Abstract: A photovoltaic module and a method of manufacturing such a module in which metal is deposited in a pattern on the front side of a semiconductor wafer which acts as an electrode. Photovoltaic cells manufactured using a semiconductor wafer typically have a P type semiconductor region and an N type semiconductor region. The metal on the front side of each of the photovoltaic cells forms an electrical connection to the doped layer of the semiconductor wafer on its front side.

Abstract: A method for advanced recognition and detection of persons and objects comprises providing an intelligent video recognition system including a plurality of video cameras having advanced recognition methods associated therewith, providing a location awareness system with active emitting tags and including one or more receiver antennas, detecting outlier persons or objects by processing intermediate data output from the intelligent video recognition system and location awareness system with output from a master database to generate relevant and focused alert data through comparing spatial information, classifying the alert data as alerts or allowed events based on business logic described in a rule engine, displaying the alert data along with primary video stream and active emitting tag data in real-time in a user visualization engine, and allowing the relevant and focused alert data to be replayed and displayed in the user visualization engine at a future time.

Abstract: A method of coating of thin film coated magnetic disks and thin film magnetic disks made thereby is described. In accordance with the invention, a barrier layer is deposited on the substrate before the underlayer film(s) to increase the corrosion resistance of metallic substrate magnetic disks and, in the case of nonmetallic substrates, to reduce the diffusion of water to the substrate and of freely moveable ions from the substrate. Preferably the barrier layer is deposited by medium frequency pulsed sputtering at a frequency of 10 to 200 kHz and a pulse length to pulse pause ratio from 5:1 to 1:10. Aluminum or chromium are the preferred materials for the barrier layer. Additional improvements may be achieved where the sputtering process gas contains a proportion of oxygen and/or nitrogen.