Patents by Inventor Karsten Moh
Karsten Moh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11873849Abstract: A molded body with a structured surface for reversible adhesion to surfaces includes projections having an aspect ratio of up to 10. The structure can be easily detached from the surface by a lateral movement.Type: GrantFiled: December 10, 2018Date of Patent: January 16, 2024Assignee: INNOCISE GmbHInventors: Eduard Arzt, Karsten Moh, Martin Schmitz
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Patent number: 11787982Abstract: A structure with improved adhesion includes projections and a backing layer, the rigidity of the backing layer being variable, and the end faces defining a common surface.Type: GrantFiled: December 18, 2018Date of Patent: October 17, 2023Assignee: INNOCISE GmbHInventors: Eduard Arzt, René Hensel, Karsten Moh, Verena Nicola Tinnemann
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Patent number: 11655396Abstract: An object includes at least two faces which are suitable for dry adhesion and differ in their adhesion parameters. By suitable structuring, it is possible, where appropriate in combination with a suitable contact pressure, to selectively control the detachment of surfaces contacted on these faces.Type: GrantFiled: December 14, 2018Date of Patent: May 23, 2023Assignee: Leibniz-Institut für Neue Materialien gemeinnützige GmbHInventors: Eduard Arzt, René Hensel, Karsten Moh
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Publication number: 20230151247Abstract: A moulded body comprising includes a structured surface, wherein the surface has a structuring including a plurality of protrusions (pillars), at least each having a stem and comprising an end face pointing away from the surface. With this end face, the protrusions come into contact with the surface of the adhered object, wherein at least one protrusion comprises at least one structural feature, which, when loading the protrusion, leads to a directed deformation of the protrusion by changing the adhesion.Type: ApplicationFiled: April 7, 2021Publication date: May 18, 2023Inventors: Karsten Moh, Lena Barnefske, Eduard Arzt, Fabian Rundel
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Patent number: 11145797Abstract: Embodiments relate to forming an elastomeric interface layer (elayer) with a flap over multiple light emitting diode (LED) dies by forming materials across multiple LED dies and removing the materials between the LED dies. The formed flap of the elayer provides a large surface area for adhesion between each LED and a pick-up surface. For example, the flap may have a surface area that is larger than the light emitting surface of the LED die, or larger than the surface area of an elastomeric interface layer without the flap. As such, the elayer allows each LED to be picked up by a pick-up surface and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (?LED) dies.Type: GrantFiled: January 31, 2019Date of Patent: October 12, 2021Assignee: Facebook Technologies, LLCInventors: Oscar Torrents Abad, Tilman Zehender, Pooya Saketi, Karsten Moh
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Publication number: 20210210667Abstract: Embodiments relate to using flux or underfill as a trapping layer for temporarily attaching light emitting diodes (LEDs) to a substrate and heating to simultaneously bond multiple LEDs onto the substrate. The flux or underfill may be selectively coated at the ends of electrodes of the LEDs prior to placing the LEDs on the substrate. Due to adhesive properties of the flux or underfill, multiple LEDs can be placed on and attached to the substrate prior to performing the bonding process. Once LEDs are placed on the substrate, the flux or underfill facilitates formation of metallic contacts between electrodes of the LED and contacts of the substrate during the bonding process. By using the flux or underfill, the formation of metallic contacts can be performed even without applying pressure.Type: ApplicationFiled: February 24, 2021Publication date: July 8, 2021Inventors: Daniel Brodoceanu, Thiago Martins Amaral, Pooya Saketi, Patrick Joseph Hughes, Alexander Udo May, Karsten Moh, Oscar Torrents Abad
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Patent number: 10964867Abstract: Embodiments relate to using flux or underfill as a trapping layer for temporarily attaching light emitting diodes (LEDs) to a substrate and heating to simultaneously bond multiple LEDs onto the substrate. The flux or underfill may be selectively coated at the ends of electrodes of the LEDs prior to placing the LEDs on the substrate. Due to adhesive properties of the flux or underfill, multiple LEDs can be placed on and attached to the substrate prior to performing the bonding process. Once LEDs are placed on the substrate, the flux or underfill facilitates formation of metallic contacts between electrodes of the LED and contacts of the substrate during the bonding process. By using the flux or underfill, the formation of metallic contacts can be performed even without applying pressure.Type: GrantFiled: May 29, 2019Date of Patent: March 30, 2021Assignee: Facebook Technologies, LLCInventors: Daniel Brodoceanu, Thiago Martins Amaral, Pooya Saketi, Patrick Joseph Hughes, Alexander Udo May, Karsten Moh, Oscar Torrents Abad
