Patents by Inventor Karsten Auen
Karsten Auen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240088622Abstract: In one embodiment the semiconductor laser comprises a carrier and an edge-emitting laser diode which is mounted on the carrier and which comprises an active zone for generating a laser radiation and a facet with a radiation exit region. The semiconductor laser further comprises a protective cover, preferably a lens for collimation of the laser radiation. The protective cover is fastened to the facet and to a side surface of the carrier by means of an adhesive. A mean distance between a light entrance side of the protective cover and the facet is at most 60 ?m. The semiconductor laser is configured to be operated in a normal atmosphere without additional gas-tight encapsulation.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Applicant: OSRAM OLED GmbHInventors: Jörg Erich SORG, Harald KÖNIG, Alfred LELL, Florian PESKOLLER, Karsten AUEN, Roland SCHULZ, Herbert BRUNNER, Frank SINGER, Roland HÜTTINGER
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Patent number: 11870214Abstract: In one embodiment the semiconductor laser comprises a carrier and an edge-emitting laser diode which is mounted on the carrier and which comprises an active zone for generating a laser radiation and a facet with a radiation exit region. The semiconductor laser further comprises a protective cover, preferably a lens for collimation of the laser radiation. The protective cover is fastened to the facet and to a side surface of the carrier by means of an adhesive. A mean distance between a light entrance side of the protective cover and the facet is at most 60 ?m. The semiconductor laser is configured to be operated in a normal atmosphere without additional gas-tight encapsulation.Type: GrantFiled: October 21, 2022Date of Patent: January 9, 2024Assignee: OSRAM OLED GMBHInventors: Jörg Erich Sorg, Harald König, Alfred Lell, Florian Peskoller, Karsten Auen, Roland Schulz, Herbert Brunner, Frank Singer, Roland Hüttinger
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Patent number: 11735887Abstract: In one embodiment the semiconductor laser (1) comprises a carrier (2) and an edge-emitting laser diode (3) which is mounted on the carrier (2) and which comprises an active zone (33) for generating a laser radiation (L) and a facet (30) with a radiation exit region (31). The semiconductor laser (1) further comprises a protective cover (4), preferably a lens for collimation of the laser radiation (L). The protective cover (4) is fastened to the facet (30) and to a side surface (20) of the carrier (2) by means of an adhesive (5). A mean distance between a light entrance side (41) of the protective cover (4) and the facet (30) is at most 60 ?m. The semiconductor laser (1) is configured to be operated in a normal atmosphere without additional gas-tight encapsulation.Type: GrantFiled: October 8, 2018Date of Patent: August 22, 2023Assignee: OSRAM OLED GMBHInventors: Jörg Erich Sorg, Harald König, Alfred Lell, Florian Peskoller, Karsten Auen, Roland Schulz, Herbert Brunner, Frank Singer, Roland Hüttinger
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Publication number: 20230068945Abstract: In one embodiment the semiconductor laser comprises a carrier and an edge-emitting laser diode which is mounted on the carrier and which comprises an active zone for generating a laser radiation and a facet with a radiation exit region. The semiconductor laser further comprises a protective cover, preferably a lens for collimation of the laser radiation. The protective cover is fastened to the facet and to a side surface of the carrier by means of an adhesive. A mean distance between a light entrance side of the protective cover and the facet is at most 60 ?m. The semiconductor laser is configured to be operated in a normal atmosphere without additional gas-tight encapsulation.Type: ApplicationFiled: October 21, 2022Publication date: March 2, 2023Applicant: OSRAM OLED GmbHInventors: Jörg Erich SORG, Harald KÖNIG, Alfred LELL, Florian PESKOLLER, Karsten AUEN, Roland SCHULZ, Herbert BRUNNER, Frank SINGER, Roland HÜTTINGER
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Patent number: 10826277Abstract: An optoelectronic component includes a carrier with at least two radiation sources that generate electromagnetic radiation, including a housing consisting of a material non-transmissive to the electromagnetic radiation from the radiation sources, wherein at least two openings are provided in the housing, each opening is closed with a plate, the plate consists of a material transmissive to the electromagnetic radiation from the respective radiation source, and a radiation source is respectively assigned to an opening.Type: GrantFiled: May 27, 2014Date of Patent: November 3, 2020Assignee: OSRAM OLED GmbHInventors: Markus Horn, Karsten Auen
