Abstract: The present invention relates to an electronic device, comprising a fingerprint sensor configured to capture an image of a fingerprint of a finger positioned on a sensor surface of the fingerprint sensor, the fingerprint sensor comprising a sensing array comprising a plurality of sensing elements, and connection pads for electrical connection to external fingerprint sensor control circuitry; and a protective plate for protecting the fingerprint sensor, the protective plate comprising conductive traces for connecting the fingerprint sensor to the external fingerprint sensor control circuitry, wherein the fingerprint sensor is attached to an underside of the protective plate and wherein the connection pads of the fingerprint sensor are mechanically and electrically connected to the conductive traces of the protective plate.

Abstract: There is provided a capacitive fingerprint sensing device for sensing a fingerprint pattern of a finger, said capacitive fingerprint sensing device comprising: a protective top layer to be touched by said finger; a first metal layer comprising a two-dimensional array of sensing structures arranged underneath said top layer; a second metal layer, arranged underneath said first metal layer, comprising a plurality of conductive structures a dielectric layer arranged between the first and second metal layers to electrically insulate the first metal layer from the second metal layer, the dielectric layer comprising a low-k material; and readout circuitry arranged underneath said second metal layer and coupled to each of the electrically conductive sensing structures by means of via connections to receive a sensing signal indicative of a distance between said finger and said sensing structure. There is also provided a method for manufacturing such a device.

Abstract: The invention relates to a fingerprint sensing device comprising a sensing chip comprising an array of capacitive sensing elements. The sensing device comprises a coating material arranged in a layer on top of the array of sensing elements, the coating material comprising a plurality of cavities filled with a mold material; wherein locations of the cavities correspond to locations of the sensing elements, such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element; and wherein a dielectric constant of the mold material is higher than a dielectric constant of the coating material. The invention also relates to a method for manufacturing such a device.

Abstract: The invention relates to a fingerprint sensing device comprising: a sensing chip comprising an array of sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of the sensing elements and a finger placed on a sensing surface of the sensing device. A surface of the sensing elements defines a sensing plane. The sensing device further comprises a plurality of interposer structures arranged on the sensing chip extending above sensing plane, wherein the plurality of interposer structures have the same height above the sensing plane. A protective plate is attached to the sensing chip by means of an adhesive, and the protective plate rests on the interposer structures such that a distance between the protective plate and the sensing plane is defined by the height of the interposer structures.

Abstract: There is provided a capacitive fingerprint sensing device for sensing a fingerprint pattern of a finger, said capacitive fingerprint sensing device comprising: a protective top layer to be touched by said finger; a first metal layer comprising a two-dimensional array of sensing structures arranged underneath said top layer; a second metal layer, arranged underneath said first metal layer, comprising a plurality of conductive structures a dielectric layer arranged between the first and second metal layers to electrically insulate the first metal layer from the second metal layer, the dielectric layer comprising a low-k material; and readout circuitry arranged underneath said second metal layer and coupled to each of the electrically conductive sensing structures by means of via connections to receive a sensing signal indicative of a distance between said finger and said sensing structure. There is also provided a method for manufacturing such a device.

Abstract: The invention relates to a fingerprint sensing device comprising a sensing chip comprising an array of capacitive sensing elements. The sensing device comprises a coating material arranged in a layer on top of the array of sensing elements and comprising a plurality of cavities filled with a dielectric material. The dielectric material comprises reduced graphene oxide. Locations of the cavities correspond to locations of the sensing elements such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element. A dielectric constant of the dielectric material is higher than a dielectric constant of the coating material. The invention also relates to a sensing device where the dielectric coating layer containing reduced graphene oxide comprises trenches corresponding to areas between the sensing pixels filled with a fill material, where the dielectric coating layer has a higher dielectric constant than the fill material.

