Abstract: A method of manufacturing an assembly to couple an optical fiber to an opto-electronic component includes providing the optical fiber having an end section with a front face to couple light in and out of the optical fiber, providing a housing to encase the end section of the optical fiber. The housing is formed with an opening to receive the optical fiber. The method further includes inserting the optical fiber in the opening such that the end section of the optical fiber is disposed inside the housing, attaching the optical fiber to a surface of the housing arranged to form a boundary of the opening, and aligning the front face of the optical fiber to the opto-electronic component.

Abstract: A method to manufacture an optoelectronic assembly comprises a step of structuring a first wafer to provide a plurality of optical components to change a beam of light in the optoelectronic assembly with a respective alignment structure being formed to couple the respective optical component to an optical connector. A second wafer is provided with a plurality of optoelectronic components. The first and second wafer are stacked on top of each other, aligned and bonded together. The bonded first and second wafers are separated into a plurality of optoelectronic modules. The optical connector is manufactured by structuring a third wafer so that the third wafer is provided with a plurality of optical connectors. The third wafer is separated into a plurality of the optical connectors. The optical fiber is coupled to one of the optical connectors and then is coupled to one of the separated optoelectronic modules.

Abstract: A method for forming optoelectronic modules connectable to optical fibers is provided which comprises forming a compound substrate comprising a substrate having a two-dimensional array of optoelectronic devices and further comprising a cover layer having a two-dimensional array of fiber end-piece mounting structures. The cover layer is arranged in an aligned position in relation to the substrate, thereby bringing all fiber end-piece mounting structures in alignment to all optoelectronic devices simultaneously. The compound substrate is singulated into pieces, thereby forming a plurality of optoelectronic modules each comprising at least one optoelectronic device covered by an aligned fiber end-piece mounting block connectable to end-pieces of at least one optical fiber in a position automatically self-aligned.

Abstract: A method to manufacture an optoelectronic assembly comprises a step of structuring a first wafer to provide a plurality of optical components to change a beam of light in the optoelectronic assembly with a respective alignment structure being formed to couple the respective optical component to an optical connector. A second wafer is provided with a plurality of optoelectronic components. The first and second wafer are stacked on top of each other, aligned and bonded together. The bonded first and second wafers are separated into a plurality of optoelectronic modules. The optical connector is manufactured by structuring a third wafer so that the third wafer is provided with a plurality of optical connectors. The third wafer is separated into a plurality of the optical connectors. The optical fiber is coupled to one of the optical connectors and then is coupled to one of the separated optoelectronic modules.

Abstract: An optical fiber having an end section with a front face to couple light in and out of the optical fiber is inserted in an opening of a housing to encase the end section of the optical fiber. The optical fiber is attached to a surface of the housing, wherein the surface forms a boundary of the opening. The front face of the optical fiber is aligned to the opto-electronic device such that light coupled out of the front face of the optical fiber is coupled into the opto-electronic device or light coupled out of the opto-electronic device is coupled into the optical fiber at the front face of the optical fiber.

Abstract: A splicer comprises a positioning device, in which the fiber ends in general have a residual offset. A memory stores a predetermined relationship between the possible offset and a parameter which controls the application of heat. The parameter which controls the application of heat, for example the splicing time for a predetermined splicing current, is defined on the basis of an actual offset which can be recorded by means of cameras.

Abstract: A splicer comprises a positioning device, in which the fiber ends in general have a residual offset. A memory stores a predetermined relationship between the possible offset and a parameter which controls the application of heat. The parameter which controls the application of heat, for example the splicing time for a predetermined splicing current, is defined on the basis of an actual offset which can be recorded by means of cameras.

Abstract: A splicer comprises a positioning device, in which the fiber ends in general have a residual offset. A memory stores a predetermined relationship between the possible offset and a parameter which controls the application of heat. The parameter which controls the application of heat, for example the splicing time for a predetermined splicing current, is defined on the basis of an actual offset which can be recorded by means of cameras.