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Publication number: 20200313399Abstract: In one embodiment the semiconductor laser (1) comprises a carrier (2) and an edge-emitting laser diode (3) which is mounted on the carrier (2) and which comprises an active zone (33) for generating a laser radiation (L) and a facet (30) with a radiation exit region (31). The semiconductor laser (1) further comprises a protective cover (4), preferably a lens for collimation of the laser radiation (L). The protective cover (4) is fastened to the facet (30) and to a side surface (20) of the carrier (2) by means of an adhesive (5). A mean distance between a light entrance side (41) of the protective cover (4) and the facet (30) is at most 60 ?m. The semiconductor laser (1) is configured to be operated in a normal atmosphere without additional gas-tight encapsulation.Type: ApplicationFiled: October 8, 2018Publication date: October 1, 2020Inventors: Jörg Erich SORG, Harald KÖNIG, Alfred LELL, Florian PESKOLLER, Karsten AUEN, Roland SCHULZ, Herbert BRUNNER, Frank SINGER, Roland HÜTTINGER
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Patent number: 10672815Abstract: A sensor device is disclosed. In an embodiment, the sensor device includes a carrier having a plane carrier surface, a plurality of photodetectors arranged on the carrier surface, each photodetector including a photosensitive sensor area and a lens arrangement arranged opposite the sensor areas, wherein the lens arrangement includes an optical axis, wherein the lens arrangement is configured to image electromagnetic radiation onto the sensor areas, wherein the plurality of photodetectors comprise at least one first photodetector having a first sensor area, the first sensor area comprises at least one property which differs from a property of a second sensor area of a second photodetector of the plurality of photodetectors, and wherein the second photodetector is arranged closer to the optical axis than the at least one first photodetector in order to reduce an optical imaging aberration of the lens arrangement.Type: GrantFiled: March 17, 2016Date of Patent: June 2, 2020Assignee: OSRAM OLED GMBHInventors: Karsten Auen, Andreas Wojcik, Hubert Halbritter, Tim Böscke
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Patent number: 10651623Abstract: An arrangement includes a conversion element, an optoelectronic semiconductor component and a first carrier including a carrier plane, wherein the conversion element is arranged on the carrier plane, the optoelectronic semiconductor component emits a first electromagnetic radiation including a first beam direction and a first wavelength from a first spectral range during operation, the first electromagnetic radiation is directed onto the conversion element, the conversion element at least partly converts the first electromagnetic radiation into a second electromagnetic radiation including a second wavelength from a second spectral range, the first beam direction of the optoelectronic semiconductor component is oriented at an inclination with respect to the carrier plane, a housing including a housing cap is provided, the housing cap is configured in a hollow-body-like fashion, the housing cap and the carrier define an interior, the conversion element and the semi-conductor component are arranged in the interiType: GrantFiled: October 14, 2016Date of Patent: May 12, 2020Assignee: OSRAM OLED GmbHInventors: Karsten Auen, Markus Horn, Roland Enzmann
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Publication number: 20180309263Abstract: An arrangement includes a conversion element, an optoelectronic semiconductor component and a first carrier including a carrier plane, wherein the conversion element is arranged on the carrier plane, the optoelectronic semiconductor component emits a first electromagnetic radiation including a first beam direction and a first wavelength from a first spectral range during operation, the first electromagnetic radiation is directed onto the conversion element, the conversion element at least partly converts the first electromagnetic radiation into a second electromagnetic radiation including a second wavelength from a second spectral range, the first beam direction of the optoelectronic semiconductor component is oriented at an inclination with respect to the carrier plane, a housing including a housing cap is provided, the housing cap is configured in a hollow-body-like fashion, the housing cap and the carrier define an interior, the conversion element and the semi-conductor component are arranged in the interiType: ApplicationFiled: October 14, 2016Publication date: October 25, 2018Inventors: Karsten Auen, Markus Horn, Roland Enzmann
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Publication number: 20180062346Abstract: A laser component includes a housing, the housing including a base surface and side walls which are perpendicular to the base surface, wherein a first carrier block and a second carrier block are arranged parallel to each other at the base surface, a first laser chip arranged on a longitudinal side of the first carrier block; and a further laser chip arranged on a longitudinal side of the second carrier block, wherein an emission direction of the first laser chip and the further laser chip is oriented perpendicular to the base surface.Type: ApplicationFiled: October 26, 2017Publication date: March 1, 2018Inventors: Markus Horn, Andreas Breidenassel, Karsten Auen, Bernhard Stojetz, Thomas Schwarz
