-shaped article in a predetermined orientation wherein a lower surface of the wafer-shaped article is spaced a predetermined distance from an upper surface of the spin chuck. A heating assembly comprising at least one infrared heater is mounted above the upper surface of the spin chuck and below a wafer-shaped article when mounted on the spin chuck. The heating assembly is stationary in relation to rotation of the spin chuck.Type: GrantFiled: September 9, 2011Date of Patent: May 31, 2016Assignee: LAM RESEARCH AGInventors: Karl-Heinz Hohenwarter, Lach Otto
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Patent number: 9316443Abstract: In an apparatus and process for treating wafer-shaped articles, a spin chuck holds a wafer-shaped article in a predetermined orientation relative to an upper surface of the spin chuck. The apparatus includes a heating assembly having a housing that contains at least one infrared heating element. The heating assembly is mounted above an upper surface of the spin chuck and adjacent a wafer-shaped article when mounted on the spin chuck. The housing comprises a gas inlet connected to a gas supply, and at least one outlet for discharging gas from the housing.Type: GrantFiled: August 23, 2012Date of Patent: April 19, 2016Assignee: LAM RESEARCH AGInventors: Karl-Heinz Hohenwarter, Vijay Badam, Christoph Semmelrock
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Publication number: 20150200123Abstract: An apparatus for treating a wafer-shaped article, comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, at least one upper nozzle for dispensing a treatment fluid onto an upwardly facing surface of a wafer-shaped article when positioned on the spin chuck, and at least one lower nozzle arm comprising a series of lower nozzles extending from a central region of the spin chuck to a peripheral region of the spin chuck. The series of nozzles comprises a smaller nozzle in a central region of the spin chuck and a larger nozzle in a peripheral region of the spin chuck. In the method according to the invention, a heated liquid is supplied through the series of nozzles so as to supply more heat to peripheral regions of a wafer than to central regions.Type: ApplicationFiled: January 14, 2014Publication date: July 16, 2015Applicant: LAM RESEARCH AGInventors: Michael BRUGGER, Karl-Heinz HOHENWARTER, Dieter SPITALER, Gerald ANTON
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Patent number: 8955529Abstract: In a spin-chuck with plural collector levels, a separate exhaust controller is provided for each level. This permits selectively varying gas flow conditions among the collector levels, so that the ambient pressure at one level does not adversely affect device performance in an adjacent level.Type: GrantFiled: January 4, 2010Date of Patent: February 17, 2015Assignee: Lam Research AGInventor: Karl-Heinz Hohenwarter
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Patent number: 8926788Abstract: An improved design for a closed chamber process module for single wafer wet processing utilizes a combination lid and gas showerhead for sealing the chamber from above. One or more media arms dispense liquid onto a wafer in the chamber. The media arms are mounted inside the chamber but are connected by a linkage that passes through the chamber wall to a drive unit mounted outside the chamber.Type: GrantFiled: October 27, 2010Date of Patent: January 6, 2015Assignee: Lam Research AGInventor: Karl-Heinz Hohenwarter
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Publication number: 20140053982Abstract: An apparatus and method for processing wafer-shaped articles features a spin chuck that is axially displaceable between at least two exhaust levels within a surrounding collector. A gas supply system comprises ducts for supplying gas separately to a first interior region of the collector that is above the spin chuck and a second interior region that is below the spin chuck. The pressure differential within the collector above and below the spin chuck can thereby be controlled to prevent cross-contamination between collector levels.Type: ApplicationFiled: August 23, 2012Publication date: February 27, 2014Applicant: LAM RESEARCH AGInventors: Karl-Heinz HOHENWARTER, Reinhold SCHWARZENBACHER