Abstract: After aligning the respective end portions of a first and second optical fiber, the first and second optical fibers are heated by an electric arc during a first time period to melt the respective end portions. The end face of at least one of the first and second optical fibers is positioned away from a center of the electric arc by a distance greater than a quarter of the width of the electric arc. After bringing the respective end portions into contact the respective end portions of the first and second optical fibers are heated during a second time period to form a splice joint.

Abstract: A splicer comprises a positioning device, in which the fiber ends in general have a residual offset. A memory stores a predetermined relationship between the possible offset and a parameter which controls the application of heat. The parameter which controls the application of heat, for example the splicing time for a predetermined splicing current, is defined on the basis of an actual offset which can be recorded by means of cameras.

Abstract: A method for connecting optical fibers comprises determining the position of the core of a fiber. In response to heating, the optical fibers emit light of which an image can be recorded. The position of the core and/or the eccentricity of the fiber is determined from the recorded image. The core position and/or eccentricity can be used to align fibers for a subsequent fusion splicing operation. The process is suitable for, for example, bend optimized optical fibers.

Abstract: A device for splicing optical waveguides comprises a heating unit for heating fiber ends of optical waveguides to be spliced. The optical waveguides are heated by means of the heating unit for a time period, with the heated fiber ends emitting thermal radiation. The thermal radiation is detected in the form of intensity distributions at two different times by a recording unit. Quotients which represent a measure of the splicing temperature which occurs during the splicing process can be determined from the intensity values of the detected intensity distributions. The welding current can be varied as a function of a set value of the quotient, by a comparison with the determined quotient, in order in this way to match the splicing temperature to a desired value.

Abstract: A device for thermally treating at least one optical waveguide has a radiation source. A first optical system is used to direct a beam, emitted by the radiation source, onto the optical waveguide from a first side. The first optical system generates a beam profile whose extent in the transverse direction with respect to a longitudinal axis of the optical waveguide corresponds to at least twice an optical waveguide diameter. The optical waveguide is positioned completely outside a center axis of the beam profile in the transverse direction with respect to the longitudinal axis of the optical waveguide in the focusing area of the beam. A second optical system which is positioned behind the optical waveguide in the direction of a beam path of the beam, reflects and directs a beam, which is transmitted past the side of the optical waveguide, onto the optical waveguide from a second side.

Abstract: In order to provide a laser amplification system comprising several solid-state volumes having a laser-active medium, a pumping radiation source, a pumping radiation reflector which allows a leg of the pumping radiation field entering the solid-state volume to pass through the solid-state volume again as outgoing leg such that the incoming leg and the outgoing leg form a first pumping branch, a first pumping radiation path, in which the pumping radiation field passes through the first pumping branches in a first sequence, with which the individual solid-state volumes are acted upon with pumping power as uniformly as possible, it is suggested that each solid-state volume be penetrated by a second pumping branch, the incoming leg of which and the outgoing leg of which are located in a second plane different to the first plane, that a second pumping radiation path be provided, in which the pumping radiation field passes through the second pumping branches in a second sequence and that in the second sequence the

Abstract: In order to provide a laser amplification system comprising several solid-state volumes having a laser-active medium, a pumping radiation source, a pumping radiation reflector which allows a leg of the pumping radiation field entering the solid-state volume to pass through the solid-state volume again as outgoing leg such that the incoming leg and the outgoing leg form a first pumping branch, a first pumping radiation path, in which the pumping radiation field passes through the first pumping branches in a first sequence, with which the individual solid-state volumes are acted upon with pumping power as uniformly as possible, it is suggested that each solid-state volume be penetrated by a second pumping branch, the incoming leg of which and the outgoing leg of which are located in a second plane different to the first plane, that a second pumping radiation path be provided, in which the pumping radiation field passes through the second pumping branches in a second sequence and that in the second sequence the