Abstract: The present invention relates to a novel class of polymers which can be used as dielectric material for the preparation of passivation layers in electronic devices. The polymers are prepared from polymerizable compounds having mesogenic groups and they provide excellent film forming capability and excellent mechanical properties and have a low dielectric constant and a low coefficient of thermal expansion (CTE). There is further provided a method for forming said polymers and an electronic device containing said polymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.

Abstract: The present invention relates to novel positive tone photoresist formulations comprising using crosslinkable siloxane polymers. The siloxane polymers used in the positive tone photoresist formulations are crosslinkable and comprise a first repeating unit, which contains at least one maleimide group, and a second repeating unit, which does not contain a maleimide group. The present invention further provides a manufacturing method for a microelectronic structure using a positive tone photoresist formulation according to the present invention and to an electronic device comprising a microelectronic structure, which is obtained or obtainable by said manufacturing method.

Abstract: The present invention relates to a polymerizable mixture which can be used to form a dielectric material for the preparation of passivation layers in electronic devices. The polymerizable mixture comprises a first monomer and a second monomer which may react to form a copolymer providing excellent film forming capability, excellent thermal properties and excellent mechanical properties. There is further provided a method for forming said copolymers and an electronic device containing said copolymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.

Abstract: The present invention relates to novel siloxane oligomer and polymers and crosslinkable compositions, which may be used for the preparation of dielectric materials having excellent barrier, passivation and/or planarization properties. There is also provided a monomer composition from which the siloxane oligomers or polymers may be obtained and a method for preparing said siloxane oligomers or polymers. Beyond that, the present invention relates to a manufacturing method for preparing a microelectronic structure, wherein a crosslinkable composition is applied to a surface of a substrate and then cured, and to an electronic device comprising a microelectronic structure which is obtained by said manufacturing method.

Abstract: The present invention relates to a polymerizable mixture which can be used to form a dielectric material for the preparation of passivation layers in electronic devices. The polymerizable mixture comprises a first monomer and a second monomer which may react to form a copolymer providing excellent film forming capability, excellent thermal properties and excellent mechanical properties. There is further provided a method for forming said copolymers and an electronic device containing said copolymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.

Abstract: The present invention relates to a novel class of polymers which can be used as dielectric material for the preparation of passivation layers in electronic devices. The polymers are prepared from polymerizable compounds having mesogenic groups and they provide excellent film forming capability and excellent mechanical properties and have a low dielectric constant and a low coefficient of thermal expansion (CTE). There is further provided a method for forming said polymers and an electronic device containing said polymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.

Abstract: The invention relates to alkenyl(perfluoroalkyl)phosphinic acids, to the preparation and intermediates thereof, to the use thereof as monomers for the preparation of oligomers and/or polymers, to the corresponding oligomers/polymers, to the corresponding support materials comprising the oligomers/polymers, and to the use thereof as ion exchangers, as catalysts or extraction medium and corresponding salts thereof.

Abstract: The invention relates to alkenyl(perfluoroalkyl)phosphinic acids, to the preparation and intermediates thereof, to the use thereof as monomers for the preparation of oligomers and/or polymers, to the corresponding oligomers/polymers, to the corresponding support materials comprising the oligomers/polymers, and to the use thereof as ion exchangers, as catalysts or extraction medium and corresponding salts thereof.

Abstract: The invention relates to a method for producing tris(perfluoroalkyl)phosphine oxides and bis(perfluoroalkyl)phosphinic acids by reacting tris(perfluoroalkyl)difluorophosphorane or bis(perfluoroalkyl)trifluorophosphorane with non-metal oxides, metalloid oxides or organic compounds with basic oxygen residues.

Abstract: The invention relates to a process for the preparation of alkyl phosphinates, alkenyl phosphinates, alkynyl phosphinates or phenyl phosphinates by reaction of a corresponding phosphine oxide with an alcohol or phenol in the presence of alkali-metal fluoride or tetraalkylammonium fluoride.

Abstract: The invention relates to a method for producing tris(perfluoroalkyl)phosphine oxides and bis(perfluoroalkyl)phosphinic acids by reacting tris(perfluoroalkyl)difluorophosphorane or bis(perfluoroalkyl)trifluorophosphorane with non-metal oxides, metalloid oxides or organic compounds with basic oxygen residues.

Abstract: The invention relates to a process for the preparation of alkyl phosphinates, alkenyl phosphinates, alkynyl phosphinates or phenyl phosphinates by reaction of a corresponding phosphine oxide with an alcohol or phenol in the presence of alkali-metal fluoride or tetraalkylammonium fluoride.

Abstract: The present invention relates to a process for the preparation of compounds containing CF3O groups using compounds containing at least one group Y, in which Y=—Hal, —OSO2(CF2)zF, —OSO2CzH2z+1 (z=1-10), —OSO2F, —OSO2Cl, —OC(O)CF3— or —OSO2Ar, to a process for the preparation of compounds containing CF3O groups using KOCF3 and/or RbOCF3, and to novel compounds containing CF3O groups, and to the use thereof.

Abstract: The present invention relates to a process for the cleavage of dialkoxyalkanes to give corresponding aldehydes or ketones, where the cleavage is carried out in the presence of at least one ionic liquid of the general formula K+A?.

Abstract: The present invention relates to a process for the dehydration of alcohols, polyalcohols or alcoholates having at least one CH group in the ?-position to the alcoholate or alcohol function to give alcenes or ethers, where the dehydration is carried out in ionic liquids of the general formula K+A?.

Abstract: The present invention relates to a process for the cleavage of dialkoxyalkanes to give corresponding aldehydes or ketones, where the cleavage is carried out in the presence of at least one ionic liquid of the general formula K+A?.

Abstract: The invention relates to alkenyl(perfluoroalkyl)phosphinic acids, to the preparation and intermediates thereof, to the use thereof as monomers for the preparation of oligomers and/or polymers, to the corresponding oligomers/polymers, to the corresponding support materials comprising the oligomers/polymers, and to the use thereof as ion exchangers, as catalysts or extraction medium and corresponding salts thereof.