Abstract: In an X-Y addressable workpiece positioner the workpiece to be positioned, such as a semiconductive wafer to be aligned with a mask image, is coupled to move with a work stage moveable in X and Y direction and having a two-dimensional array of positioning indicia affixed thereto for movement therewith. An enlarged image of a portion of the positioning array is projected onto a relatively stationary sensor stage to derive an output determinative of the X and Y coordinates of the positioning array relative to the position of the sensor. The sensed X and Y coordinates of the positioning array are compared with the X and Y coordinates of a reference positioning address to derive an error output. The work stage is moved in response to the error output for causing the workpiece to be positioned to the reference address.

Abstract: In an X-Y addressable workpiece positioner the workpiece to be positioned, such as a semiconductive wafer to be aligned with a mask image, is coupled to move with a work stage moveable in X and Y direction and having a two-dimensional array of positioning indicia affixed thereto for movement therewith. An enlarged image of a portion of the positioning array is projected onto a relatively stationary sensor stage to derive an output determinative of the X and Y coordinates of the positioning array relative to the position of the sensor. The sensed X and Y coordinates of the positioning array are compared with the X and Y coordinates of a reference positioning address to derive an error output. The work stage is moved in response to the error output for causing the workpiece to be positioned to the reference address.

Abstract: A step-and-repeat alignment and exposure system is provided with an adjustable holder for holding a main reticle, a main optical unit including a projection lens for producing an image of the main reticle at an image plane, a stage movable along coordinate axes adjacent to the image plane, and a holder rotatably mounted on the stage for holding a semiconductive wafer to be aligned with respect to the image of the main reticle. The system is further provided with an adjustable holder for holding an auxiliary reticle, a single channel auxiliary optical unit including a main objective lens for producing an image of the auxiliary reticle at the image plane, and a reference mark disposed on the stage and aligned with respect to the coordinate axes.

Abstract: A step-and-repeat alignment and exposure system is provided with an adjustable holder for holding a main reticle, a main optical unit including a projection lens for producing an image of the main reticle at an image plane, a stage movable along coordinate axes adjacent to the image plane, and a holder rotatably mounted on the stage for holding a semiconductive wafer to be aligned with respect to the image of the main reticle. The system is further provided with an adjustable holder for holding an auxiliary reticle, a single channel auxiliary optical unit including a main objective lens for producing an image of the auxiliary reticle at the image plane, and a reference mark disposed on the stage and aligned with respect to the coordinate axes.

Abstract: A device is disclosed for use on a projection type semiconductive wafer precision step-and-repeat alignment and exposure system for on-machine inspection of a reticle containing the circuitry to be printed on the wafer. Two apertured optical detectors are aligned with identical portions of the projected image of the reticle and scanned across the image of the reticle. Any difference in the electrical response of the two optical detectors indicates dirt or a flaw in the reticle.

Abstract: In an X-Y addressable workpiece positioner the workpiece to be positioned, such as a semiconductive wafer to be aligned with a mask image, is coupled to move with a work stage moveable in the X-Y direction and having a two-dimensional array of positioning indicia affixed thereto for movement therewith. An enlarged image of a portion of the positioning array is projected onto a relatively stationary sensor stage to derive an output determinative of the X and Y coordinates of the positioning array relative to the position of the sensor. The sensed X and Y coordinates of the positioning array are compared with the X and Y coordinates of a reference positioning address to derive an error output. The work stage is moved in response to the error output for causing the workpiece to be positioned to the reference address.

Abstract: A step-and-repeat alignment and exposure system is provided with a main stage controlled for movement along orthogonal X and Y axes to position either a reference mark or a semiconductive wafer directly beneath a projection lens of the reduction type. The reference mark is formed on a reference mark plate mounted on a substage which is in turn mounted on the main stage and provided with adjustment screws for manually positioning the reference mark plate in a plane parallel to an image plane of the projection lens and for manually positioning the reference mark in alignment with one of the axes of motion of the main stage. Another stage is disposed above the projection lens and controlled for movement along the X and Y axes and about an orthogonal Z axis to position a reticle, held by a vacuum holder and selectively illuminated by a light source unit, with respect to the reference mark.

Abstract: An apparatus for automatically aligning a semiconductor wafer with a mask in the manufacture of integrated circuit devices is disclosed. The mask and wafer are each provided with alignment patterns, the alignment pattern on the wafer cooperating with the alignment pattern on the mask in a unique visual mannner to signify alignment. A scanning mechanism is provided for automatically scanning the alignment pattern areas and producing output signals indicative of the relative positions of the alignment patterns on the wafer and mask. Logic circuitry is provided for operating in response to any misalignment represented by the scan output signals to compute formulae which are utilized to produce control signals for driving motor drive mechanisms to produce relative movement between the mask and wafer to bring them into alignment. Several separate alignment cycles are provided, if needed, for zeroing in on finalized alignment.

