Abstract: A method for dispensing underfill material between a flip chip bonded to substrate. The method requires an underfill injection port to be drilled through the substrate prior to reflow such that underfill material can be dispensed between the flip chip and substrate through the port. After reflow is completed, a pressurized pump delivers a predetermined amount of underfill under hydraulic pressure through the underfill injection port between the flip chip and substrate. Once injected, the underfill migrates between the flip chip and substrate via capillary action pushing out any air around the joints.