Abstract: The method (400, 500) and device (200) for reworkable direct chip attachment include a thermal-mechanical and mechanical stable solder joint for arranging connection pads on a top surface of the circuit board to facilitate connection for electronic elements, and affixing a reinforcement having apertures to accommodate solder joints to the top surface of the circuit board to facilitate solder attachment of the connection pads to the electronic elements wherein the reinforcement constrains deformation of the circuit board to provide reliable solder joints and facilitates attachment and removal of electronic elements from the circuit board.

Abstract: A microelectronic assembly (10) includes an integrated circuit die (12) that is mounted to a printed circuit board (14). The integrated circuit die (12) overlies the printed circuit board (14) and includes an active face (26) that faces the printed circuit board (14) and is spaced apart therefrom by a gap (30). A plurality of solder bump interconnections (32) extend across the gap (30) and connect a plurality of board bond pads (22) with a plurality of die bond pads (28). A polymeric precursor (13) is dispensed onto the printed circuit board (14) about the integrated circuit die (12) and is curable to form a polymeric encapsulant (16). The polymeric precursor (13) is drawn into the gap (30) and forms a fillet (34) overlying the printed circuit board (14). A frame (18) is embedded in the fillet (34), not in direct contact with the board (14), and the polymeric precursor (13) is heated to cure the polymeric precursor (13) to form a polymeric encapsulant (16).

Abstract: The present invention provides a method, article of manufacture, and optical package (24) for eliminating tilt angle (40) between an optical emitter (26) mounted on a carrier (28). The method, article of manufacture, and optical package (24) include a carrier (28) having a top surface (42) with a cavity (46) formed therein, an adhesive material (38) inserted into the cavity (46), and an optical emitter (26) placed on the top surface (42) of the carrier (28) and at least partially covering the cavity (46), thereby providing at least one egress point for overflowing said adhesive material therefrom.

Abstract: The present invention provides a method (600) and device (400) for minimizing wind-induced noise in a microphone. The device includes: a housing (412) having a recessed area shaped to accommodate a microphone transducer (410); the microphone transducer (410), situated within the recessed area such that a thin film situated over the microphone transducer is flush with/overlaying a top of the recessed area and affixed at least to the sides of the recessed area, for receiving sound; and the thin film (402) has at least one aperture (404, . . . 406) for allowing sound to impinge on the microphone transducer (410), and has a minimal thickness that maintains structural integrity.

Abstract: A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) by solder bump interconnections (32). The die (12) and the substrate (14) are spaced apart by a gap (30) that is filled with a polymeric encapsulant (16). The die (12) includes a die perimeter (24) and a face (27) facing away from the substrate (14). A polymeric reinforcement (18) is disposed onto the die face (27) to protect the die (12) and to reduce the effects of thermally induced stresses on the die (12) and the solder bump interconnections (32). The polymeric reinforcement (18) is spaced apart from the die perimeter (24) to maintain a desired peripheral fillet geometry of the encapsulant (16).

Abstract: A micro-turbo generator device (10) includes a housing (12), a rotor (14), a plurality of stator cores (16), and coils (18) encircling the stator cores. The housing (12) includes a shaft (34) which has an axis (11). The rotor (14) is rotatably mounted onto the shaft (34) and includes a perimeter (32) and a plurality of rotor poles (24) extending generally radially about the axis (11). Each rotor pole (24) includes a magnetizable tip (30) and a concave fluid impact surface (26). The stator cores (16) are disposed about the rotor (14) and include first pole face (15) and second pole face (17) facing the perimeter (32) of the rotor (14) and spaced apart therefrom. The coils (18) helically encircle the stator cores (16) and conduct electrical current to magnetize the stator cores (16) to magnetize the tips (30) and to alternately conduct induced electrical current generated in response to changes in magnetic flux between the first and second pole faces (15, 17) and the magnetizable tips (30).

Abstract: The present invention provides a manufacturing process (600) and method (500) for efficiently providing a multi-holographic optical element substrate unit. Upon preparation of an original continuous/non-continuous holographic optical element with uniform diffraction efficiency and marking the original continuous/non-continuous holographic optical element with predetermined alignment marks, the original continuous/non-continuous holographic optical element is cut into a predetermined number of individual holographic optical elements in accordance with the predetermined alignment marks. Then a substrate is prepared with alignment marks in accordance with the predetermined alignment marks of the individual holographic optical elements, and the individual holographic optical elements are attached to a substrate in accordance with the alignment marks.

Abstract: An optical isolator (10) includes an opto-electronic emitter (16) and an opto-electronic detector (17) mounted over offset portions (12, 13) of a leadframe (11). The offset portions (12, 13) form angles (14, 15) with other portions (24, 25) of the leadframe (11). An optically transmissive material (22) encapsulates the opto-electronic emitter (16) and the opto-electronic detector (17), and a reflective material (20) is located above the opto-electronic emitter (16) and the opto-electronic detector (17). An optically insulative packaging material (26) encapsulates the optically transmissive material (22).

Abstract: A portable fuel cell device (10) includes a fuel reservoir (26) and an oxidant chamber (34). Gaseous fuel from the fuel reservoir (26) is mixed with an oxidant from the oxidant chamber (34) by an aspirator (42) to form a fuel-oxidant mixture. The fuel-oxidant mixture is passed through a fuel-oxidant line (44) into a fuel cell (13). The fuel cell (13) contains a reaction chamber (20) that generates electricity by reacting the fuel-oxidant mixture. Waste gaseous products, such as water and carbon dioxide, are sent through an exhaust line (24) to a water trap (46). The water trap (46) contains a water absorbing medium (52) for absorbing the water vapor from the exhaust gas, thereby forming a dry exhaust gas. The dry exhaust gas is released through the exhaust vent (48) into the ambient atmosphere.

Abstract: A microelectronic assembly (10) includes an integrated circuit die (12) that is mounted to a printed circuit board (14). The integrated circuit die (12) overlies the printed circuit board (14) and includes an active face (26) that faces the printed circuit board (14) and is spaced apart therefrom by a gap (30). A plurality of solder bump interconnections (32) extend across the gap (30) and connect a plurality of board bond pads (22) with a plurality of die bond pads (28). A polymeric precursor (13) is dispensed onto the printed circuit board (14) about the integrated circuit die (12) and is curable to form a polymeric encapsulant (16). The polymeric precursor (13) is drawn into the gap (30) and forms a fillet (34) overlying the printed circuit board (14). A frame (18) is embedded in the fillet (34) and the polymeric precursor (13) is heated to cure the polymeric precursor (13) to form a polymeric encapsulant (16).