Patents by Inventor Karsten Droegemüller
Karsten Droegemüller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11777189Abstract: A header, with improved cooling for electronic components for radio frequency signal transmission, for an electronic component for radio frequency data transfer, includes: a metallic base body including a plurality of electrical feedthroughs; a thermoelectric cooling element having one side bearing on the base body and an opposite side for mounting the electronic component; a radio frequency line to the electronic component being on the side for mounting the electronic component, with a ground conductor that is electrically connected to the metallic base body, the electrical connection to the metallic base body including a telluride element.Type: GrantFiled: April 14, 2022Date of Patent: October 3, 2023Assignee: Schott AGInventors: Karsten Drögemüller, Artit Aowudomsuk
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Publication number: 20230179254Abstract: A conductor track arrangement for high-frequency signals is provided. The arrangement has a carrier and a layered signal conductor arranged on the carrier. The layered signal conductor is delimited by a first end, a second end, an inner edge, and an outer edge. The layered signal conductor changes direction in a deflection area and has a minimum width in the deflection area. At least one of the inner and outer edges has a curvature in the deflection area. The deflection area is between the first and second ends.Type: ApplicationFiled: February 6, 2023Publication date: June 8, 2023Applicant: SCHOTT AGInventors: Andreas KRAUSE, Karsten DROEGEMÜLLER
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Publication number: 20230097003Abstract: A conductor track arrangement for high-frequency signals is provided. The arrangement includes a carrier, a ground conductor, and a pair of signal conductors. The signal conductors are layered and are arranged on the carrier opposite the ground conductor. A distance is between the signal conductors, which have a deflection region, in which a direction of the signal conductors changes. The deflection region has a reduced distance, which is reduced compared to the distance d between the signal conductors outside the deflection region. The distance between the signal conductors in transition regions from straight portions of the signal conductors into the deflection region is reduced here symmetrically with respect to an extension of a centre line between the two signal conductors into their respective straight portions and/or a capacitor is introduced into the signal conductor considered to be the inner signal conductor in respect of the direction change.Type: ApplicationFiled: September 28, 2022Publication date: March 30, 2023Applicant: SCHOTT AGInventors: Karsten Droegemüller, Ong Wai Li, Yin Cheng Wong, Amy Soon, Artit Aowudomsuk
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Publication number: 20220238980Abstract: A header, with improved cooling for electronic components for radio frequency signal transmission, for an electronic component for radio frequency data transfer, includes: a metallic base body including a plurality of electrical feedthroughs; a thermoelectric cooling element having one side bearing on the base body and an opposite side for mounting the electronic component; a radio frequency line to the electronic component being on the side for mounting the electronic component, with a ground conductor that is electrically connected to the metallic base body, the electrical connection to the metallic base body including a telluride element.Type: ApplicationFiled: April 14, 2022Publication date: July 28, 2022Applicant: Schott AGInventors: Karsten Drögemüller, Artit Aowudomsuk
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Publication number: 20220069540Abstract: A header for an electronic component is provided. The header includes a base, a pedestal, and a submount. The base has a feedthrough with a feedthrough pin extending through the base and being electrically insulated from the base. The pedestal is connected to the base. The submount is connected to the pedestal. The pedestal is joined to the base via a pedestal substance-to-substance bond.Type: ApplicationFiled: September 3, 2021Publication date: March 3, 2022Applicant: SCHOTT AGInventors: Ong Wai Li, Jian Dean Tan, Amy Soon Li Ping, Andreas Krause, Artit Aowudomsuk, Karsten Droegemueller
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Publication number: 20220069544Abstract: A header for opto-electronic applications is provided. The header includes a header base with a back face, a front face, and opening that extends from the back face through the base to the front face. The opening accommodates an electrically isolated pin through the opening. A pedestal is arranged at the front face and is below a center of the opening. The pedestal has a mounting face and a free face, which opposes the mounting face. The pedestal further includes an upper surface for mounting and carrying a pedestal submount. The mounting face is fixedly attached to the front face with an electrically conductive material that is at least partially arranged between the front face and the mounting face. An electrically isolating material is arranged in the opening between the base and the pin to electrically isolate the pin from the base.Type: ApplicationFiled: August 30, 2021Publication date: March 3, 2022Applicant: SCHOTT AGInventors: Ong WAI LI, Jian Dean TAN, Amy Soon Li PING, Andreas KRAUSE, Artit AOWUDOMSUK, Karsten DROEGEMUELLER
