Abstract: A component for a micromechanical system has an upper side and a lower side disposed opposite the upper side and includes at least one first structural element that is arranged in a first region of the component and bounded by at least one first gap and at least one second structural element that is arranged in a second region of the component different from the first region and bounded by at least one second gap. The first region includes a first cutout in the lower side of the component, wherein a first thickness of the component in the first region is reduced in the second region with respect to a second thickness of the component. A minimal second gap width of the at least one second gap is larger than a minimal first gap width of the at least one first gap.

Abstract: The invention relates to a sensor element for pressure measurement, having a substrate (5) and at least one mass element (1), which is arranged spaced apart from the substrate (5) and is connected in an oscillating manner to the substrate (5) and/or a support body (6) fixed relative to the substrate (5), so that a gap is formed between the mass element (1) and the substrate (5), the width of which can be varied through oscillations of the mass element (1). At least one recess and/or at least one bushing (4) is located in the surface of the substrate (5) delimiting the gap, which recess is used for reducing the damping of the oscillation of the mass element through the gas or plasma surrounding the mass element (1). The sensor element is used in particular in pressure sensors for measuring pressures in the vacuum range. Through the use of the sensor element according to the invention as a pressure sensor, maximum pressures up to the range of atmospheric air pressure can be recorded.

Abstract: The invention relates to a sensor element for pressure measurement, having a substrate (5) and at least one mass element (1), which is arranged spaced apart from the substrate (5) and is connected in an oscillating manner to the substrate (5) and/or a support body (6) fixed relative to the substrate (5), so that a gap is formed between the mass element (1) and the substrate (5), the width of which can be varied through oscillations of the mass element (1). At least one recess and/or at least one bushing (4) is located in the surface of the substrate (5) delimiting the gap, which recess is used for reducing the damping of the oscillation of the mass element through the gas or plasma surrounding the mass element (1). The sensor element is used in particular in pressure sensors for measuring pressures in the vacuum range. Through the use of the sensor element according to the invention as a pressure sensor, maximum pressures up to the range of atmospheric air pressure can be recorded.

Abstract: A method for producing a silicon torsion spring capable, for example, of reading the rotation rate in a microstructured torsion spring/mass system. The system that is produced achieves a low torsional stiffness compared to a relatively high transverse stiffness in the lateral and vertical directions. The method proceeds from a wafer or wafer composite and, upon suitable mask coverage, a spring with a V-shaped cross section is formed by anisotropic wet-chemical etching which preferably extends over the entire wafer thickness and is laterally delimited only by [111] planes. Two of the wafers or wafer composites prepared in this way are rotated through 180° and joined to one another oriented mirrorsymmetrically with respect to one another, so that overall the desired X-shaped cross section is formed.