Abstract: The invention relates to a fingerprint sensing device comprising: a sensing chip comprising an array of sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of the sensing elements and a finger placed on a sensing surface of the sensing device. A surface of the sensing elements defines a sensing plane. The sensing device further comprises a plurality of interposer structures arranged on the sensing chip extending above sensing plane, wherein the plurality of interposer structures have the same height above the sensing plane. A protective plate is attached to the sensing chip by means of an adhesive, and the protective plate rests on the interposer structures such that a distance between the protective plate and the sensing plane is defined by the height of the interposer structures.

Abstract: The invention relates to a fingerprint sensing device comprising: a sensing chip comprising an array of sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of the sensing elements and a finger placed on a sensing surface of the sensing device. A surface of the sensing elements defines a sensing plane. The sensing device further comprises a plurality of interposer structures arranged on the sensing chip extending above sensing plane, wherein the plurality of interposer structures have the same height above the sensing plane. A protective plate is attached to the sensing chip by means of an adhesive, and the protective plate rests on the interposer structures such that a distance between the protective plate and the sensing plane is defined by the height of the interposer structures.

Abstract: The invention relates to a fingerprint sensing device comprising: a sensing chip comprising an array of sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of the sensing elements and a finger placed on a sensing surface of the sensing device. A surface of the sensing elements defines a sensing plane. The sensing device further comprises a plurality of interposer structures arranged on the sensing chip extending above sensing plane, wherein the plurality of interposer structures have the same height above the sensing plane. A protective plate is attached to the sensing chip by means of an adhesive, and the protective plate rests on the interposer structures such that a distance between the protective plate and the sensing plane is defined by the height of the interposer structures.

Abstract: The invention relates to a fingerprint sensing device comprising: a sensing chip comprising an array of sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of the sensing elements and a finger placed on a sensing surface of the sensing device. A surface of the sensing elements define a sensing plane. The sensing device further comprises a plurality of interposer structures arranged on the sensing chip extending above sensing plane, wherein the plurality of interposer structures have the same height above the sensing plane. A protective plate is attached to the sensing chip by means of an adhesive, and the protective plate rests on the interposer structures such that a distance between the protective plate and the sensing plane is defined by the height of the interposer structures.

Abstract: A fingerprint sensing device comprising sensing circuitry comprising a plurality of sensing elements, each sensing element comprising a sensing structure arranged in a sensing plane and facing a surface of the capacitive fingerprint sensing device, each of the sensing elements being configured to provide a signal indicative of an electromagnetic coupling between the sensing structure and a finger placed on the surface of the fingerprint sensing device; and a plurality of connection pads electrically connected to the sensing circuitry for providing an electrical connection between the sensing circuitry and readout circuitry, wherein each of the connection pads is separately recessed in relation to the sensing plane such that each connection pad has a floor in a floor plane, and wherein each connection pad is separated from an adjacent connection pad through a portion of the sensing device being elevated in relation to the floor plane.

Abstract: A fingerprint sensing device (and associated method of manufacturing) comprises a sensing chip arranged on a substrate with readout circuitry. The sensing chip comprising a plurality of sensing elements having a surface defining a sensing plane, each sensing element being configured to provide a signal indicative of an electromagnetic coupling between a sensing element and a finger placed on the sensing device; bond wires arranged between bond pads located on the sensing chip on the substrate, respectively, to electrically connect the sensing chip to the readout circuitry. A portion of the bond wire protrudes above the chip and an adhesive is arranged on the sensing chip to covering to cover the chip so that the portion of the bond wire protruding above the chip is embedded in the adhesive. A protective plate is attached to the sensing chip by the adhesive and forms an exterior surface of the device.

Abstract: The invention relates to a fingerprint sensing device comprising: a sensing chip comprising an array of sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of the sensing elements and a finger placed on a sensing surface of the sensing device, wherein a surface of the sensing elements define a sensing plane; a plurality of interposer structures arranged on the sensing chip extending above sensing plane, wherein the plurality of interposer structures have substantially the same height above the sensing plane; and a protective plate attached to the sensing chip by means of an adhesive arranged on the sensing chip, wherein the protective plate rests on the interposer structures such that a distance between the protective plate and the sensing plane is defined by the height of the interposer structures.

