Patents by Inventor Karl Mayer

Karl Mayer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10525003
    Abstract: The invention provides a topical liquid antifungal composition containing an antifungal agent, a film-forming agent and a solvent. The composition is applied on the infected skin area to form a film that delivers the active agent. The invention also provides a method for treating a fungal infection on the skin by applying the topical antifungal composition that forms a film on the skin.
    Type: Grant
    Filed: September 27, 2006
    Date of Patent: January 7, 2020
    Assignee: GSK CONSUMER HEALTHCARE S.A.
    Inventor: Friedrich Karl Mayer
  • Patent number: 10443022
    Abstract: The present invention is a solid fabric care composition comprising a water-soluble carrier, a water-soluble polymer, a fabric care compound, a polysaccharide and a fragrance, wherein the water-soluble carrier is in particle form, having a coating comprising the water-soluble polymer and the fragrance, and a mixture of the fabric care compound and the polysaccharide being incorporated at least partly into the coating, or the coating of the water-soluble carrier being coated at least partly with a mixture of the fabric care compound and the polysaccharide. Also described herein are fabric care washing or cleaning products comprising the fabric care compositions.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: October 15, 2019
    Assignee: Henkel AG & Co. KGaA
    Inventors: Noelle Wrubbel, Karl-Heinz Scheffler, Daniel Tigges, Rene-Andres Artiga Gonzalez, Matthias Sunder, Mario Sturm, Tobias Segler, Konstanze Mayer
  • Publication number: 20190252095
    Abstract: The invention relates to an electrically conductive contact element (2) for an electric plug connector. The electrically conductive contact element (2) comprises a contact region (4) for making detachable electric contact with a mating contact element of a mating plug connector, and comprises a cable connecting region (6) for the connection of a cable. The contact element (2) comprises a cooling cavity (24), which opens into a distal opening (22) of the cable connecting region (6) which is arranged opposite the contact region (4).
    Type: Application
    Filed: August 31, 2017
    Publication date: August 15, 2019
    Applicant: ITT MANUFACTURING ENTERPRISE LLC
    Inventors: STEFAN MAYER, MARTIN LITTEK, KARL FRIEDRICH ALBRECHT, MARCUS BIHRER, ANDREAS ZIMMERMANN
  • Publication number: 20190221480
    Abstract: The invention relates to methods of processing a wafer, having on one side a device area with a plurality of devices. In particular, the invention relates to a method which comprises providing a protective film, and applying the protective film to the side of the wafer being opposite to the one side, so that at least a central area of a front surface of the protective film is in direct contact with the side of the wafer being opposite to the one side. The method further comprises applying an external stimulus to the protective film during and/or after applying the protective film to the side of the wafer being opposite to the one side, so that the protective film is attached to the side of the wafer being opposite to the one side, and processing the one side of the wafer and/or the side of the wafer being opposite to the one side.
    Type: Application
    Filed: January 15, 2019
    Publication date: July 18, 2019
    Inventors: Karl Heinz PRIEWASSER, Hitoshi HOSHINO, Dietmar MAYER
  • Patent number: 10356964
    Abstract: Examples described herein include an electromagnetic interference shield. In some examples, the electromagnetic interference shield includes a wall comprised of a conductive material. The wall may have a first surface, a second surface, and a thickness between the first surface and the second surface. The shield may include a rounded opening in the wall that creates an air passageway through the thickness of the wall. The shield may also include a first obstruction in the opening and a second obstruction in the opening. The first obstruction may span across the opening. The second obstruction may span across the opening and intersect the first obstruction. The first obstruction and the second obstruction may be waveguide structures.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: July 16, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Elene Chobanyan, Karl J. Bois, Dave Mayer, Arlen L. Roesner
  • Publication number: 20190148233
    Abstract: A system and method for manufacturing a packaged component are disclosed. An embodiment comprises forming a plurality of components on a carrier, the plurality of components being separated from each other by kerf regions on a front side of the carrier and forming a metal pattern on a backside of the carrier, wherein the metal pattern covers the backside of the carrier except over regions corresponding to the kerf regions. The method further comprises generating the component by separating the carrier.
    Type: Application
    Filed: January 15, 2019
    Publication date: May 16, 2019
    Inventors: Karl Mayer, Evelyn Napetschnig, Michael Pinczolits, Michael Sternad, Michael Roesner
  • Patent number: 10186458
    Abstract: A system and method for manufacturing a packaged component are disclosed. An embodiment comprises forming a plurality of components on a carrier, the plurality of components being separated from each other by kerf regions on a front side of the carrier and forming a metal pattern on a backside of the carrier, wherein the metal pattern covers the backside of the carrier except over regions corresponding to the kerf regions. The method further comprises generating the component by separating the carrier.
