Abstract: A method for programming a head gimbal assembly. The method includes building a plurality of transducers into a slider, and testing the plurality of transducers to select one of the plurality of transducers for field operation. The method also includes providing an interconnect assembly having a plurality of traces with at least one of the plurality of traces having a plurality of electrically coupled bond pads. One of the plurality of bond pads is bonded electrically to the selected transducer out of the plurality of transducers, and the other bond pads of the plurality of bond pads are not electrically coupled to any of the plurality of transducers.

Abstract: A slider configured for heat-assisted magnetic recording comprises an optical sensor coupled to first and second bond pads. The optical sensor comprises a bolometer and a reference sensor. The bolometer is situated at a location of the slider that receives at least some of the light and exposed to an ambient temperature at the slider. The bolometer produces a signal in response to a change in the ambient temperature and the change in output optical power. The reference sensor is situated at a location of the slider unexposed to the light and exposed to the ambient temperature. The reference sensor is coupled to the bolometer and configured to produce a signal in response to the change in the ambient temperature. The optical sensor is configured to generate a sensor signal indicative of changes in output optical power of a laser source without contribution due to ambient temperature changes.

Abstract: A method for programming a head gimbal assembly. The method includes building a plurality of transducers into a slider, and testing the plurality of transducers to select one of the plurality of transducers for field operation. The method also includes providing an interconnect assembly having a plurality of traces with at least one of the plurality of traces having a plurality of electrically coupled bond pads. One of the plurality of bond pads is bonded electrically to the selected transducer out of the plurality of transducers, and the other bond pads of the plurality of bond pads are not electrically coupled to any of the plurality of transducers.

Abstract: A slider of a heat-assisted magnetic recording head comprises an air bearing surface and an optical waveguide configured to receive light from a laser source. The slider comprises a plurality of electrical bond pads including a first bond pad and a second bond pad. A first resistive sensor is configured to sense for spacing changes and contact between the slider and a magnetic recording medium at or near a first close point of the slider. A second resistive sensor is configured to sense for spacing changes and contact between the slider and the medium at or near a second close point of the slider. A bolometer is situated at a location within the slider that receives at least some of the light communicated along the optical waveguide. The first resistive sensor, the second resistive sensor, and the bolometer are coupled together and between the first and second bond pads.

Abstract: A head slider for use in a disk drive is movably positionable relative to a magnetic recording disk and includes at least one write element for writing data to the magnetic recording disk. The write element includes a writer coil electrically connected between a first bond pad and a second bond pad, where the connection between the first bond pad and the second bond pad includes a center tap located proximate to a voltage null point. The head slider also includes at least one read element for reading data from the magnetic recording disk, the read element electrically connected between the center tap and a third bond pad, where the write element and the read element are configured to be selectively activated based on biased inputs to the first bond pad, the second bond pad, and the third bond pad.

Abstract: A bond pad set includes at least one ground pad and at least one electrical bond pad configured to bias and send/receive signals. The bond pad set is electrically connected to a multiplicity of electrical components. At least one electrical bond pad of the bond pad set is shared between two or more of the electrical components.

Abstract: A slider configured for heat-assisted magnetic recording comprises an optical sensor coupled to first and second bond pads. The optical sensor comprises a bolometer and a reference sensor. The bolometer is situated at a location of the slider that receives at least some of the light and exposed to an ambient temperature at the slider. The bolometer produces a signal in response to a change in the ambient temperature and the change in output optical power. The reference sensor is situated at a location of the slider unexposed to the light and exposed to the ambient temperature. The reference sensor is coupled to the bolometer and configured to produce a signal in response to the change in the ambient temperature. The optical sensor is configured to generate a sensor signal indicative of changes in output optical power of a laser source without contribution due to ambient temperature changes.

Abstract: A slider of a heat-assisted recording head comprises electrical bond pads coupled to bias sources and a ground pad, an air bearing surface, and a waveguide configured to receive light from a laser source. A contact sensor proximate the air bearing surface is coupled between a first bond pad and a second bond pad. A bolometer is coupled to a reference thermal sensor. The bolometer is situated at a slider location that receives at least some of the light communicated along the waveguide. The reference thermal sensor is situated at a slider location unexposed to the light communicated along the waveguide. The bolometer and reference thermal sensor are coupled between the first and second bond pads and in parallel with the contact sensor. A ground connection is coupled to the ground pad and at a connection between the bolometer and the reference thermal sensor.

Abstract: A bond pad set includes at least one ground pad and at least one electrical bond pad configured to bias and send/receive signals. The bond pad set is electrically connected to a multiplicity of electrical components. At least one electrical bond pad of the bond pad set is shared between two or more of the electrical components.

