Abstract: A flow sensor element is provided having at least one temperature-measuring element and at least one heating element each having at least one platinum thin film resistor, the at least one temperature-measuring element and the at least one heating element each being arranged on a carrier element which is formed from a ceramic foil laminate or a multi-part ceramic component. The carrier elements have electrical conductor paths and junction surfaces for electrically contacting the at least one temperature-measuring element and the at least one heating element. The at least one temperature-measuring element and the at least one heating element each have a metallic carrier foil with an electrically insulating coating, on which the platinum thin film resistors are arranged. The flow sensor element may be used for mass through-flow measurements of gaseous or liquid media in pipe ducts, for example in an exhaust gas pipe of an internal combustion engine.

Abstract: A temperature sensor is provided with a temperature-sensitive element on a surface of a monocrystalline substrate, wherein the temperature-sensitive element is made of a platinum thin-film resistor and is produced as an epitaxial layer. The monocrystalline substrate can be an electrically insulating material, preferably &agr;-Al2O3 or MgO. Alternatively, the substrate may be an electrically conducting material, such as silicon, with an electrically insulating epitaxial layer arranged between the substrate and the platinum thin-film resistor. The platinum thin-film resistor epitaxial layer is preferably deposited by physical vapor deposition (PVD), chemical vapor deposition (CVD), or molecular beam epitaxy (MBE).

Abstract: An apparatus is provided for determining the temperature of a flowing medium in a pipe or tube conduit. The apparatus has a sensor element formed from a ceramic substrate and a thin-film resistor arranged on the substrate and electrically and mechanically connected to at least two electrical leads. The sensor element is arranged in a plastic housing having an opening at least for the pipe or tube and being formed as a molded part. The electrical leads are formed from metal strips, each having first and second ends, with the sensor element arranged at the first end of the metal strips. The plastic housing is molded around the metal strips in a region between their first and second ends, and preferably forms a plug at the second end of the metal strips.

Abstract: A semiconductor component with an integrated circuit has a cooling body as a heat sink and a temperature sensor thermally connected thereto, whose resistance is dependent on temperature. The temperature sensor contains a thin film measuring resistor, which is applied to an electrically insulating surface of a foil-like substrate, and the total thickness of the temperature sensor lies in a range of about 10 &mgr;m to 100 &mgr;m. The thin film measuring resistor is formed as a planar component, with the temperature sensor being arranged between the integrated circuit and the cooling body. The thin film measuring resistor is provided on one side with a thermal coupling layer bordering on the cooling body, while on the other side the resistor has a substrate bordering on a heat distributor, which at least partially surrounds the integrated circuit.

Abstract: A flow sensor element is provided having at least one temperature-measuring element and at least one heating element each having at least one platinum thin film resistor, the at least one temperature-measuring element and the at least one heating element each being arranged on a carrier element which is formed from a ceramic foil laminate or a multi-part ceramic component. The carrier elements have electrical conductor paths and junction surfaces for electrically contacting the at least one temperature-measuring element and the at least one heating element. The at least one temperature-measuring element and the at least one heating element each have a metallic carrier foil with an electrically insulating coating, on which the platinum thin film resistors are arranged. The flow sensor element may be used for mass through-flow measurements of gaseous or liquid media in pipe ducts, for example in an exhaust gas pipe of an internal combustion engine.

Abstract: For detecting the temperature of a fluid, particularly a flowing liquid or gaseous medium, in the hollow space of a housing, a temperature-measuring element is provided that can be connected to an evaluation device via a plug arrangement and is arranged in a protective tube of a sensor housing, which is closed on one side, and with a connection piece firmly affixed thereto. The protective tube projects at least with its tip into an opening of the hollow space that is sealed off from the outside atmosphere using an elastic O-ring. The temperature-measuring element is arranged in the region of the tip of the protective tube on one end of a longitudinally extending circuit board and is connected via strip conductors to the plug arrangement that leads to the outside. The plug arrangement is surrounded by a screw sheath of the sensor housing, which is firmly connected to the protective tube and is provided with a threading that projects into the housing of the hollow space for the purpose of mounting.