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: January 22, 2019
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Karl Mayer, Evelyn Napetschnig, Michael Pinczolits, Michael Sternad, Michael Roesner
  • Patent number: 10157765
    Abstract: Methods for processing a semiconductor workpiece can include providing a semiconductor workpiece that includes one or more kerf regions; forming one or more trenches in the workpiece by removing material from the one or more kerf regions from a first side of the workpiece; mounting the workpiece with the first side to a carrier; thinning the workpiece from a second side of the workpiece; and forming a metallization layer over the second side of the workpiece.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: December 18, 2018
    Assignee: Infineon Technologies AG
    Inventors: Gudrun Stranzl, Martin Zgaga, Rainer Leuschner, Bernhard Goller, Bernhard Boche, Manfred Engelhardt, Hermann Wendt, Bernd Noehammer, Karl Mayer, Michael Roesner, Monika Cornelia Voerckel
  • Patent number: 9935060
    Abstract: A method for processing a wafer in accordance with various embodiments may include: removing wafer material from an inner portion of the wafer to form a structure at an edge region of the wafer to at least partially surround the inner portion of the wafer, and printing material into the inner portion of the wafer using the structure as a printing mask. A method for processing a wafer in accordance with various embodiments may include: providing a carrier and a wafer, the wafer having a first side and a second side opposite the first side, the first side of the wafer being attached to the carrier, the second side having a structure at an edge region of the wafer, the structure at least partially surrounding an inner portion of the wafer; and printing material onto at least a portion of the second side of the wafer.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: April 3, 2018
    Assignee: Infineon Technologies AG
    Inventors: Srinivasa Reddy Yeduru, Karl Heinz Gasser, Stefan Woehlert, Karl Mayer, Francisco Javier Santos Rodriguez
  • Patent number: 9917333
    Abstract: A lithium ion battery includes a first substrate having a first main surface, and a lid including an insulating material. The lid is attached to the first main surface of the first substrate, and a cavity is defined between the first substrate and the lid. The lithium ion battery further includes an electrical interconnection element in the lid, the electrical interconnection element providing an electrical connection between a first main surface and a second main surface of the lid. The lithium ion battery further includes an electrolyte in the cavity, an anode at the first substrate, the anode including a component made of a semiconductor material, and a cathode at the lid.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: March 13, 2018
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Vijaye Kumar Rajaraman, Kamil Karlovsky, Thomas Neidhart, Karl Mayer, Rainer Leuschner, Christine Moser, Ravi Keshav Joshi, Alexander Breymesser, Bernhard Goller, Francisco Javier Santos Rodriguez, Peter Zorn
  • Publication number: 20170154857
    Abstract: A method for processing a wafer in accordance with various embodiments may include: removing wafer material from an inner portion of the wafer to form a structure at an edge region of the wafer to at least partially surround the inner portion of the wafer, and printing material into the inner portion of the wafer using the structure as a printing mask. A method for processing a wafer in accordance with various embodiments may include: providing a carrier and a wafer, the wafer having a first side and a second side opposite the first side, the first side of the wafer being attached to the carrier, the second side having a structure at an edge region of the wafer, the structure at least partially surrounding an inner portion of the wafer; and printing material onto at least a portion of the second side of the wafer.
    Type: Application
    Filed: February 13, 2017
    Publication date: June 1, 2017
    Inventors: Srinivasa Reddy Yeduru, Karl Heinz Gasser, Stefan Woehlert, Karl Mayer, Francisco Javier Santos Rodriguez
  • Publication number: 20170076970
    Abstract: Methods for processing a semiconductor workpiece can include providing a semiconductor workpiece that includes one or more kerf regions; forming one or more trenches in the workpiece by removing material from the one or more kerf regions from a first side of the workpiece; mounting the workpiece with the first side to a carrier; thinning the workpiece from a second side of the workpiece; and forming a metallization layer over the second side of the workpiece.
    Type: Application
    Filed: November 23, 2016
    Publication date: March 16, 2017
    Inventors: Gudrun Stranzl, Martin Zgaga, Rainer Leuschner, Bernhard Goller, Bernhard Boche, Manfred Engelhardt, Hermann Wendt, Bernd Noehammer, Karl Mayer, Michael Roesner, Monika Cornelia Voerckel
  • Patent number: 9589880
    Abstract: A method for processing a wafer in accordance with various embodiments may include: removing wafer material from an inner portion of the wafer to form a structure at an edge region of the wafer to at least partially surround the inner portion of the wafer, and printing material into the inner portion of the wafer using the structure as a printing mask. A method for processing a wafer in accordance with various embodiments may include: providing a carrier and a wafer, the wafer having a first side and a second side opposite the first side, the first side of the wafer being attached to the carrier, the second side having a structure at an edge region of the wafer, the structure at least partially surrounding an inner portion of the wafer; and printing material onto at least a portion of the second side of the wafer.