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Publication number: 20180053801Abstract: A sensor device is disclosed. In an embodiment, the sensor device includes a carrier having a plane carrier surface, a plurality of photodetectors arranged on the carrier surface, each photodetector including a photosensitive sensor area and a lens arrangement arranged opposite the sensor areas, wherein the lens arrangement includes an optical axis, wherein the lens arrangement is configured to image electromagnetic radiation onto the sensor areas, wherein the plurality of photodetectors comprise at least one first photodetector having a first sensor area, the first sensor area comprises at least one property which differs from a property of a second sensor area of a second photodetector of the plurality of photodetectors, and wherein the second photodetector is arranged closer to the optical axis than the at least one first photodetector in order to reduce an optical imaging aberration of the lens arrangement.Type: ApplicationFiled: March 17, 2016Publication date: February 22, 2018Inventors: Karsten Auen, Andreas Wojcik, Hubert Halbritter, Tim Böscke
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Patent number: 9831632Abstract: A laser component includes a housing in which a first carrier block is arranged. A first laser chip having an emission direction is arranged on a longitudinal side of the first carrier block. The first laser chip electrically conductively connects to a first contact region arranged on the first carrier block and a second contact region arranged on the first carrier block. There is a respective electrically conductive connection between the first contact region and a first contact pin of the housing and between the second contact region and a second contact pin of the housing.Type: GrantFiled: November 5, 2014Date of Patent: November 28, 2017Assignees: OSRAM Opto Semiconductor GmbH, OSRAM GmbHInventors: Markus Horn, Andreas Breidenassel, Karsten Auen, Bernhard Stojetz, Thomas Schwarz
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Patent number: 9705057Abstract: In a method for producing a laser diode, a number of laser diodes are produced on a wafer. The wafer is broken down into wafer pieces, each wafer piece having a plurality of laser diodes being arranged side by side. One wafer piece is inserted into a first mount that includes a first covering element overlapping a front face of the wafer piece and shadowing a bottom area of the front face of the wafer piece. A minor layer is deposited on an unshadowed upper area of the wafer piece's front face. The wafer piece is inserted into a second mount, which includes a second covering element that shadows the minor layer of the upper area of the front face. An electrically conductive contact layer is deposited on an unshadowed bottom area of the wafer piece's front face. The wafer piece is subsequently broken down into individual laser diodes.Type: GrantFiled: August 27, 2013Date of Patent: July 11, 2017Assignee: OSRAM Opto Semiconductors GmbHInventors: Roland Enzmann, Stephan Haneder, Tomasz Swietlik, Christoph Walter, Andreas Rozynski, Markus Graul, Karsten Auen, Jürgen Dachs
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Patent number: 9599319Abstract: A radiation-emitting device and a method for producing a radiation-emitting device are disclosed. In an embodiment, a radiation-emitting device comprises an optoelectronic semiconductor component and an optical element disposed downstream of the semiconductor component in an emission direction. The optical element is mechanically fixed to the semiconductor component by a clamp.Type: GrantFiled: April 17, 2013Date of Patent: March 21, 2017Assignee: OSRAM Opto Semiconductors GmbHInventor: Karsten Auen
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Patent number: 9537285Abstract: Laser diode apparatus, comprising a carrier (1) having a carrier top (11), a laser diode chip (4) arranged on the carrier top (11) emitting, during operation, electromagnetic radiation through a radiating face (5), which radiating face (5) runs perpendicularly to the carrier top (11), and at least one optical element (6) to deflect at least some of the electromagnetic radiation radiated by the laser diode chip (4) perpendicularly to the carrier top (11). By the use of a plurality of laser diode chips having wavelengths that differ very slightly from one another, speckles can be reduced. By means of a retarder plate (8) between the laser diode chip and the optical element it is possible to influence the polarization. A polarization cube enables the deflected light beam bundles to fully cover one another as differently polarized light beam bundles.Type: GrantFiled: April 25, 2014Date of Patent: January 3, 2017Assignee: OSRAM Opto Semiconductors GmbHInventors: Markus Horn, Andreas Rozynski, Karsten Auen, Stephan Haneder, Thomas Dobbertin
