Patents by Inventor Karthik Visvanathan

Karthik Visvanathan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit packages with asymmetric adhesion material regions
    Patent number: 11682605
    Abstract: Disclosed herein are integrated circuit (IC) packages with asymmetric adhesion material regions, as well as related methods and devices. For example, in some embodiments, an IC package may include a solder thermal interface material (STIM) between a die of the IC package and a lid of the IC package. The lid of the IC package may include an adhesion material region, in contact with the STIM, that is asymmetric with respect to the die.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: June 20, 2023
    Assignee: Intel Corporation
    Inventors: Karthik Visvanathan, Shenavia S. Howell, Sergio Antonio Chan Arguedas, Peng Li
  • INTEGRATED CIRCUIT PACKAGES WITH ASYMMETRIC ADHESION MATERIAL REGIONS
    Publication number: 20200381334
    Abstract: Disclosed herein are integrated circuit (IC) packages with asymmetric adhesion material regions, as well as related methods and devices. For example, in some embodiments, an IC package may include a solder thermal interface material (STIM) between a die of the IC package and a lid of the IC package. The lid of the IC package may include an adhesion material region, in contact with the STIM, that is asymmetric with respect to the die.
    Type: Application
    Filed: May 28, 2019
    Publication date: December 3, 2020
    Applicant: Intel Corporation
    Inventors: Karthik Visvanathan, Shenavia S. Howell, Sergio Antonio Chan Arguedas, Peng Li
  • Cauterization Device and Method of Cauterizing
    Publication number: 20110184313
    Abstract: A medical device such as a biopsy needle or probe has an integrated piezoelectric transducer. A power source is electrically coupled to the piezoelectric transducer. The power source is configured to generate a signal that causes the piezoelectric transducer to generate heat for cauterizing tissue. A signal analyzer receives a signal from the piezoelectric transducer, or from a sensor integrated into the biopsy needle or probe, to determine the extent of the cauterization.
    Type: Application
    Filed: January 20, 2011
    Publication date: July 28, 2011
    Applicant: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
    Inventors: Yogesh B. Gianchandani, Karthik Visvanathan