Abstract: A method for producing a semiconductor component (166) is proposed.

Abstract: A method for producing a semiconductor component (166) is proposed.

Abstract: A simple and economical method for manufacturing very thin capped MEMS components. In the method, a large number of MEMS units are produced on a component wafer. A capping wafer is then mounted on the component wafer, so that each MEMS unit is provided with a capping structure. Finally, the MEMS units capped in this way are separated to form MEMS components. A diaphragm layer is formed in a surface of the capping wafer by using a surface micromechanical method to produce at least one cavern underneath the diaphragm layer, support points being formed that connect the diaphragm layer to the substrate underneath the cavern. The capping wafer structured in this way is mounted on the component wafer in flip chip technology, so that the MEMS units of the component wafer are capped by the diaphragm layer. The support points are then cut through in order to remove the substrate.

Abstract: In a method is for producing through contacts in thin chips, whose functionality is implemented in a layer structure starting from the surface layer of a semiconductor substrate, to separate these chips, the surface layer is structured using the layer structure and at least one cavity is produced below the surface layer, so that the individual chips are defined by trenches opening into the cavity and the individual chips are connected via support elements in the area of the cavity to the substrate below the cavity. The chips are provided with through contacts, in that firstly a contact hole, which extends through the entire layer structure of the chip and opens into a support element, is produced for each through contact. At least one dielectric layer is applied to the thus structured layer structure and in particular to the wall of the contact holes and structured in accordance with the electrical connections to be created between areas of the chip surface and at least one through contact.

Abstract: A method for manufacturing a micromechanical component and the micromechanical component produced thereby. This component is preferably a diaphragm or a diaphragm layer which is independently produced for the purpose of subsequent assembly with other components.

Abstract: In a method is for producing through contacts in thin chips, whose functionality is implemented in a layer structure starting from the surface layer of a semiconductor substrate, to separate these chips, the surface layer is structured using the layer structure and at least one cavity is produced below the surface layer, so that the individual chips are defined by trenches opening into the cavity and the individual chips are connected via support elements in the area of the cavity to the substrate below the cavity. The chips are provided with through contacts, in that firstly a contact hole, which extends through the entire layer structure of the chip and opens into a support element, is produced for each through contact. At least one dielectric layer is applied to the thus structured layer structure and in particular to the wall of the contact holes and structured in accordance with the electrical connections to be created between areas of the chip surface and at least one through contact.

Abstract: A method for manufacturing a micromechanical component and the micromechanical component produced thereby. This component is preferably a diaphragm or a diaphragm layer which is independently produced for the purpose of subsequent assembly with other components.

Abstract: A simple and economical method for manufacturing very thin capped MEMS components. In the method, a large number of MEMS units are produced on a component wafer. A capping wafer is then mounted on the component wafer, so that each MEMS unit is provided with a capping structure. Finally, the MEMS units capped in this way are separated to form MEMS components. A diaphragm layer is formed in a surface of the capping wafer by using a surface micromechanical method to produce at least one cavern underneath the diaphragm layer, support points being formed that connect the diaphragm layer to the substrate underneath the cavern. The capping wafer structured in this way is mounted on the component wafer in flip chip technology, so that the MEMS units of the component wafer are capped by the diaphragm layer. The support points are then cut through in order to remove the substrate.

Abstract: The invention relates to a method of manufacturing a semiconductor device (10) with a substrate (11) and a semiconductor body (12) comprising silicon which is provided with at least one semiconductor element (T), wherein an epitaxial semiconductor layer (1) comprising silicon is grown on top of a first semiconductor substrate (14), wherein a splitting region (2) is formed in the epitaxial layer (1), wherein a second substrate (11) is attached by wafer bonding to the first substrate (12) at the side of the epitaxial layer (1) provided with the splitting region (2) while an electrically insulating region (3) is interposed between the epitaxial layer (1) and the second substrate (11), the structure thus formed is split at the location of the splitting region (2) as a result of which the second substrate (11) forms the substrate (11) with on top of the insulating region (3) a part (IA) of the epitaxial layer forming the semiconductor body (12) in which the semiconductor element (T) is formed.

