Abstract: In some embodiments, a substrate carrier for holding a plurality of substrates comprises a disk formed of a continuous material to a nominal dimension which is approximately a multiple of a nominal dimension of a standard substrate size used in the manufacture of light emitting diode devices. In an embodiment, the disk is formed symmetrically about a central axis and defines a substantially planar upper surface. A first pair of pockets is defined in the upper surface of the disk, wherein the disk and each of the first pair of pockets are bisected by a first reference plane passing through the central axis. A second pair of pockets is defined in the upper surface of the disk, wherein the disk and each of the second pair of pockets are bisected by a second reference plane passing through the central axis.

Abstract: An electrostatic carrier is described for carrying a substrate for handling through different processes. The carrier has a dielectric plate having a top side and a bottom side and configured to be attached on a top side of the plate to a substrate using electrostatic force, and a base plate coupled to a bottom side of the dielectric plate. Electrodes are formed on the base plate and extend across the base plate parallel to the top side of the dielectric plate. The electrodes are configured to carry an electrostatic charge and formed so that electrodes of a first charge are positioned near electrodes of a second charge. Connectors extend through the base plate to the electrodes to couple the electrodes to a source of electrostatic charge.

Abstract: Thermal control of substrate carrier is described using a thermal fluid. In one example, a thermally controlled substrate support includes a top surface to support a substrate, the top surface being thermally coupled to substrate, a thermal fluid channel thermally coupled to the top surface to carry a thermal fluid, the thermal fluid to draw heat from and provide heat to the top surface, and a heat exchanger to supply thermal fluid to the thermal fluid channel, the heat exchanger alternately heating and cooling the thermal fluid to adjust the substrate temperature.