Patents by Inventor Karlheinz Muth
Karlheinz Muth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11815748Abstract: An optoelectronic device, including: a rib waveguide, the rib waveguide including: a ridge portion, which includes a temperature-sensitive optically active region, and a slab portion, positioned adjacent to the ridge portion; the device further comprising a heater, disposed on top of the slab portion wherein a part of the heater closest to ridge portion is at least 2 ?m away from the ridge portion. The device may also have a heater provided with a bottom cladding layer, and may also include various thermal insulation enhancing cavities.Type: GrantFiled: December 2, 2021Date of Patent: November 14, 2023Assignee: Rockley Photonics LimitedInventors: James Dongyoon Oh, Hooman Abediasl, Gerald Cois Byrd, Karlheinz Muth, Yi Zhang, Aaron John Zilkie
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Patent number: 11573387Abstract: An optical engine. In some embodiments, the optical engine includes an electronic interfacing component including: an upper surface having a plurality of conductors for forming a corresponding plurality of connections to a host board, a lower surface having a plurality of conductors for forming a corresponding plurality of connections to one or more optoelectronic elements, and a plurality of vias extending from the lower surface to the upper surface.Type: GrantFiled: March 31, 2020Date of Patent: February 7, 2023Inventors: Brett Sawyer, Seungjae Lee, Chia-Te Chou, Vivek Raghunathan, Vivek Raghuraman, Karlheinz Muth, David Arlo Nelson
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Publication number: 20220163824Abstract: An optoelectronic device, including: a rib waveguide, the rib waveguide including: a ridge portion, which includes a temperature-sensitive optically active region, and a slab portion, positioned adjacent to the ridge portion; the device further comprising a heater, disposed on top of the slab portion wherein a part of the heater closest to ridge portion is at least 2 ?m away from the ridge portion. The device may also have a heater provided with a bottom cladding layer, and may also include various thermal insulation enhancing cavities.Type: ApplicationFiled: December 2, 2021Publication date: May 26, 2022Inventors: James Dongyoon OH, Hooman ABEDIASL, Gerald Cois BYRD, Karlheinz MUTH, Yi ZHANG, Aaron John ZILKIE
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Patent number: 11333907Abstract: A system including an optical engine. In some embodiments, the system includes an integrated circuit in a first-level package, and the system includes the optical engine, in the first-level package, and the optical engine includes an electro-optical chip.Type: GrantFiled: April 12, 2019Date of Patent: May 17, 2022Assignee: Rockley Photonics LimitedInventors: David Arlo Nelson, Vivek Raghuraman, David Erich Tetzlaff, Karlheinz Muth, Vivek Raghunathan
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Patent number: 11262498Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.Type: GrantFiled: July 31, 2020Date of Patent: March 1, 2022Assignee: Rockley Photonics LimitedInventors: Gerald Cois Byrd, Chia-Te Chou, Karlheinz Muth
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Patent number: 11209678Abstract: An optoelectronic device, including: a rib waveguide, the rib waveguide including: a ridge portion, which includes a temperature-sensitive optically active region, and a slab portion, positioned adjacent to the ridge portion; the device further comprising a heater, disposed on top of the slab portion wherein a part of the heater closest to ridge portion is at least 2 ?m away from the ridge portion. The device may also have a heater provided with a bottom cladding layer, and may also include various thermal insulation enhancing cavities.Type: GrantFiled: February 20, 2019Date of Patent: December 28, 2021Assignee: Rockley Photonics LimitedInventors: Dong Yoon Oh, Hooman Abediasl, Gerald Cois Byrd, Karlheinz Muth, Yi Zhang, Aaron John Zilkie
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Patent number: 11054597Abstract: An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.Type: GrantFiled: April 11, 2019Date of Patent: July 6, 2021Assignee: Rockley Photonics LimitedInventors: Vivek Raghunathan, Vivek Raghuraman, Karlheinz Muth, David Arlo Nelson, Chia-Te Chou, Brett Sawyer, SeungJae Lee
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Patent number: 10921538Abstract: An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.Type: GrantFiled: April 11, 2019Date of Patent: February 16, 2021Assignee: Rockley Photonics LimitedInventors: Vivek Raghunathan, Vivek Raghuraman, Karlheinz Muth, David Arlo Nelson, Chia-Te Chou, Brett Sawyer, SeungJae Lee
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Patent number: 10877217Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.Type: GrantFiled: July 8, 2019Date of Patent: December 29, 2020Assignee: Rockley Photonics LimitedInventors: Gerald Cois Byrd, David Arlo Nelson, Javid Messian, Thomas Pierre Schrans, Chia-Te Chou, Karlheinz Muth
