Abstract: A submersible pump assembly (1) includes a submersible pump (2) with a housing (3), and a sensor capsule (4) with a hermetically sealed casing (5). The sensor capsule (4) is releasably mountable at a sensor position (6) located at an outer face (7) of the housing (3) of the submersible pump (2). The submersible pump (2) includes a primary coil (8) within the housing (3). The sensor capsule (4) includes a secondary coil (9) within the casing (5). The primary coil (8) and the secondary coil (9) are arranged to be inductively coupled with each other for wirelessly transferring data and/or power through the housing (3) and the casing (5) when the sensor capsule (4) is mounted at the sensor position (6).

Abstract: A hydraulic system includes at least one hydraulic unit (2) having at least one flow path (14, 16, 18), an hydraulic actuator (22), provided for influencing a hydraulic flow through the flow path (14, 16, 18), at least one sensor device (24, 26), and a control device (10) for controlling the hydraulic actuator (22). The at least one sensor device (24, 26) includes a storage device (32) provided for containing information specifying the hydraulic unit (2). The control device (10) is configured to receive the information stored in the storage device (32) of the sensor device (24, 26) and to set up a control of the hydraulic actuator (22) based on the received information specifying the hydraulic unit (2). A method is provided for controlling the hydraulic actuator.

Abstract: A hydraulic system includes at least one hydraulic unit (2) having at least one flow path (14, 16, 18), an hydraulic actuator (22), provided for influencing a hydraulic flow through the flow path (14, 16, 18), at least one sensor device (24, 26), and a control device (10) for controlling the hydraulic actuator (22). The at least one sensor device (24, 26) includes a storage device (32) provided for containing information specifying the hydraulic unit (2). The control device (10) is configured to receive the information stored in the storage device (32) of the sensor device (24, 26) and to set up a control of the hydraulic actuator (22) based on the received information specifying the hydraulic unit (2). A method is provided for controlling the hydraulic actuator.

Abstract: A submersible pump assembly (1) includes a submersible pump (2) with a housing (3), and a sensor capsule (4) with a hermetically sealed casing (5). The sensor capsule (4) is releasably mountable at a sensor position (6) located at an outer face (7) of the housing (3) of the submersible pump (2). The submersible pump (2) includes a primary coil (8) within the housing (3). The sensor capsule (4) includes a secondary coil (9) within the casing (5). The primary coil (8) and the secondary coil (9) are arranged to be inductively coupled with each other for wirelessly transferring data and/or power through the housing (3) and the casing (5) when the sensor capsule (4) is mounted at the sensor position (6).

Abstract: A submersible pump assembly (1), for arrangement in a shaft (2) or receptacle, includes a pump (3) and an electric motor (8) driving the pump (3) and a cable (5) for the supply of electricity. The cable is configured for being led out of the shaft (2) or receptacle at the upper side and for connection to an electricity source (7) outside the shaft or receptacle. The pump assembly (1) includes an electronics unit (9) which is configured to transmit a signal into the cable (5) and to detect a reflection signal at the surface (4) of the fluid (10) located in the shaft (2) or receptacle. The electronics unit (9) is configured to determine, from this reflection signal, a fluid level (11) in the shaft (2) or receptacle by way of time domain reflectometry.

Abstract: A method produces electronic components in particular electronic sensors for pressure and differential pressure measurement. Firstly, the semiconductor structure of the electronic components is produced on a wafer. An insulating oxide layer is then applied. A protective metal layer is subsequently applied. The metal layer is applied in sections only in those regions of the wafer in which no splitting, for example by mechanical separation, occurs later. The electronic components thus formed in the wafer are then divided up into individual elements.

Abstract: A differential pressure sensor includes a micro-electromechanical sensor die fabricated as a plurality of sensor die sites on a semiconductor wafer, and then singularized, the sensor die having a top face surface including die electrical output pads exposed to a first test fluid source and a bottom side surface exposed to a second test fluid source. The differential pressure further has a sensor die support member having a die support member fluid access port with a support member port perimeter; wherein one of the top face surface or the bottom side surface is sealed fully around the support member port perimeter by a wafer scale seal formed on the plurality of sensor die sites before die singulation. Wafer scale seals may be formed by a photofabrication process, screen printing, stamp printing, or pressure transfer printing. Some embodiments may include a photofabricated seal formed by a photosensitive polydimethylsiloxane material, by a filled photofabricated mold, and by photopatterned glass frit.

Abstract: A method produces electronic components in particular electronic sensors for pressure and differential pressure measurement. Firstly, the semiconductor structure of the electronic components is produced on a wafer. An insulating oxide layer is then applied. A protective metal layer is subsequently applied. The metal layer is applied in sections only in those regions of the wafer in which no splitting, for example by mechanical separation, occurs later. The electronic components thus formed in the wafer are then divided up into individual elements.

Abstract: A differential pressure sensor includes a micro-electromechanical sensor die fabricated as a plurality of sensor die sites on a semiconductor wafer, and then singularized, the sensor die having a top face surface including die electrical output pads exposed to a first test fluid source and a bottom side surface exposed to a second test fluid source. The differential pressure further has a sensor die support member having a die support member fluid access port with a support member port perimeter; wherein one of the top face surface or the bottom side surface is sealed fully around the support member port perimeter by a wafer scale seal formed on the plurality of sensor die sites before die singulation. Wafer scale seals may be formed by a photofabrication process, screen printing, stamp printing, or pressure transfer printing. Some embodiments may include a photofabricated seal formed by a photosensitive polydimethylsiloxane material, by a filled photofabricated mold, and by photopatterned glass frit.

Abstract: The invention relates to a pressure or differential pressure sensor comprising a membrane with at least one measuring element located thereon, as well evaluation electronics for measuring the membrane deflection. The membrane is covered against environmental influences with a protective layer and is gripped within a mounting in a pressure tight manner. The protective layer is composed of a fluid tight amorphous metal layer, a so called metal glass layer which with the interposing of an electrically insulating layer, is directly deposited onto the membrane, the measuring element located thereon and where appropriate, onto further electronic components located thereon. In this manner, on the one hand, the membrane is protected but on the other hand it may be deflected sensitively since the amorphous metal layer is fluid and gas tight even with layer thicknesses in the .mu.m region.

Abstract: The invention relates to an electronic component manufactured in thick film technology, thin film technology or silicon technology and then provided with an electrically insulating layer which is covered by an amorphous metal layer. The amorphous metal layer protects the component, even with the smallest of layer thicknesses, from external influences and directly transmits heating and force effects.