Patents by Inventor Karsten Kellermann

Karsten Kellermann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9576844
    Abstract: A composite wafer is manufactured by providing a carrier wafer including graphite and a protective layer, forming a bonding layer, and bonding the carrier wafer to a semiconductor wafer through the bonding layer.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: February 21, 2017
    Assignee: Infineon Technologies AG
    Inventors: Rudolf Berger, Hermann Gruber, Wolfgang Lehnert, Guenther Ruhl, Raimund Foerg, Anton Mauder, Hans-Joachim Schulze, Karsten Kellermann, Michael Sommer, Christian Rottmair, Roland Rupp
  • Publication number: 20160086844
    Abstract: A composite wafer is manufactured by providing a carrier wafer including graphite and a protective layer, forming a bonding layer, and bonding the carrier wafer to a semiconductor wafer through the bonding layer.
    Type: Application
    Filed: December 8, 2015
    Publication date: March 24, 2016
    Inventors: Rudolf Berger, Hermann Gruber, Wolfgang Lehnert, Guenther Ruhl, Raimund Foerg, Anton Mauder, Hans-Joachim Schulze, Karsten Kellermann, Michael Sommer, Christian Rottmair, Roland Rupp
  • Patent number: 9224633
    Abstract: According to an embodiment, a composite wafer includes a carrier substrate having a graphite layer and a monocrystalline semiconductor layer attached to the carrier substrate.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: December 29, 2015
    Assignee: Infineon Technologies AG
    Inventors: Rudolf Berger, Hermann Gruber, Wolfgang Lehnert, Guenther Ruhl, Raimund Foerg, Anton Mauder, Hans-Joachim Schulze, Karsten Kellermann, Michael Sommer, Christian Rottmair, Roland Rupp
  • Publication number: 20140335676
    Abstract: According to an embodiment, a composite wafer includes a carrier substrate having a graphite layer and a monocrystalline semiconductor layer attached to the carrier substrate.
    Type: Application
    Filed: July 24, 2014
    Publication date: November 13, 2014
    Inventors: Rudolf Berger, Hermann Gruber, Wolfgang Lehnert, Guenther Ruhl, Raimund Foerg, Anton Mauder, Hans-Joachim Schulze, Karsten Kellermann, Michael Sommer, Christian Rottmair, Roland Rupp
  • Patent number: 8822306
    Abstract: According to an embodiment, a composite wafer includes a carrier substrate having a graphite layer and a monocrystalline semiconductor layer attached to the carrier substrate.
    Type: Grant
    Filed: August 9, 2011
    Date of Patent: September 2, 2014
    Assignee: Infineon Technologies AG
    Inventors: Rudolf Berger, Hermann Gruber, Wolfgang Lehnert, Guenther Ruhl, Raimund Foerg, Anton Mauder, Hans-Joachim Schulze, Karsten Kellermann, Michael Sommer, Christian Rottmair, Roland Rupp
  • Publication number: 20120083098
    Abstract: According to an embodiment, a composite wafer includes a carrier substrate having a graphite layer and a monocrystalline semiconductor layer attached to the carrier substrate.
    Type: Application
    Filed: August 9, 2011
    Publication date: April 5, 2012
    Applicant: Infineon Technologies AG
    Inventors: Rudolf Berger, Hermann Gruber, Wolfgang Lehnert, Guenther Ruhl, Raimund Foerg, Anton Mauder, Hans-Joachim Schulze, Karsten Kellermann, Michael Sommer, Christian Rottmair, Roland Rupp
  • Publication number: 20120056199
    Abstract: The invention relates to a self-supporting CVD diamond film comprising a plurality of diamond layers (8) lying one over the other, wherein a lower side of each diamond layer (8) is made of diamond having a first average crystal size of 2 to 50 nm, wherein the average crystal size increases within the diamond layer (8) from the lower side to an upper side of the diamond layer (8), and wherein a second average crystal size in the area of the upper side is 50 to 500 nm.
    Type: Application
    Filed: March 5, 2010
    Publication date: March 8, 2012
    Applicant: Friedrich-Alexander-Universitaet Erlangen-Nuernberg
    Inventors: Stefan Rosiwal, Jan Fandrey, Karsten Kellermann, Matthias Lodes