Patents by Inventor Karthikeyan Kumarasamy

Karthikeyan Kumarasamy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230232598
    Abstract: A liquid cooled enclosure for transfer heat from a printed circuit board assembly (PCBA) which is disposed inside the liquid cooled enclosure is introduced. The liquid cooled enclosure includes a first cover structure, a cooler structure and a second cover structure. The cooler structure, which is mounted on the first cover structure, includes a hollow tube with a predefined shape pattern. The second cover structure includes an elastic pad that is disposed on a surface of the second cover structure. The PCBA is floatingly mounted on the elastic pad of the second cover structure, and the elastic pad is configured to push the PCBA toward the cooler structure such that heat from the PCBA is dissipated via the cooler structure.
    Type: Application
    Filed: April 21, 2022
    Publication date: July 20, 2023
    Applicant: Lite-On Singapore Pte Ltd
    Inventors: Peng GAO, Neilson NG, Karthikeyan Kumarasamy