Abstract: A slider of a heat-assisted magnetic recording head comprises an air bearing surface and an optical waveguide configured to receive light from a laser source. The slider comprises a plurality of electrical bond pads including a first bond pad and a second bond pad. A first resistive sensor is configured to sense for spacing changes and contact between the slider and a magnetic recording medium at or near a first close point of the slider. A second resistive sensor is configured to sense for spacing changes and contact between the slider and the medium at or near a second close point of the slider. A bolometer is situated at a location within the slider that receives at least some of the light communicated along the optical waveguide. The first resistive sensor, the second resistive sensor, and the bolometer are coupled together and between the first and second bond pads.

Abstract: A slider for use in a disk drive, the slider including a slider body having a leading surface and an opposite trailing surface, wherein the trailing surface includes portions with extensions or depressions. The extensions or depressions include a slider bond pad.

Abstract: A slider for use in a disk drive, the slider including a slider body having a leading surface and an opposite trailing surface, wherein the trailing surface includes portions with extensions or depressions. The extensions or depressions include a slider bond pad.

Abstract: A bond pad set includes at least one ground pad and at least one electrical bond pad configured to bias and send/receive signals. The bond pad set is electrically connected to a multiplicity of electrical components. At least one electrical bond pad of the bond pad set is shared between two or more of the electrical components.

Abstract: A slider of a heat-assisted recording head comprises electrical bond pads coupled to bias sources and a ground pad, an air bearing surface, and a waveguide configured to receive light from a laser source. A contact sensor proximate the air bearing surface is coupled between a first bond pad and a second bond pad. A bolometer is coupled to a reference thermal sensor. The bolometer is situated at a slider location that receives at least some of the light communicated along the waveguide. The reference thermal sensor is situated at a slider location unexposed to the light communicated along the waveguide. The bolometer and reference thermal sensor are coupled between the first and second bond pads and in parallel with the contact sensor. A ground connection is coupled to the ground pad and at a connection between the bolometer and the reference thermal sensor.

Abstract: A system includes a first preamplifier, a second preamplifier and a flex circuit. The first preamplifier is configured to be connected to a first plurality of recording heads. The second preamplifier is configured to be connected to a second plurality of recording heads. At least one of the first plurality of recording heads and at least one of the second plurality of recording heads are configured to concurrently perform read and or write operations. The flex circuit is a single flex circuit configured to connect the first and second preamplifiers to the plurality of recording heads.

Abstract: A bond pad set includes at least one ground pad and at least one electrical bond pad configured to bias and send/receive signals. The bond pad set is electrically connected to a multiplicity of electrical components. At least one electrical bond pad of the bond pad set is shared between two or more of the electrical components.

Abstract: An assembly includes a slider having an air bearing surface and a slider mounting surface opposite the air bearing surface. The slider mounting surface includes first, second, third, and fourth slider pads. A first slider trace electrically shorts the first slider pad with the third slider pad. A second slider trace electrically shorts the second slider pad with the fourth slider pad. A transducing head is supported by the slider. The transducing head includes a positive terminal electrically connected to the first slider pad and a negative terminal electrically connected to the second slider pad. The first, second, third, and fourth slider pads can be connected to pads on a connection circuit with interleaved traces.

Abstract: A technique is described for reducing overhead in a magnetic medium utilizing interspersed timing synchronization fields. In particular, a reader reads timing synchronization fields interspersed within data fields of the medium to obtain timing measurements. The reader is separated from a writer by a distance greater than a distance of the reader to traverse a select timing synchronization field. As such, the writer may perform a direct current (DC) write to the medium to suspend transitional write operations while the reader is reading the select timing synchronization field, and/or while the writer is over a unipolar field (e.g., a timing synchronization field).

Abstract: An assembly includes a slider having an air bearing surface and a slider mounting surface opposite the air bearing surface. The slider mounting surface includes first, second, third, and fourth slider pads. A first slider trace electrically shorts the first slider pad with the third slider pad. A second slider trace electrically shorts the second slider pad with the fourth slider pad. A transducing head is supported by the slider. The transducing head includes a positive terminal electrically connected to the first slider pad and a negative terminal electrically connected to the second slider pad. The first, second, third, and fourth slider pads can be connected to pads on a connection circuit with interleaved traces.

Abstract: A method and apparatus for measuring latency in a communication path is provided. The technique includes driving a signal such as a square wave on the communication path, such as a write path such that it travels around the write-read path, and sensing a returned signal at one end of the write-read path. A square wave signal corresponding to the square wave driven on the write path is delayed by a predetermined phase thus generating a delayed signal. The returned signal and the delayed signal are mixed, producing a mixed signal. The mixed signal is integrated to obtain an integrated output. The phase by which the delayed signal is shifted is successively adjusted. Returned signals are mixed with such delayed signals until the integrated output is equal to zero. The phase shift amount that results in a nulled integrated output, less a quarter cycle of the square wave, is equal to the round trip latency of the write-read path.