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Patent number: 9356423Abstract: A laser diode assembly includes a housing having a housing part and a mounting part that is connected to the housing part and that extends away from the housing part along an extension direction. A laser diode chip is disposed on the mounting part. The laser diode chip has, on a substrate, semiconductor layers with an active layer for emitting light. The housing part and the mounting part have a main body composed of copper and at least the housing part is steel-sheathed. A first solder layer having a thickness of greater than or equal to 3 ?m is arranged between the laser diode chip and the mounting part.Type: GrantFiled: September 25, 2014Date of Patent: May 31, 2016Assignee: OSRAM Opto Semiconductors GmbHInventors: Uwe Strauss, Soenke Tautz, Alfred Lell, Karsten Auen, Clemens Vierheilig
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Publication number: 20160126704Abstract: An optoelectronic component includes a carrier with at least two radiation sources that generate electromagnetic radiation, including a housing consisting of a material non-transmissive to the electromagnetic radiation from the radiation sources, wherein at least two openings are provided in the housing, each opening is closed with a plate, the plate consists of a material transmissive to the electromagnetic radiation from the respective radiation source, and a radiation source is respectively assigned to an opening.Type: ApplicationFiled: May 27, 2014Publication date: May 5, 2016Inventors: Markus Horn, Karsten Auen
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Publication number: 20160087399Abstract: Laser diode apparatus, comprising a carrier (1) having a carrier top (11), a laser diode chip (4) arranged on the carrier top (11) emitting, during operation, electromagnetic radiation through a radiating face (5), which radiating face (5) runs perpendicularly to the carrier top (11), and at least one optical element (6) to deflect at least some of the electromagnetic radiation radiated by the laser diode chip (4) perpendicularly to the carrier top (11). By the use of a plurality of laser diode chips having wavelengths that differ very slightly from one another, speckles can be reduced. By means of a retarder plate (8) between the laser diode chip and the optical element it is possible to influence the polarisation. A polarisation cube enables the deflected light beam bundles to fully cover one another as differently polarised light beam bundles.Type: ApplicationFiled: April 25, 2014Publication date: March 24, 2016Inventors: Markus HORN, Andreas ROZYNSKI, Karsten AUEN, Stephan HANEDER, Thomas DOBBERTIN
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Publication number: 20150288138Abstract: A laser diode assembly includes a housing having a housing part and a mounting part that is connected to the housing part and that extends away from the housing part along an extension direction. A laser diode chip is disposed on the mounting part. The laser diode chip has, on a substrate, semiconductor layers with an active layer for emitting light. The housing part and the mounting part have a main body composed of copper and at least the housing part is steel-sheathed. A first solder layer having a thickness of greater than or equal to 3 ?m is arranged between the laser diode chip and the mounting part.Type: ApplicationFiled: September 25, 2014Publication date: October 8, 2015Inventors: Uwe Strauss, Soenke Tautz, Alfred Lell, Karsten Auen, Clemens Vierheilig
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Publication number: 20150228871Abstract: In a method for producing a laser diode, a number of laser diodes are produced on a wafer. The wafer is broken down into wafer pieces, each wafer piece having a plurality of laser diodes being arranged side by side. One wafer piece is inserted into a first mount that includes a first covering element overlapping a front face of the wafer piece and shadowing a bottom area of the front face of the wafer piece. A minor layer is deposited on an unshadowed upper area of the wafer piece's front face. The wafer piece is inserted into a second mount, which includes a second covering element that shadows the minor layer of the upper area of the front face. An electrically conductive contact layer is deposited on an unshadowed bottom area of the wafer piece's front face. The wafer piece is subsequently broken down into individual laser diodes.Type: ApplicationFiled: August 27, 2013Publication date: August 13, 2015Applicant: OSRAM Opto Semiconductors GmbHInventors: Roland Enzmann, Stephan Haneder, Tomasz Swietlik, Christoph Walter, Andreas Rozynski, Markus Graul, Karsten Auen, Jürgen Dachs