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Publication number: 20210071045Abstract: An object includes at least two faces which are suitable for dry adhesion and differ in their adhesion parameters. By suitable structuring, it is possible, where appropriate in combination with a suitable contact pressure, to selectively control the detachment of surfaces contacted on these faces.Type: ApplicationFiled: December 14, 2018Publication date: March 11, 2021Inventors: Eduard Arzt, René Hensel, Karsten Moh
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Publication number: 20210071046Abstract: A structure with improved adhesion includes projections and a backing layer, the rigidity of the backing layer being variable, and the end faces defining a common surface.Type: ApplicationFiled: December 18, 2018Publication date: March 11, 2021Applicant: INNOCISE GmbHInventors: Eduard Arzt, René Hensel, Karsten Moh, Verena Nicola Tinnemann
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Patent number: 10941035Abstract: A process for producing a structured surface, in which a composition comprising nanowires is applied to a surface and structured, especially by partial displacement of the composition. When the solvent is removed, the nanowires aggregate to form structures. These may be transparent and also conductive.Type: GrantFiled: September 2, 2016Date of Patent: March 9, 2021Assignee: Leibniz-Institut für Neue Materialien gemeinnützige GmbHInventors: Johannes H. M. Maurer, Tobias Kraus, Lola González-García, Beate Reiser, Ioannis Kanelidis, Peter William de Oliveira, Jenny Kampka, Karsten Moh
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Publication number: 20210062839Abstract: A molded body with a structured surface for reversible adhesion to surfaces includes projections having an aspect ratio of up to 10. The structure can be easily detached from the surface by a lateral movement.Type: ApplicationFiled: December 10, 2018Publication date: March 4, 2021Applicant: INNOCISE GmbHInventors: Eduard Arzt, Karsten Moh, Martin Schmitz
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Patent number: 10910514Abstract: Techniques related to molded etch masks are disclosed. Etch masks can be formed based on pressing a mold against a layer of pliable masking material applied to a surface of an epitaxial layered structure. The epitaxial layered structure includes a first semiconductor layer, a second semiconductor layer, and a light-emitting layer between the first and second semiconductor layers. The epitaxial layered structure is etched using the molded etch masks to form etched structures. The etched structures may be optical structures that modify light emitted through the surface or epitaxial mesas that collimate light within the epitaxial layered structure.Type: GrantFiled: December 21, 2018Date of Patent: February 2, 2021Assignee: FACEBOOK TECHNOLOGIES, LLCInventors: Daniel Brodoceanu, David Massoubre, Karsten Moh
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Patent number: 10822697Abstract: A method for producing metal structures includes an initiator composition comprising a photocatalytic substance being applied to a substrate. A precursor composition that can be reduced to a metal by the photocatalytic activity of the nanodusts is applied to the layer. A structure template is then applied, partially displacing the precursor composition, and then the substrate is illuminated. Structured metal structures are thus generated.Type: GrantFiled: November 23, 2011Date of Patent: November 3, 2020Assignee: Leibniz-Institut Fuer Neue Materialien gemeinnuetzige GmbHInventors: Peter William de Oliveira, Karsten Moh, Eduard Arzt
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Patent number: 10763135Abstract: Embodiments relate to an integrated process for forming an elastomeric layer over an epitaxial structure of multiple light emitting diode (LED) dies, and then etching the elastomeric layer into individual elastomeric interface layers (elayers) on each of the LED dies and etching the epitaxial structure to singulate the LED dies. The elayer allows each LED die to be picked up by a pick-up head (or pick and place head (PPH)), and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (uLED) dies.Type: GrantFiled: January 30, 2018Date of Patent: September 1, 2020Assignee: Facebook Technologies, LLCInventors: Pooya Saketi, Karsten Moh, Tilman Zehender
