Patents by Inventor Karl-Heinz Malek

Karl-Heinz Malek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8154049
    Abstract: An ESD protection apparatus includes a substrate, a transistor structure arranged in the substrate, and a diode structure arranged in the substrate, a high-resistance electrical connection being provided between the transistor structure and the diode structure in the substrate.
    Type: Grant
    Filed: August 2, 2010
    Date of Patent: April 10, 2012
    Assignee: Infineon Technologies AG
    Inventors: Sven Albers, Klaus Diefenbeck, Bernd Eisener, Gernot Langguth, Christian Lehrer, Karl-Heinz Malek, Eberhard Rohrer
  • Patent number: 7888703
    Abstract: An ESD protection apparatus includes a substrate, a transistor structure arranged in the substrate, and a diode structure arranged in the substrate, a high-resistance electrical connection being provided between the transistor structure and the diode structure in the substrate.
    Type: Grant
    Filed: February 8, 2008
    Date of Patent: February 15, 2011
    Assignee: Infineon Technologies AG
    Inventors: Sven Albers, Klaus Diefenbeck, Bernd Eisener, Gernot Langguth, Christian Lehrer, Karl-Heinz Malek, Eberhard Rohrer
  • Publication number: 20100295094
    Abstract: An ESD protection apparatus includes a substrate, a transistor structure arranged in the substrate, and a diode structure arranged in the substrate, a high-resistance electrical connection being provided between the transistor structure and the diode structure in the substrate.
    Type: Application
    Filed: August 2, 2010
    Publication date: November 25, 2010
    Inventors: Sven Albers, Klaus Diefenbeck, Bernd Eisener, Gernot Langguth, Christian Lehrer, Karl-Heinz Malek, Eberhard Rohrer
  • Publication number: 20080192395
    Abstract: An ESD protection apparatus includes a substrate, a transistor structure arranged in the substrate, and a diode structure arranged in the substrate, a high-resistance electrical connection being provided between the transistor structure and the diode structure in the substrate.
    Type: Application
    Filed: February 8, 2008
    Publication date: August 14, 2008
    Inventors: Sven Albers, Klaus Diefenbeck, Bernd Eisener, Gernot Langguth, Christian Lehrer, Karl-Heinz Malek, Eberhard Rohrer