    Type: Grant
    Filed: October 9, 2013
    Date of Patent: March 7, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Srinivasa Reddy Yeduru, Karl Heinz Gasser, Stefan Woehlert, Karl Mayer, Francisco Javier Santos Rodriguez
  • Publication number: 20150280288
    Abstract: A lithium ion battery includes a first substrate having a first main surface, and a lid including an insulating material. The lid is attached to the first main surface of the first substrate, and a cavity is defined between the first substrate and the lid. The lithium ion battery further includes an electrical interconnection element in the lid, the electrical interconnection element providing an electrical connection between a first main surface and a second main surface of the lid. The lithium ion battery further includes an electrolyte in the cavity, an anode at the first substrate, the anode including a component made of a semiconductor material, and a cathode at the lid.
    Type: Application
    Filed: March 31, 2014
    Publication date: October 1, 2015
    Inventors: Vijaye Kumar Rajaraman, Kamil Karlovsky, Thomas Neidhart, Karl Mayer, Rainer Leuschner, Christine Moser, Ravi Keshav Joshi, Alexander Breymesser, Bernhard Goller, Francisco Javier Santos Rodriguez, Peter Zorn
  • Publication number: 20150147850
    Abstract: Methods for processing a semiconductor workpiece can include providing a semiconductor workpiece that includes one or more kerf regions; forming one or more trenches in the workpiece by removing material from the one or more kerf regions from a first side of the workpiece; mounting the workpiece with the first side to a carrier; thinning the workpiece from a second side of the workpiece; and forming a metallization layer over the second side of the workpiece.
    Type: Application
    Filed: November 25, 2013
    Publication date: May 28, 2015
    Applicant: Infineon Technologies AG
    Inventors: Gudrun Stranzl, Martin Zgaga, Rainer Leuschner, Bernhard Goller, Bernhard Boche, Manfred Engelhardt, Hermann Wendt, Bernd Noehammer, Karl Mayer, Michael Roesner, Monika Cornelia Voerckel
  • Publication number: 20150097294
    Abstract: A method for processing a wafer in accordance with various embodiments may include: removing wafer material from an inner portion of the wafer to form a structure at an edge region of the wafer to at least partially surround the inner portion of the wafer, and printing material into the inner portion of the wafer using the structure as a printing mask. A method for processing a wafer in accordance with various embodiments may include: providing a carrier and a wafer, the wafer having a first side and a second side opposite the first side, the first side of the wafer being attached to the carrier, the second side having a structure at an edge region of the wafer, the structure at least partially surrounding an inner portion of the wafer; and printing material onto at least a portion of the second side of the wafer.
    Type: Application
    Filed: October 9, 2013
    Publication date: April 9, 2015
    Applicant: Infineon Technologies AG
    Inventors: Srinivasa Reddy Yeduru, Karl Heinz Gasser, Stefan Woehlert, Karl Mayer, Francisco Javier Santos Rodriguez
  • Publication number: 20140008805
    Abstract: A system and method for manufacturing a packaged component are disclosed. An embodiment comprises forming a plurality of components on a carrier, the plurality of components being separated from each other by kerf regions on a front side of the carrier and forming a metal pattern on a backside of the carrier, wherein the metal pattern covers the backside of the carrier except over regions corresponding to the kerf regions. The method further comprises generating the component by separating the carrier.
    Type: Application
    Filed: July 5, 2012
    Publication date: January 9, 2014
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Karl Mayer, Evelyn Napetschnig, Michael Pinczolits, Michael Sternad, Michael Roesner
  • Patent number: 8603910
    Abstract: In various embodiments, a method of processing a contact pad may include providing a contact pad, a topmost layer of the contact pad containing aluminum or an aluminum alloy, at least part of the topmost layer of the contact pad being exposed; subjecting the contact pad to a thermally activated atmosphere containing water or reactive components of water.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: December 10, 2013
    Assignee: Infineon Technologies AG
    Inventors: Marco Koitz, Guenter Zieger, Christian Krenn, Franz Kleinbichler, Guenther Zoth, Karl Mayer
  • Publication number: 20130180945
    Abstract: In various embodiments, a method of processing a contact pad may include providing a contact pad, a topmost layer of the contact pad containing aluminum or an aluminum alloy, at least part of the topmost layer of the contact pad being exposed; subjecting the contact pad to a thermally activated atmosphere containing water or reactive components of water.
    Type: Application
    Filed: January 13, 2012
    Publication date: July 18, 2013
    Applicant: Infineon Technologies AG
    Inventors: Marco Koitz, Guenter Zieger, Christian Krenn, Franz Kleinbichler, Guenther Zoth, Karl Mayer
  • Publication number: 20110237547
    Abstract: Synergistic combinations of a squalene epoxidase inhibitor and a leucyl-tRNA synthetase inhibitor are provided, which are useful in particular in the treatment of diseases involving fungal or suspected fungal infection, for immunomodulation or immunosuppression in conditions in which fungal or suspected fungal colonisation of e.g. the skin or nail plays a role, such as atopic dermatitis, acne vulgaris, seborrhoeic dermatitis, rosacea or onychomycosis, and in situations of fungal resistance.
    Type: Application
    Filed: June 7, 2011
    Publication date: September 29, 2011
    Inventor: Friedrich Karl Mayer