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Publication number: 20200111939Abstract: Embodiments relate to using flux or underfill as a trapping layer for temporarily attaching light emitting diodes (LEDs) to a substrate and heating to simultaneously bond multiple LEDs onto the substrate. The flux or underfill may be selectively coated at the ends of electrodes of the LEDs prior to placing the LEDs on the substrate. Due to adhesive properties of the flux or underfill, multiple LEDs can be placed on and attached to the substrate prior to performing the bonding process. Once LEDs are placed on the substrate, the flux or underfill facilitates formation of metallic contacts between electrodes of the LED and contacts of the substrate during the bonding process. By using the flux or underfill, the formation of metallic contacts can be performed even without applying pressure.Type: ApplicationFiled: May 29, 2019Publication date: April 9, 2020Inventors: Daniel Brodoceanu, Thiago Martins Amaral, Pooya Saketi, Patrick Joseph Hughes, Alexander Udo May, Karsten Moh, Oscar Torrents Abad
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Patent number: 10586725Abstract: One or more chips are transferred from one substrate to another by using one or more polymer layers to secure the one or more chips to an intermediate carrier substrate. While secured to the intermediate carrier substrate, the one or more chips may be transported or put through further processing or fabrication steps. To release the one or more chips, the adhesion strength of the one or more polymer layers is gradually reduced to minimize potential damage to the one or more chips.Type: GrantFiled: January 10, 2018Date of Patent: March 10, 2020Assignee: Facebook Technologies, LLCInventors: Pooya Saketi, Oscar Torrents Abad, Allan Pourchet, Patrick Joseph Hughes, Karsten Moh, Daniel Brodoceanu
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Patent number: 10559486Abstract: One or more chips are transferred from one substrate to another by using one or more polymer layers to secure the one or more chips to an intermediate carrier substrate. While secured to the intermediate carrier substrate, the one or more chips may be transported or put through further processing or fabrication steps. To release the one or more chips, the adhesion strength of the one or more polymer layers is gradually reduced to minimize potential damage to the one or more chips.Type: GrantFiled: January 10, 2018Date of Patent: February 11, 2020Assignee: Facebook Technologies, LLCInventors: Daniel Brodoceanu, Pooya Saketi, Oscar Torrents Abad, Allan Pourchet, Patrick Joseph Hughes, Karsten Moh
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Patent number: 10388516Abstract: One or more chips are transferred from one substrate to another by using one or more polymer layers to secure the one or more chips to an intermediate carrier substrate. While secured to the intermediate carrier substrate, the one or more chips may be transported or put through further processing or fabrication steps. To release the one or more chips, the adhesion strength of the one or more polymer layers is gradually reduced to minimize potential damage to the one or more chips.Type: GrantFiled: January 10, 2018Date of Patent: August 20, 2019Assignee: Facebook Technologies, LLCInventors: Oscar Torrents Abad, Pooya Saketi, Daniel Brodoceanu, Karsten Moh
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Publication number: 20190237347Abstract: Embodiments relate to an integrated process for forming an elastomeric layer over an epitaxial structure of multiple light emitting diode (LED) dies, and then etching the elastomeric layer into individual elastomeric interface layers (elayers) on each of the LED dies and etching the epitaxial structure to singulate the LED dies. The elayer allows each LED die to be picked up by a pick-up head (or pick and place head (PPH)), and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (uLED) dies.Type: ApplicationFiled: January 30, 2018Publication date: August 1, 2019Inventors: Pooya Saketi, Karsten Moh, Tilman Zehender
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Patent number: 10323324Abstract: A method for producing patterned metallic coatings includes an initiator composition having at least one active substance being added to a substrate. A precursor composition including at least one precursor compound for a metallic layer is applied to the initiator composition coating. A metallic layer is then deposited by the active substance. At least one composition is applied as an emulsion in order to obtain a patterning of the resultant metallic layer.Type: GrantFiled: December 4, 2014Date of Patent: June 18, 2019Assignee: Leibniz-Institut fuer Neue Materialien gemeinnuetzige GmbHInventors: Peter William de Oliveira, Tobias Dörr, Karsten Moh