Abstract: The invention relates to a fingerprint sensing device comprising a sensing chip comprising an array of capacitive sensing elements. The sensing device comprises a coating material arranged in a layer on top of the array of sensing elements, the coating material comprising a plurality of cavities filled with a mold material; wherein locations of the cavities correspond to locations of the sensing elements, such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element; and wherein a dielectric constant of the mold material is higher than a dielectric constant of the coating material. The invention also relates to a method for manufacturing such a device.

Abstract: A fingerprint sensing device comprises a sensing chip comprising an array of capacitive sensing elements. The sensing device comprises a coating material arranged in a layer on top of the array of sensing elements, the coating material comprising a plurality of cavities filled with an adhesive; wherein locations of the cavities correspond to locations of the sensing elements, such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element; and wherein a dielectric constant of the adhesive is higher than a dielectric constant of the coating material; and a protective plate attached to the sensing chip by means of the adhesive. Another sensing device is disclosed, where the coating layer comprises trenches filled with an adhesive, and where the coating has a higher dielectric constant than the adhesive. Associated methods of manufacturing are also disclosed.

Abstract: A fingerprint sensing device comprises a sensing chip comprising an array of capacitive sensing elements. The sensing device comprises a coating material arranged in a layer on top of the array of sensing elements, the coating material comprising a plurality of cavities filled with an adhesive; wherein locations of the cavities correspond to locations of the sensing elements, such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element; and wherein a dielectric constant of the adhesive is higher than a dielectric constant of the coating material; and a protective plate attached to the sensing chip by means of the adhesive. Another sensing device is disclosed, where the coating layer comprises trenches filled with an adhesive, and where the coating has a higher dielectric constant than the adhesive. Associated methods of manufacturing are also disclosed.

Abstract: A sensing device comprising a plurality of sensing elements, each of the sensing elements being configured to provide a signal indicative of an electromagnetic coupling between the sensing element and a finger placed on a surface of the sensing device, a first layer arranged to cover the plurality of sensing elements, the first layer comprising a plurality of recesses, and a second layer arranged to cover the first layer, the second layer having hydrophobic surface properties. There is also provided a method for manufacturing such a sensing device.

Abstract: A fingerprint sensing device comprising sensing circuitry comprising a plurality of sensing elements, each sensing element comprising a sensing structure arranged in a sensing plane and facing a surface of the capacitive fingerprint sensing device, each of the sensing elements being configured to provide a signal indicative of an electromagnetic coupling between the sensing structure and a finger placed on the surface of the fingerprint sensing device; and a plurality of connection pads electrically connected to the sensing circuitry for providing an electrical connection between the sensing circuitry and readout circuitry, wherein each of the connection pads is separately recessed in relation to the sensing plane such that each connection pad has a floor in a floor plane, and wherein each connection pad is separated from an adjacent connection pad through a portion of the sensing device being elevated in relation to the floor plane.

Abstract: A fingerprint sensing device (and associated method of manufacturing) comprises a sensing chip arranged on a substrate with readout circuitry. The sensing chip comprising a plurality of sensing elements having a surface defining a sensing plane, each sensing element being configured to provide a signal indicative of an electromagnetic coupling between a sensing element and a finger placed on the sensing device; bond wires arranged between bond pads located on the sensing chip on the substrate, respectively, to electrically connect the sensing chip to the readout circuitry. A portion of the bond wire protrudes above the chip and an adhesive is arranged on the sensing chip to covering to cover the chip so that the portion of the bond wire protruding above the chip is embedded in the adhesive. A protective plate is attached to the sensing chip by the adhesive and forms an exterior surface of the device.

Abstract: A sensing device comprising a plurality of sensing elements, each of the sensing elements being configured to provide a signal indicative of an electromagnetic coupling between the sensing element and a finger placed on a surface of the sensing device, a first layer arranged to cover the plurality of sensing elements, the first layer comprising a plurality of recesses, and a second layer arranged to cover the first layer, the second layer having hydrophobic surface properties. There is also provided a method for manufacturing such a sensing device.