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Publication number: 20220069543Abstract: A header for electronic components is provided. The header has a base with at least two electrical feedthroughs each having a feedthrough pin extending through the base and being electrically isolated to the base within the feedthrough. The further includes at least one pedestal connected to the base and two submounts. Each submount includes a carrier with a structured conductor plating that has at least two conductor traces with one of the conductor traces of each submount being electrically connected to one of the feedthrough pins. The submounts are equally formed but mounted in different orientations.Type: ApplicationFiled: August 30, 2021Publication date: March 3, 2022Applicant: SCHOTT AGInventors: Ong WAI LI, Jian Dean TAN, Amy Soon Li PING, Andreas KRAUSE, Artit AOWUDOMSUK, Karsten DROEGEMUELLER
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Patent number: 11256048Abstract: A transistor outline package is provided that includes a header with a mounting area for an optoelectronic component. The header has a signal pin disposed in a feedthrough. The feedthrough is filled with an insulating material made of glass and/or glass ceramic. The feedthrough has a recessed area on at least one side that is not completely filled up with the insulating material. The recessed area defines a cavity at least partially around the signal pin and the signal pin has an enlarged portion in the recessed area.Type: GrantFiled: August 27, 2019Date of Patent: February 22, 2022Assignee: SCHOTT AGInventors: Robert Hettler, Artit Aowudomsuk, Kenneth Tan, Karsten Droegemueller
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Patent number: 11128101Abstract: A transistor outline package is provided that includes a header having an upper surface, a lower surface, an inner surface, and a mounting area for an optoelectronic component in the inner surface. The header has a signal pin configured to connect an optoelectronic component. The signal pin is disposed in a feedthrough and protrudes from the lower surface. A printed circuit board attached on the signal pin substantially coaxially thereto. The printed circuit board is mechanically and electrically connected to the header by a metal block arranged adjacent to the feedthrough to provide grounding.Type: GrantFiled: August 27, 2019Date of Patent: September 21, 2021Assignee: SCHOTT AGInventors: Robert Hettler, Artit Aowudomsuk, Kenneth Tan, Karsten Droegemueller
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Publication number: 20210281042Abstract: A header for an electronic component including a base body, a thermoelectric cooler, a carrier and first and second conductor track arrangements. The thermoelectric cooler is thermally attached to the base body. The carrier is coupled to the thermoelectric cooler and is cooled thereby. The first and second conductor track arrangements each have a signal conductor, at least one grounding conductor and an end. The second conductor track arrangement is on the carrier and connected to the electronic component. The first and second conductor track arrangements are separated by a gap that is bridged by bonding wire connections electrically connecting the first and second signal conductors and electrically connecting the two grounding conductors, the ends facing each other across the gap, at least one of the ends having a capacitive structural feature that increases the capacitance of the first and/or the second conductor track arrangement.Type: ApplicationFiled: March 3, 2021Publication date: September 9, 2021Applicant: SCHOTT AGInventors: Andreas Krause, Amy Soon Li Ping, Ong Wai Li, Karsten Droegemüller, Artit Aowudomsuk
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Patent number: 11088096Abstract: A transistor outline housing is provided that includes a header for an optoelectronic component. The header has electrical feedthroughs in the form of connection pins embedded in a potting compound. The header has a recess in which at least one of the connection pins in one of the feedthroughs extends out of the lower surface of the header.Type: GrantFiled: October 9, 2018Date of Patent: August 10, 2021Assignee: SCHOTT AGInventors: Artit Aowudomsuk, Karsten Droegemueller, Rudolf Jungwirth, Michelle YanYan Fang
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Patent number: 10763638Abstract: A transistor outline (TO) housing comprising a base part having a mounting area for a thermoelectric cooler, wherein the base part has at least two feedthroughs for connecting an optoelectronic component. A support extends from the upper surface of the base part, which support has at least two conductor traces arranged thereon, each of which is connected to a respective one of the feedthroughs for connecting the optoelectronic component.Type: GrantFiled: August 31, 2018Date of Patent: September 1, 2020Assignee: SCHOTT AGInventors: Rudolf Jungwirth, Amy Soon Li Ping, Artit Aowudomsuk, Ong Wai Li, Kenneth Tan, Karsten Droegemueller