Abstract: A semiconductor component with an integrated circuit has a cooling body as a heat sink and a temperature sensor thermally connected thereto, whose resistance is dependent on temperature. The temperature sensor contains a thin film measuring resistor, which is applied to an electrically insulating surface of a foil-like substrate, and the total thickness of the temperature sensor lies in a range of about 10 &mgr;m to 100 &mgr;m. The thin film measuring resistor is formed as a planar component, with the temperature sensor being arranged between the integrated circuit and the cooling body. The thin film measuring resistor is provided on one side with a thermal coupling layer bordering on the cooling body, while on the other side the resistor has a substrate bordering on a heat distributor, which at least partially surrounds the integrated circuit.

Abstract: A temperature sensor is provided with a temperature-sensitive element on a surface of a monocrystalline substrate, wherein the temperature-sensitive element is made of a platinum thin-film resistor and is produced as an epitaxial layer. The monocrystalline substrate can be an electrically insulating material, preferably &agr;-Al2O3 or MgO. Alternatively, the substrate may be an electrically conducting material, such as silicon, with an electrically insulating epitaxial layer arranged between the substrate and the platinum thin-film resistor. The platinum thin-film resistor epitaxial layer is preferably deposited by physical vapor deposition (PVD), chemical vapor deposition (CVD), or molecular beam epitaxy (MBE).

Abstract: A composite wire is provided as a connection wire for electric temperature sensors, the wire having a core made of a nickel-based alloy which self-passivates at the core surface, wherein the core has a jacket made of platinum. A suitable nickel-based alloy which self-passivates at the core surface contains chromium in a range of about 16 to 22-wt %, preferably about 20-wt %.

Abstract: In order to connect contact surfaces of electric component blanks for layer resistors to at least two elongated, metallic connection leads, elongated, slot-shaped openings are made, e.g., by etching, in a continuous metal sheet to manufacture a connection lead blank. The openings border on later connection leads of the connection blank and cross-struts yet to be removed. In a second step, the connection lead blank is brought into a cassette and seized, whereby one of the cross-struts projects out of the cassette and is separated in a third step, such that the free ends of the parallel-running connection leads project out of the cassette. In a fourth step, the cassette is brought into a bonding or welding device, so that the free ends of the connection leads cover the contact surfaces of a component blank or a multi-component blank and are connected together by a bonding or welding operation. In case a multi-component blank (multi-unit plate) is used, it is then separated into individual components.

Abstract: An electrical resistor has a resistance layer containing platinum or a platinum group metal, which is applied to an electrically insulating surface of a substrate, wherein the resistance layer is constructed as a thin layer element and is made of a physical mixture of finely dispersed ceramic and metal. Preferably, the ratio of finely dispersed ceramic to metal lies in a range of about 5 to 50% by weight. Preferably, the finely dispersed ceramic is selected from SiO, Sio2, Ta2O5, MgO, Al2O3, and mixtures thereof. The resistor is used as a reference resistor in a sensor (temperature sensor) together with a temperature-dependent measuring resistor, wherein both resistors are arranged on a common substrate.

Abstract: For detecting the temperature of a fluid, particularly a flowing liquid or gaseous medium, in the hollow space of a housing, a temperature-measuring element is provided that can be connected to an evaluation device via a plug arrangement and is arranged in a protective tube of a sensor housing, which is closed on one side, and with a connection piece firmly affixed thereto. The protective tube projects at least with its tip into an opening of the hollow space that is sealed off from the outside atmosphere using an elastic O-ring. The temperature-measuring element is arranged in the region of the tip of the protective tube on one end of a longitudinally extending circuit board and is connected via strip conductors to the plug arrangement that leads to the outside. The plug arrangement is surrounded by a screw sheath of the sensor housing, which is firmly connected to the protective tube and is provided with a threading that projects into the housing of the hollow space for the purpose of mounting.

Abstract: In order to connect contact surfaces of electric component blanks for layer resistors to at least two elongated, metallic connection leads, elongated, slot-shaped openings are made, e.g., by etching, in a continuous metal sheet to manufacture a connection lead blank. The openings border on later connection leads of the connection blank and cross-struts yet to be removed. In a second step, the connection lead blank is brought into a cassette and seized, whereby one of the cross-struts projects out of the cassette and is separated in a third step, such that the free ends of the parallel-running connection leads project out of the cassette. In a fourth step, the cassette is brought into a bonding or welding device, so that the free ends of the connection leads cover the contact surfaces of a component blank or a multi-component blank and are connected together by a bonding or welding operation. In case a multi-component blank (multi-unit plate) is used, it is then separated into individual components.