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Patent number: 10872854Abstract: An electro-optical package. In some embodiments, the package includes an electronic integrated circuit module, a first electro-optical component, and a photonic integrated circuit. The first electro-optical component may be in a top surface of the photonic integrated circuit. The electronic integrated circuit module may have a top surface facing toward and overlapping both a portion of the first electro-optical component, and a portion of the photonic integrated circuit.Type: GrantFiled: April 24, 2019Date of Patent: December 22, 2020Assignee: Rockley Photonics LimitedInventors: Vivek Raghunathan, Vivek Raghuraman, Karlheinz Muth
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Publication number: 20200363585Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.Type: ApplicationFiled: July 31, 2020Publication date: November 19, 2020Inventors: Gerald Cois Byrd, Chia-Te Chou, Karlheinz Muth
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Patent number: 10761262Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.Type: GrantFiled: July 31, 2018Date of Patent: September 1, 2020Assignee: ROCKLEY PHOTONICS LIMITEDInventors: Gerald Cois Byrd, Chia-Te Chou, Karlheinz Muth
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Publication number: 20200225430Abstract: An optical engine. In some embodiments, the optical engine includes an electronic interfacing component including: an upper surface having a plurality of conductors for forming a corresponding plurality of connections to a host board, a lower surface having a plurality of conductors for forming a corresponding plurality of connections to one or more optoelectronic elements, and a plurality of vias extending from the lower surface to the upper surface.Type: ApplicationFiled: March 31, 2020Publication date: July 16, 2020Inventors: Brett Sawyer, SEUNGJAE LEE, Chia-Te Chou, Vivek Raghunathan, Vivek Raghuraman, Karlheinz Muth, David Arlo Nelson
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Publication number: 20200073050Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.Type: ApplicationFiled: July 8, 2019Publication date: March 5, 2020Inventors: Gerald Cois Byrd, David Arlo Nelson, Javid Messian, Thomas Pierre Schrans, Chia-Te Chou, Karlheinz Muth
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Publication number: 20190333905Abstract: An electro-optical package. In some embodiments, the package includes an electronic integrated circuit module, a first electro-optical component, and a photonic integrated circuit. The first electro-optical component may be in a top surface of the photonic integrated circuit. The electronic integrated circuit module may have a top surface facing toward and overlapping both a portion of the first electro-optical component, and a portion of the photonic integrated circuit.Type: ApplicationFiled: April 24, 2019Publication date: October 31, 2019Inventors: Vivek Raghunathan, Vivek Raghuraman, Karlheinz Muth
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Publication number: 20190317287Abstract: An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.Type: ApplicationFiled: April 11, 2019Publication date: October 17, 2019Inventors: Vivek Raghunathan, Vivek Raghuraman, Karlheinz Muth, David Arlo Nelson, Chia-Te Chou, Brett Sawyer, SeungJae Lee
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Publication number: 20190258094Abstract: An optoelectronic device, including: a rib waveguide, the rib waveguide including: a ridge portion, which includes a temperature-sensitive optically active region, and a slab portion, positioned adjacent to the ridge portion; the device further comprising a heater, disposed on top of the slab portion wherein a part of the heater closest to ridge portion is at least 2 ?m away from the ridge portion. The device may also have a heater provided with a bottom cladding layer, and may also include various thermal insulation enhancing cavities.Type: ApplicationFiled: February 20, 2019Publication date: August 22, 2019Inventors: Dong Yoon Oh, Hooman Abediasl, Gerald Cois Byrd, Karlheinz Muth, Yi Zhang, Aaron John Zilkie
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Publication number: 20190243164Abstract: A system including an optical engine. In some embodiments, the system includes an integrated circuit in a first-level package, and the system includes the optical engine, in the first-level package, and the optical engine includes an electro-optical chip.Type: ApplicationFiled: April 12, 2019Publication date: August 8, 2019Inventors: David Arlo Nelson, Vivek Raghuraman, David Erich Tetzlaff, Karlheinz Muth, Vivek Raghunathan
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Publication number: 20190041576Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.Type: ApplicationFiled: July 31, 2018Publication date: February 7, 2019Inventors: Gerald Cois Byrd, Chia-Te Chou, Karlheinz Muth
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Patent number: 10062981Abstract: Electronic devices and associated methods are shown including a connector mounted to a printed circuit board (PCB). Examples shown include a number of ground vias passing through the PCB to a second side of the PCB, wherein the number of ground vias is smaller than a number of ground sites. Selected examples include an optoelectronic connector mounted using surface mount technology.Type: GrantFiled: December 18, 2013Date of Patent: August 28, 2018Assignee: Intel CorporationInventors: Karlheinz Muth, Brent Rothermel