Patents by Inventor Karl Yee

Karl Yee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070298542
    Abstract: A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum packaging method that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.
    Type: Application
    Filed: September 5, 2007
    Publication date: December 27, 2007
    Applicants: California Institute of Technology, The Boeing Company
    Inventors: Ken Hayworth, Karl Yee, Kirill Shcheglov, Youngsam Bae, Dean Wiberg, A. Challoner, Chris Peay
  • Publication number: 20070119258
    Abstract: The invention provides resonant vibratory sensors to render such resonant vibratory sensors more beneficial than conventional MEMS-based and non-MEMS-based resonant vibratory sensors for various usage applications, such as portable applications requiring navigation-grade performance. The resonant vibratory sensors include as examples an oscillator, a vibratory gyroscope and a vibratory accelerometer. In one embodiment, the resonant vibratory sensor is a disk resonator gyroscope. The improved resonant vibratory sensors employ materials having an ultra low thermal expansion coefficient, which provides an improved thermoelastic quality factor.
    Type: Application
    Filed: November 15, 2006
    Publication date: May 31, 2007
    Applicant: California Institute of Technology
    Inventor: Karl Yee
  • Publication number: 20050274183
    Abstract: The present invention discloses an inertial sensor having an integral resonator. A typical sensor comprises a planar mechanical resonator for sensing motion of the inertial sensor and a case for housing the resonator. The resonator and a wall of the case are defined through an etching process. A typical method of producing the resonator includes etching a baseplate, bonding a wafer to the etched baseplate, through etching the wafer to form a planar mechanical resonator and the wall of the case and bonding an end cap wafer to the wall to complete the case.
    Type: Application
    Filed: August 8, 2005
    Publication date: December 15, 2005
    Applicants: The Boeing Company, California Institute of Technology
    Inventors: Kirill Shcheglov, A. Dorian Challoner, Ken Hayworth, Dean Wiberg, Karl Yee
  • Publication number: 20050017329
    Abstract: A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum package that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.
    Type: Application
    Filed: June 10, 2004
    Publication date: January 27, 2005
    Inventors: Ken Hayworth, Karl Yee, Kirill Shcheglov, Youngsam Bae, Dean Wiberg, A. Challoner, Chris Peay