Patents by Inventor Karthik Kannappan

Karthik Kannappan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Arrays and methods of manufacture
    Patent number: 11577485
    Abstract: The invention relates to a microarray structure that may include a substrate material layer, a continuous three-dimensional (3D) surface layer on the substrate material layer that is capable of functionalisation for use as an array, and an inert material. The structure may include accurately defined and functionalisable isolated areas which are millimeter to nanometer in size. The functionalisable areas may be part of the continuous 3D surface layer and may be isolated by the inert material but interconnected within the structure by the continuous 3D surface layer.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: February 14, 2023
    Assignee: Digital Sensing Ltd.
    Inventors: Andrew Haynes, David James Bates, Ashton Cyril Partridge, Karthik Kannappan
  • ARRAYS AND METHODS OF MANUFACTURE
    Publication number: 20200198286
    Abstract: The invention relates to a microarray structure that may include a substrate material layer, a continuous three-dimensional (3D) surface layer on the substrate material layer that is capable of functionalisation for use as an array, and an inert material. The structure may include accurately defined and functionalisable isolated areas which are millimeter to nanometer in size. The functionalisable areas may be part of the continuous 3D surface layer and may be isolated by the inert material but interconnected within the structure by the continuous 3D surface layer.
    Type: Application
    Filed: December 20, 2019
    Publication date: June 25, 2020
    Applicant: Digital Sensing Ltd.
    Inventors: Andrew Haynes, David James Bates, Ashton Cyril Partridge, Karthik Kannappan
  • Arrays and methods of manufacture
    Patent number: 10556398
    Abstract: The invention relates to a microarray structure including a substrate material layer, a continuous three-dimensional (3D) surface layer on the substrate material layer that is capable of functionalisation for use as an array, and an inert material wherein the structure includes accurately defined and functionalisable isolated areas which are millimeter to nanometer in size. The functionalised areas are part of the continuous 3D surface layer and are isolated by the inert material and are interconnected within the structure by the continuous 3D surface layer.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: February 11, 2020
    Assignee: Digital Sensing Limited
    Inventors: Andrew Haynes, David James Bates, Ashton Cyril Partridge, Karthik Kannappan
  • ARRAYS AND METHODS OF MANUFACTURE
    Publication number: 20140342128
    Abstract: The invention relates to a microarray structure including a substrate material layer, a continuous three-dimensional (3D) surface layer on the substrate material layer that is capable of functionalisation for use as an array, and an inert material wherein the structure includes accurately defined and functionalisable isolated areas which are millimeter to nanometer in size. The functionalised areas are part of the continuous 3D surface layer and are isolated by the inert material and are interconnected within the structure by the continuous 3D surface layer.
    Type: Application
    Filed: October 12, 2012
    Publication date: November 20, 2014
    Applicant: Digital Sensing Limited
    Inventors: Andrew Haynes, David James Bates, Ashton Cyril Partridge, Karthik Kannappan