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Publication number: 20140054280Abstract: In an apparatus and process for treating wafer-shaped articles, a spin chuck holds a wafer-shaped article in a predetermined orientation relative to an upper surface of the spin chuck. The apparatus includes a heating assembly having a housing that contains at least one infrared heating element. The heating assembly is mounted above an upper surface of the spin chuck and adjacent a wafer-shaped article when mounted on the spin chuck. The housing comprises a gas inlet connected to a gas supply, and at least one outlet for discharging gas from the housing.Type: ApplicationFiled: August 23, 2012Publication date: February 27, 2014Applicant: LAM RESEARCH AGInventors: Karl-Heinz HOHENWARTER, Vijay BADAM, Christoph SEMMELROCK
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Publication number: 20140026926Abstract: An apparatus and method for treating a wafer-shaped article utilizes a gas supply hood that can be positioned in a working position above a holder so as to cover all or substantially all of a wafer shaped article when positioned on the holder. The gas supply hood accommodates a fluid dispenser for dispensing at least one fluid onto an upper surface of the wafer shaped article positioned on the holder. The gas supply hood permits the fluid dispenser to be moved laterally of the holder and the gas supply hood while the gas supply hood is in the working position and without moving the gas supply hood.Type: ApplicationFiled: July 30, 2012Publication date: January 30, 2014Applicant: LAM RESEARCH AGInventors: Christoph SEMMELROCK, Michael PUGGL, Anders Joel BJOERK, Karl-Heinz HOHENWARTER
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Publication number: 20130061873Abstract: In an apparatus and method for treating a wafer-shaped article, a spin chuck is provided for holding a wafer-shaped article in a predetermined orientation wherein a lower surface of the wafer-shaped article is spaced a predetermined distance from an upper surface of the spin chuck. A heating assembly comprising at least one infrared heater is mounted above the upper surface of the spin chuck and below a wafer-shaped article when mounted on the spin chuck. The heating assembly is stationary in relation to rotation of the spin chuck.Type: ApplicationFiled: September 9, 2011Publication date: March 14, 2013Applicant: LAM RESEARCH AGInventors: Karl-Heinz HOHENWARTER, Lach OTTO
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Publication number: 20130008602Abstract: An apparatus for processing wafer-shaped articles comprises a closed process chamber, a chuck located within the closed process chamber, and at least one process liquid dispensing device disposed within the chamber. The closed process chamber comprises a lid that can be opened to position a wafer-shaped article within the closed process chamber. The lid incorporates a heater adapted to heat a wafer-shaped article positioned in the closed process chamber.Type: ApplicationFiled: July 7, 2011Publication date: January 10, 2013Applicant: LAM RESEARCH AGInventor: Karl-Heinz HOHENWARTER
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Publication number: 20120286481Abstract: A spin chuck and a process of operating the same display improved resistance to backsplash by provision of a media collecting ring mounted on the spin chuck. The media collecting ring surrounds a wafer to be processed and includes a radially-inwardly extending upper portion having an obliquely-angled downwardly-facing surface positioned above an upper surface of a wafer held in the device. The device moreover includes a stationary chamber surrounding the spin chuck equipped with at least two superposed collecting baffles. During treatment, liquid collected by the media collecting ring is preferably discharged radially outwardly through a series of holes formed in the ring, so as to pass between a pair of the superposed collecting baffles of the chamber.Type: ApplicationFiled: May 13, 2011Publication date: November 15, 2012Applicant: LAM RESEARCH AGInventors: Michael PUGGL, Christian AUFEGGER, Karl-Heinz HOHENWARTER
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Publication number: 20120103522Abstract: An improved design for a closed chamber process module for single wafer wet processing utilizes a combination lid and gas showerhead for sealing the chamber from above. One or more media arms dispense liquid onto a wafer in the chamber. The media arms are mounted inside the chamber but are connected by a linkage that passes through the chamber wall to a drive unit mounted outside the chamber.Type: ApplicationFiled: October 27, 2010Publication date: May 3, 2012Applicant: LAM RESEARCH AGInventor: Karl-Heinz HOHENWARTER