Abstract: A composite piezoelectric material, manufacturing of the composite material and use of this composite material in piezoelectric components are disclosed. More particularly, a piezoelectric thick film materials or piezoelectric paint being a composite piezoelectric material including piezoelectric particles randomly dispersed within a polymer matrix are disclosed. A paste of composite piezoelectric material including a matrix of polymer having a relative permittivity ?3, normally ?6, sintered piezoelectric particles having a relative permittivity in the range of 100-5000, normally in the range of 400-1000 and an average particle size between 1 and 50 ?m, although the particles should be smaller than 1/10 of the final thickness of the final layer of piezoelectric material, and additives such as dispersing agents or thinner are disclosed where the final paste has a 0-3 connectivity pattern, a content of sintered piezoelectric particles between 15 and 75 vol %, normally between 40 and 60 vol %.

Abstract: A composite piezoelectric material, manufacturing of the composite material and use of this composite material in piezoelectric components are disclosed. More particularly, a piezoelectric thick film materials or piezoelectric paint being a composite piezoelectric material including piezoelectric particles randomly dispersed within a polymer matrix are disclosed. A paste of composite piezoelectric material including a matrix of polymer having a relative permittivity?3, normally ?6, sintered piezoelectric particles having a relative permittivity in the range of 100-5000, normally in the range of 400-1000 and an average particle size between 1 and 50 ?m, although the particles should be smaller than 1/10 of the final thickness of the final layer of piezoelectric material, and additives such as dispersing agents or thinner are disclosed where the final paste has a 0-3 connectivity pattern, a content of sintered piezoelectric particles between 15 and 75 vol %, normally between 40 and 60 vol %.

Abstract: An x-ray detector module comprises a plurality of silicon drift detector cells arranged next to each other on a sensor chip. The sensor chip is arranged in a recess of a frame-shaped base support, such that the sensitive chip surface lies in the opening of the frame-shaped base support. A mask (10) is fixed to the side of the base support (2) opposite to the recess and covers the outer edge areas of external detector cells and ridges above the sensor chip (8) protrude into the opening of the base support (2). The ridges are arranged in such a manner that they cover the defining strips which are adjacent to the detector cells, in order to protect the external edge areas and the defining strips which are covered by the mask (10) counter to the incident x-ray photons.

Abstract: The invention relates an x-ray detector module comprising a plurality of silicium-drift detector cells which are arranged next to each other on a sensor chip. Said sensor chip is arranged in a recess of a frame-shaped base support, such that the sensitive chip surface lies in the opening of said frame-shaped base support. The aim of the invention is to improve the signal/base ratio. As a result, a mask (10) is fixed to the side of the base support (2) which is opposite to the recess, said mask covering the outer edge areas of external silicium-drift detector cells of the sensor chip (8) and ridges above the sensor chip (8) protrude into the opening of the base support (2). The ridges are arranged in such a manner that they cover the defining strips which are adjacent to the silicum drift detector cells, in order to protect the external edge areas and the defining strips which are covered by the mask (10) counter to the incident x-ray photons.

Abstract: A detector module for measuring radiation in an X-ray detector system includes a plurality of modules each having a detector array. Each array includes a plurality of detector elements on a first surface facing a radiation source and a conductor track carrier provided with conducter tracks and spaced from another surface of the array. Bores extend through the conductor track carrier for the detector elements and bonding wires interconnect first connections on the detector elements and the conductor tracks. The conductor tracks extend to signal processing electronics to process signals from individual detector elements.