Abstract: A holding element with a holding clip for holding a carrier board is soldered freestanding to a printed circuit board (PCB). The holding element has first and second holding arms that extend from a supporting region and form a receiving region therebetween. The first holding arm is connected to a first leg and the second holding arm is connected to a second leg. The first and second legs each have a base in an end region. At least one of the legs has a curved surface in the region of the base so that the holding element can be soldered to the PCB. The holding element being made of a strip material, and the first and second holding arms each having an outward bend forming a transition into the first and second legs, respectively.

Abstract: Holding element with a holding clip, arrangement with a carrier board and a holding element, and aA holding element (2) with a holding clip, an arrangement of a holding element (2) with a carrier board (32) and an arrangement of a holding element with a carrier strip are described, the carrier strip and the holding element being of integral construction. Advantageously, the holding element has two legs, with which a holding clip can be placed on a carrier board. In this way, a stable holding element is produced, which stands without further assistance on a base-board and can hence be easily soldered.

Abstract: A hybrid circuit with a heat dissipation system includes a terminal arrangement wherein at least one of the connecting pins (5) to solder the hybrid circuit (1) on a printed board has a heat transition resistance to the hybrid circuit (1), which is greater in relation to the other connecting pins (2) in such a way that the connecting pin (5) does not reach the melting temperature of the solder used at a given power level.

Abstract: A plate-shaped ceramic circuit substrate (6), which is adapted to be vertically mounted on a mother board, has near a lower edge (7) thereof a series of contact areas (solder pads) (1) for contacting the circuit with terminals of the mother board. For improved solderability also in case of small contact area (1), these contact areas extend down as far as the lower edge (7), and there is provided one recess (2) each which constitutes a solder deposit (3) and which extends through the circuit substrate (6) and runs from the lower face side (5) of the circuit substrate (6) upwardly into the respective contact area (1).

Abstract: Hybrid circuit arrangement having a resistance layer applied at least on one side of a plate-shaped substrate of glass or ceramic and having at least one overload protection arranged on the substrate that is electrically connected to the resistance layer, whereby the protection is formed by a PTC resistor. As a result thereof, the hybrid circuit arrangement is re-employable with the self-restoring fuse even after an overload malfunction.

Abstract: Terminal pins with two lateral portions and a bridge-shaped elevated middle portion are provided. The terminal pin and perpendicularly rising hybrid circuit typically together have an inverted T shape. On the one hand, the hybrid circuit stands on its own on the substrate without further means of assistance and can be soldered. On the other hand, the bridge-shaped construction effects a sufficient elasticity and carrying capacity relative to swivellings, or respectively, accelerations, as well as effecting the presence of two defined support surfaces whose co-planarity is guaranteed by the springing configuration of the terminal pins.