Abstract: The present invention relates to an automatic central buffer coupling for a multi-membered vehicle having a coupling head and a signal transmission device for transmitting signals between a first and a second car body. The invention integrates a signal transmission device into the central buffer coupling. The invention includes a coupling element and a counter-coupling element integrated into respective contact plates of adjacent coupling heads such that the face side of the coupling element is arranged opposite the face side of the counter-coupling element. The coupling element and the counter-coupling element each have an antenna member that includes a disc monopole antenna configured to transmit data in the GHz frequency range.

Abstract: The present invention relates to an automatic central buffer coupling (1, 1?) for a multi-membered vehicle, in particular a rail-borne vehicle, having a coupling head (3) and a signal transmission device (2) for transmitting electric and/or electronic signals between a first and a second car body.

Abstract: A reflective liquid crystal display (LCD) device includes a plurality of openings patterned in the pixel metal layer in the peripheral region of the device exposing the insulating layer beneath, a plurality of light-shielding islands beneath the openings in the pixel metal layer, and a plurality of walls formed on the islands surrounding the openings and extending substantially between the islands and the pixel metal layer. A plurality of spacers are disposed on the exposed portions of the insulating layer in the peripheral region for supporting the transparent (e.g., glass) layer above and providing a space for the liquid crystal material. The structure enhances display uniformity by making the spacers formed in the peripheral area more closely match the spacers formed in the pixel area of the device.

Abstract: A reflective liquid crystal display (LCD) device includes a plurality of openings patterned in the pixel metal layer in the peripheral region of the device exposing the insulating layer beneath, a plurality of light-shielding islands beneath the openings in the pixel metal layer, and a plurality of walls formed on the islands surrounding the openings and extending substantially between the islands and the pixel metal layer. A plurality of spacers are disposed on the exposed portions of the insulating layer in the peripheral region for supporting the transparent (e.g., glass) layer above and providing a space for the liquid crystal material. The structure enhances display uniformity by making the spacers formed in the peripheral area more closely match the spacers formed in the pixel area of the device.

Abstract: A reflective liquid crystal display (LCD) device includes a plurality of openings patterned in the pixel metal layer in the peripheral region of the device exposing the insulating layer beneath, a plurality of light-shielding islands beneath the openings in the pixel metal layer, and a plurality of walls formed on the islands surrounding the openings and extending substantially between the islands and the pixel metal layer. A plurality of spacers are disposed on the exposed portions of the insulating layer in the peripheral region for supporting the transparent (e.g., glass) layer above and providing a space for the liquid crystal material. The structure enhances display uniformity by making the spacers formed in the peripheral area more closely match the spacers formed in the pixel area of the device.

Abstract: A reflective liquid crystal display (LCD) device includes a wall substantially extending between a peripheral portion of a first metal layer (pixel metal layer) formed in the peripheral region of the device with a light shield portion of a second metal layer formed in the pixel region of the device. The structure prevents light from reaching the substrate in the peripheral region of the device. Portions of the second metal layer formed in the peripheral region of the device may therefore be used for signal routing.

Abstract: A reflective liquid crystal display (LCD) device includes a plurality of openings patterned in the pixel metal layer in the peripheral region of the device exposing the insulating layer beneath, a plurality of light-shielding islands beneath the openings in the pixel metal layer, and a plurality of walls formed on the islands surrounding the openings and extending substantially between the islands and the pixel metal layer. A plurality of spacers are disposed on the exposed portions of the insulating layer in the peripheral region for supporting the transparent (e.g., glass) layer above and providing a space for the liquid crystal material. The structure enhances display uniformity by making the spacers formed in the peripheral area more closely match the spacers formed in the pixel area of the device.

Abstract: A reflective liquid crystal display (LCD) device includes a wall substantially extending between a peripheral portion of a first metal layer (pixel metal layer) formed in the peripheral region of the device with a light shield portion of a second metal layer formed in the pixel region of the device. The structure prevents light from reaching the substrate in the peripheral region of the device. Portions of the second metal layer formed in the peripheral region of the device may therefore be used for signal routing.

Abstract: A connecting device for connecting two panels, particularly furniture panels, together in a preliminary position. A casing of the connecting device has an overall cylindrical shape. The casing is capable of receiving a bolt head through an enlarged opening into a hollow interior. A portion of an exterior circumferential side wall has a slot which is opened to only one side. The enlarged opening has an elastic narrowing section in which the width of the opening is less than the largest diameter of the bolt head.