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Publication number: 20200067265Abstract: A transistor outline package is provided that includes a header having an upper surface, a lower surface, an inner surface, and a mounting area for an optoelectronic component in the inner surface. The header has a signal pin configured to connect an optoelectronic component. The signal pin is disposed in a feedthrough and protrudes from the lower surface. A printed circuit board attached on the signal pin substantially coaxially thereto. The printed circuit board is mechanically and electrically connected to the header by a metal block arranged adjacent to the feedthrough to provide grounding.Type: ApplicationFiled: August 27, 2019Publication date: February 27, 2020Applicant: SCHOTT AGInventors: Robert Hettler, Artit Aowudomsuk, Kenneth Tan, Karsten Droegemueller
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Publication number: 20200064572Abstract: A transistor outline package is provided that includes a header with a mounting area for an optoelectronic component. The header has a signal pin disposed in a feedthrough. The feedthrough is filled with an insulating material made of glass and/or glass ceramic. The feedthrough has a recessed area on at least one side that is not completely filled up with the insulating material. The recessed area defines a cavity at least partially around the signal pin and the signal pin has an enlarged portion in the recessed area.Type: ApplicationFiled: August 27, 2019Publication date: February 27, 2020Applicant: SCHOTT AGInventors: Robert Hettler, Artit Aowudomsuk, Kenneth Tan, Karsten Droegemueller
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Publication number: 20190109102Abstract: A transistor outline housing is provided that includes a header for an optoelectronic component. The header has electrical feedthroughs in the form of connection pins embedded in a potting compound. The header has a recess in which at least one of the connection pins in one of the feedthroughs extends out of the lower surface of the header.Type: ApplicationFiled: October 9, 2018Publication date: April 11, 2019Applicant: SCHOTT AGInventors: Artit Aowudomsuk, Karsten Droegemueller, Rudolf Jungwirth, Michelle YanYan Fang
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Publication number: 20190074658Abstract: A transistor outline (TO) housing comprising a base part having a mounting area for a thermoelectric cooler, wherein the base part has at least two feedthroughs for connecting an optoelectronic component. A support extends from the upper surface of the base part, which support has at least two conductor traces arranged thereon, each of which is connected to a respective one of the feedthroughs for connecting the optoelectronic component.Type: ApplicationFiled: August 31, 2018Publication date: March 7, 2019Applicant: SCHOTT AGInventors: Rudolf Jungwirth, Amy Soon Li Ping, Artit Aowudomsuk, Ong Wai Li, Kenneth Tan, Karsten Droegemueller
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Patent number: 9159634Abstract: A transistor outline housing is provided that has bonding wires on an upper surface. The bonding wires are reduced in length and have connection leads with an excess length at an end opposite the bonding end.Type: GrantFiled: January 17, 2014Date of Patent: October 13, 2015Assignee: SCHOTT AGInventors: Robert Hettler, Kenneth Tan, Georg Mittermeier, Karsten Droegemueller
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Publication number: 20140262469Abstract: A radio frequency feedthrough for optoelectronic housings is provided that includes a multilayer ceramic body and a signal conductor that extends through the ceramic layers in an S-shape. In an upper region of the multilayer ceramic body, a ground layer is recessed in a V-shape, and in a central region of the multilayer ceramic body the signal conductor extends coaxially.Type: ApplicationFiled: March 13, 2014Publication date: September 18, 2014Applicant: Schott AGInventors: Robert Hettler, Thomas Zetterer, Kenneth Tan, Karsten Droegemueller
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Publication number: 20140217570Abstract: A transistor outline housing is provided that has bonding wires on an upper surface. The bonding wires are reduced in length and have connection leads with an excess length at an end opposite the bonding end.Type: ApplicationFiled: January 17, 2014Publication date: August 7, 2014Applicant: SCHOTT AGInventors: Robert Hettler, Kenneth Tan, Georg Mittermeyer, Karsten Droegemueller
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Patent number: 6647183Abstract: To ensure laser safety, also in the case of a largest possible coupled optical power, during the direct optical coupling of a light-emitted component to an optical waveguide, an optical system includes coupling the light through a fiber end configured as a multimode step index optical waveguide having a numeric aperture larger than the half-width value of the angular distribution of the radiation emitted from the radiation source. To distribute the radiation fed into the actual optical waveguide over the largest possible angular range with regard to the luminous power, the coupling of the light beam into the fiber end is effected such that the coupled light beams are inclined in relation to the geometric axis of the optical core of the fiber end at a defined angle.Type: GrantFiled: July 25, 2002Date of Patent: November 11, 2003Assignee: Infineon Technologies AGInventors: Jürgen Blank, Georg Jeiter, Detlef Kuhl, Volker Plickert, Karsten Drögemüller, Jörg-Reinhardt Kropp, Lars Leininger, Herwig Stange