Abstract: An apparatus for automatically aligning a semiconductor wafer with a mask in the manufacture of integrated circuit devices is disclosed. The mask and wafer are each provided with alignment patterns, the alignment pattern on the wafer cooperating with the alignment pattern on the mask in a unique visual manner to signify alignment. A scanning mechanism is provided for automatically scanning the alignment pattern areas and producing output signals indicative of the relative positions of the alignment patterns on the wafer and mask. Logic circuitry is provided for operating in response to any misalignment represented by the scan outout signals to compute formulae which are utilized to produce control signals for driving motor drive mechanisms to produce relative movement between the mask and wafer to bring them into alignment. Several separate alignment cycles are provided, if needed, for zeroing in on finalized alignment.

Abstract: An apparatus for automatically aligning a semiconductor wafer with a mask in the manufacture of integrated circuit devices is disclosed. The mask and wafer are each provided with alignment patterns, the alignment pattern on the wafer cooperating with the alignment pattern on the mask in a unique visual manner to signify alignment. A scanning mechanism is provided for automatically scanning the alignment pattern areas and producing output signals indicative of the relative positions of the alignment patterns on the wafer and mask. Logic circuitry is provided for operating in response to any misalignment represented by the scan output signals to compute formulae which are utilized to produce control signals for driving motor drive mechanisms to produce relative movement between the mask and wafer to bring them into alignment. Several separate alignment cycles are provided, if needed, for zeroing in on finalized alignment.

Abstract: A wafer-bearing chuck, an annular reference plate, a copy lens system, and a mask-bearing holder are mounted on a floating unit so that the copy lens system produces an image of a pattern-bearing surface of the mask at a plane positioned between the annular reference plate and the wafer chuck and produces an image of a selected pattern-bearing region of a photosensitive-film-bearing surface of the wafer at the pattern-bearing surface of the mask. The wafer chuck is movably mounted for positioning the photosensitive-film-bearing surface of the wafer in abutment with the annular reference plate in a plane parallel to the image plane of the pattern-bearing surface of the mask and for subsequently positioning the selected pattern-bearing surface region of the wafer in the image plane of the pattern-bearing surface of the mask.

Abstract: An apparatus for automatically aligning a semiconductor wafer with a mask in the manufacture of integrated circuit devices is disclosed. The mask and wafer are each provided with alignment patterns, the alignment pattern on the wafer cooperating with the alignment pattern on the mask in a unique visual manner to signify alignment. A scanning mechanism is provided for automatically scanning the alignment pattern areas and producing output signals indicative of the relative positions of the alignment patterns on the wafer and mask. Logic circuitry is provided for operating in response to any misalignment represented by the scan output signals to compute formulae which are utilized to produce control signals for driving motor drive mechanisms to produce relative movement between the mask and wafer to bring them into alignment. Several separate alignment cycles are provided, if needed, for zeroing in on finalized alignment.

Abstract: A support arm for a wire bonding tool is fixedly mounted at one end on a first horizontal X-Y stage and is attached at the other end to a swing block by a pair of flexible reeds. The wire bonding tool is mounted on the swing block by another pair of flexible reeds. Both pairs of flexible reeds are arranged to permit vertical motion of the wire bonding tool along a Z-axis toward and away from a workpiece supported beneath the wire bonding tool on a second horizontal X-Y stage. A bell crank is coupled between the support arm and the swing block and is operated by a push rod to control the vertical Z-axis motion of the wire bonding tool. The push rod is coupled at one end to the bell crank and at the other end to a lower coupling member rotatably mounted on the first X-Y stage as part of an Oldham coupling mechanism. An upper coupling member of this Oldham coupling mechanism is rotatably mounted on a support bracket adjacent to the first X-Y stage.

Abstract: A wafer-bearing chuck, an annular reference plate, a copy lens system, and a mask-bearing holder are mounted on a floating unit so that the copy lens system produces an image of a pattern-bearing surface of the mask at a plane positioned between the annular reference plate and the wafer chuck and produces an image of a selected pattern-bearing region of a photosensitive-film-bearing surface of the wafer at the pattern-bearing surface of the mask. The wafer chuck is movably mounted for positioning the photosensitive-film-bearing surface of the wafer in abutment with the annular reference plate in a plane parallel to the image plane of the pattern-bearing surface of the mask and for subsequently positioning the selected pattern-bearing surface region of the wafer in the image plane of the pattern-bearing surface of the mask.